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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IDT71P73604S250BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 250MHz | SYNCHRONOUS | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p73604s250bq8-datasheets-3729.pdf | 165 | 165 | Parallel | not_compliant | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 1mm | SRAMs | 1.5/1.81.8V | 0.8mA | Not Qualified | DDR2, RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.325A | 0.45 ns | COMMON | 1.7V | |||||||||||||||||||||||||||||||||||||||
| 70V9169L7PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 45.45MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9169l7pf8-datasheets-3721.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 280mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 18 ns | 28b | 16KX9 | 0.003A | 9b | Synchronous | COMMON | 3V | |||||||||||||||||||
| 7142LA35CB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142la35cb-datasheets-3707.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 16 kb | 3.3mm | 2 | No | 170mA | RAM, SRAM | 35 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 70P269L65BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p269l65bygi8-datasheets-3705.pdf | TFBGA | 100 | 3V | 1.8V | 100 | Parallel | 256 kb | yes | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 100 | INDUSTRIAL | 30 | 32kB | RAM, SDR, SRAM | 65 ns | 28b | 16KX16 | 16 | ||||||||||||||||||||||||||||||||||||
| IDT71V124SA10YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa10yi-datasheets-3698.pdf | 20.955mm | 10.16mm | 32 | 32 | Parallel | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 32 | INDUSTRIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.15mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 10 ns | COMMON | 3.15V | ||||||||||||||||||||||||||||||
| IDT71V124SA10Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa10y-datasheets-3694.pdf | 20.955mm | 3.3V | 32 | 3.6V | 3.15V | 32 | Parallel | 1 Mb | 1 | 1 | 145mA | e0 | DUAL | J BEND | 225 | 3.3V | 32 | COMMERCIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 10 ns | 17b | 8 | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||
| 71256S35TDB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 125°C | -55°C | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256s35tdb-datasheets-3689.pdf | CDIP | 37.72mm | 7.62mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | 3.56mm | 1 | No | 32kB | RAM, SDR, SRAM - Asynchronous | 35 ns | 15b | |||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V67602S150PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s150pfi-datasheets-3662.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 9 Mb | 1 | PIPELINED ARCHITECTURE | 1 | 325mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 3.8 ns | 18b | 256KX36 | 36 | 0.05A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||
| 71T75802S150BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s150bgi-datasheets-3637.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 235mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 3.8 ns | 20b | 0.045A | 18b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||||
| 7143LA20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7143la20pf8-datasheets-3619.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 32 kb | 1.4mm | 2 | No | 280mA | RAM, SRAM | 20 ns | 11b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 7015L20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7015l20j8-datasheets-3618.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 72 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 9kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX9 | 0.005A | 9b | Asynchronous | COMMON | ||||||||||||||||||||||
| IDT6116LA25SO | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 1 (Unlimited) | 70°C | 0°C | CMOS | 2.65mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116la25so-datasheets-3603.pdf | SOIC | 15.4mm | 7.5mm | 24 | Parallel | 1 | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | DUAL | GULL WING | 225 | 5V | 1.27mm | 24 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.11mA | Not Qualified | R-PDSO-G24 | RAM, SRAM - Asynchronous | 3-STATE | 2KX8 | 8 | 16384 bit | 0.00002A | 25 ns | COMMON | 2V | YES | ||||||||||||||||||||||||||
| IDT71P71804S250BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 250MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p71804s250bq8-datasheets-3604.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 1.9V | 1.7V | 20 | SRAMs | 1.5/1.81.8V | 0.65mA | Not Qualified | DDR, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.325A | 0.45 ns | COMMON | 1.7V | ||||||||||||||||||||||||||
| 7132LA55FB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 125°C | -55°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la55fb-datasheets-3597.pdf | 19mm | 19mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 16 kb | 2.2mm | 2 | No | 140mA | RAM, SRAM | 55 ns | 11b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V016SA15YI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa15yi8-datasheets-3594.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 3A991.B.2.B | ALSO OPERATES WITH 3V TO 3.6 V SUPPLY | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | INDUSTRIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.13mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 15 ns | COMMON | 3.15V | ||||||||||||||||||||||||||
| IDT71V65602S150BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s150bg-datasheets-3592.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 3.3V | 0.325mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.04A | 3.8 ns | COMMON | 3V | ||||||||||||||||||||||||||
| 71V416S12BE | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s12be-datasheets-3551.pdf | TFBGA | 9mm | 9mm | 3.3V | Contains Lead | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | no | 1.2mm | 1 | No | 1 | 180mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 48 | COMMERCIAL | 512kB | RAM, SDR, SRAM - Asynchronous | 12 ns | 18b | 16b | Asynchronous | |||||||||||||||||||||||||||||||
| 70V658S12BFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v658s12bfi8-datasheets-3541.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 1.4mm | 2 | No | 1 | 515mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 32b | 64KX36 | 0.015A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 7008L35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l35pf-datasheets-3536.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 255mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | ||||||||||||||||||||
| 70T651S15BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s15bf8-datasheets-3515.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 305mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 18b | 0.01A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 71V3556SA100BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa100bqg8-datasheets-3516.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 3.465V | RAM, SRAM | 17b | 5 ns | |||||||||||||||||||||||||||||||||||
| 70T651S12DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.1mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s12dr-datasheets-3508.pdf | PQFP | 28mm | 28mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 3.5mm | 2 | No | 1 | 355mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 208 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 12 ns | 18b | 0.01A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||
| 71V65903S85PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 85°C | -40°C | 91MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65903s85pfgi8-datasheets-3507.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 8 Weeks | 3.465V | 3.135V | 100 | Parallel | 9 Mb | 1.4mm | 1 | No | 60mA | RAM, SRAM | 8.5 ns | 19b | 18b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||
| IDT71V632S5PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v632s5pf8-datasheets-3506.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 1 | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.63V | 3.135V | 20 | SRAMs | 3.3V | 0.2mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 64KX32 | 32 | 2097152 bit | 0.015A | 5 ns | COMMON | 3.14V | YES | ||||||||||||||||||||||
| IDT71V25761S166PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v25761s166pf-datasheets-3503.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | 1 | PIPELINED ARCHITECTURE | not_compliant | 1 | 320mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 3.5 ns | 17b | 36 | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||
| 71V30L25TFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v30l25tfg8-datasheets-3501.pdf | LQFP | 10mm | 10mm | 3.3V | Lead Free | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 8 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 120mA | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 0.5mm | 64 | COMMERCIAL | 30 | SRAMs | 1kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 10b | 1KX8 | 0.003A | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||
| IDT71V124SA12YI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape and Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa12yi8-datasheets-3497.pdf | 20.955mm | 3.3V | 32 | 3.6V | 3V | 32 | Parallel | 1 Mb | 1 | not_compliant | 1 | 140mA | e0 | DUAL | J BEND | 225 | 3.3V | 32 | INDUSTRIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 12 ns | 17b | 8 | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||
| IDT71V65602S133PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s133pfi8-datasheets-3496.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | QUAD | GULL WING | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | Not Qualified | R-PQFP-G100 | RAM, SRAM | 256KX36 | 36 | 9437184 bit | 4.2 ns | |||||||||||||||||||||||||||||||||||
| IDT71V124SA10TY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.7592mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa10ty-datasheets-3494.pdf | 20.955mm | 7.62mm | 32 | 32 | Parallel | no | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 32 | COMMERCIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.145mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 10 ns | COMMON | 3.15V | |||||||||||||||||||||||||||||
| 71V65903S80PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 95MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65903s80pfg-datasheets-3440.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 8 Weeks | 3.465V | 3.135V | 100 | Parallel | 9 Mb | yes | 1.4mm | 1 | FLOW-THROUGH | No | 1 | 250mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 100 | COMMERCIAL | 30 | 1.1MB | RAM, SDR, SRAM | 8 ns | 19b | 18b | Synchronous |
