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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Access Mode | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 70P264L40BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p264l40bygi-datasheets-2933.pdf | TFBGA | 5mm | 5mm | 1.8V | Lead Free | 81 | 1.9V | 1.7V | 81 | Parallel | 256 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 81 | INDUSTRIAL | 30 | SRAMs | 0.04mA | 32kB | RAM, SDR, SRAM | 3-STATE | 40 ns | 28b | 16KX16 | 0.000006A | COMMON | |||||||||||||||||||||||||||
| IDT7164S20YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164s20yi-datasheets-2934.pdf | 28 | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V07L25PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v07l25pfi-datasheets-2930.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 80 | 7 Weeks | 3.6V | 3V | 80 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | 1 | 140mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 80 | INDUSTRIAL | 20 | SRAMs | Not Qualified | 32kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 30b | 0.003A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||
| 70T651S12DRI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s12dri-datasheets-2920.pdf | PQFP | 28mm | 28mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 3.5mm | 2 | No | 1 | 395mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 208 | INDUSTRIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 12 ns | 18b | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||
| IDT71P73804S167BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 167MHz | SYNCHRONOUS | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p73804s167bq8-datasheets-2915.pdf | 165 | 165 | Parallel | not_compliant | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 1mm | SRAMs | 1.5/1.81.8V | 0.475mA | Not Qualified | DDR2, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.275A | 0.5 ns | COMMON | 1.7V | ||||||||||||||||||||||||||||||||||||||||
| IDT7164S20Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.556mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164s20y-datasheets-2888.pdf | 5V | 28 | 5.5V | 4.5V | 28 | Parallel | 64 kb | 1 | EAR99 | not_compliant | 1 | 100mA | e0 | DUAL | J BEND | 225 | 5V | 28 | COMMERCIAL | 20 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 20 ns | 13b | 8KX8 | 8 | 8b | Asynchronous | COMMON | YES | |||||||||||||||||||||||||||||||
| 71T75902S75BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75902s75bgg8-datasheets-2868.pdf | BGA | 14mm | 22mm | 2.5V | Lead Free | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | yes | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 275mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 7.5 ns | 20b | 0.04A | 18b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||
| 71V25761S183PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | -40°C | CMOS | 183MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v25761s183pfg8-datasheets-2860.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 340mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 512kB | RAM, SDR, SRAM | 183MHz | 3.3 ns | 17b | 36b | Synchronous | ||||||||||||||||||||||||||||
| W971GG8SB-25 | Winbond Electronics Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | 0°C | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | TFBGA | 12.5mm | 8mm | 60 | Parallel | 1 | EAR99 | AUTO/SELF REFRESH | 1 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | OTHER | 1.9V | 1.7V | NOT SPECIFIED | R-PBGA-B60 | DDR2 SDRAM, RAM | 128MX8 | 8 | 1073741824 bit | 0.4 ns | MULTI BANK PAGE BURST | |||||||||||||||||||||||||||||||||||||||||
| 71421LA20J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71421la20j-datasheets-2846.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
| IDT71V124SA10TYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.7592mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa10tygi8-datasheets-2834.pdf | 20.955mm | 7.62mm | 32 | 32 | Parallel | 3A991.B.2.B | unknown | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 3.3V | 1.27mm | 32 | INDUSTRIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.15mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 10 ns | COMMON | 3.15V | ||||||||||||||||||||||||||||||
| 71V67803S150BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | RoHS Compliant | 2009 | /files/integrateddevicetechnology-71v67803s150bq8-datasheets-2832.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 305mA | e0 | TIN LEAD | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 3.8 ns | 19b | 0.05A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70P259L90BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p259l90bygi8-datasheets-2830.pdf | TFBGA | 100 | 3V | 1.8V | 100 | Parallel | 128 kb | yes | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 100 | INDUSTRIAL | 30 | 16kB | RAM, SDR, SRAM | 90 ns | 26b | 8KX16 | 16 | |||||||||||||||||||||||||||||||||||||
| IDT71P73604S167BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 167MHz | SYNCHRONOUS | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p73604s167bq8-datasheets-2831.pdf | 165 | 165 | Parallel | not_compliant | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 1mm | SRAMs | 1.5/1.81.8V | 0.6mA | Not Qualified | DDR2, RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.275A | 0.5 ns | COMMON | 1.7V | ||||||||||||||||||||||||||||||||||||||||
| 70V08S35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v08s35pf8-datasheets-2826.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | SEMAPHORE | No | 1 | 195mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 16b | 64KX8 | 0.006A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||
| IDT71V65602S100BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 100MHz | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s100bq8-datasheets-2825.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70T633S10BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t633s10bfi-datasheets-2808.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 445mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | INDUSTRIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 10 ns | 38b | 18b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 7005S55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005s55pf8-datasheets-2794.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 26b | 8KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||
| 7133LA70J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133la70j8-datasheets-2790.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 70 ns | 22b | 0.0015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 70T3599S133BFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3599s133bfgi-datasheets-2758.pdf | 15mm | 15mm | 2.5V | Lead Free | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4.5 Mb | 1.4mm | 2 | No | 450mA | RAM, SRAM | 15 ns | 34b | 36b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| 70P259L90BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p259l90bygi-datasheets-2744.pdf | TFBGA | 6mm | 6mm | Lead Free | 100 | 3V | 1.8V | 100 | Parallel | 128 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.6V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.06mA | 16kB | RAM, SDR, SRAM | 3-STATE | 90 ns | 26b | 8KX16 | 0.006A | COMMON | |||||||||||||||||||||||||||
| IDT71V65602S100BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s100bq-datasheets-2734.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.25mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.04A | 5 ns | COMMON | 3V | |||||||||||||||||||||||||||
| 71V35761SA200BGGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa200bggi8-datasheets-2735.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 119 | RAM, SRAM | 3.1 ns | 17b | 36b | Synchronous | ||||||||||||||||||||||||||||||||||||||||
| IDT71P72804S167BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 167MHz | SYNCHRONOUS | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72804s167bq8-datasheets-2720.pdf | 165 | 165 | Parallel | not_compliant | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 1mm | SRAMs | 1.5/1.81.8V | 0.65mA | Not Qualified | QDR, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.3A | 0.5 ns | SEPARATE | 1.7V | ||||||||||||||||||||||||||||||||||||||||
| IDT7164S20TP | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Through Hole | Rail/Tube | 70°C | 0°C | CMOS | 4.572mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164s20tp-datasheets-2710.pdf | PDIP | 5V | 28 | 5.5V | 4.5V | 28 | Parallel | 64 kb | 1 | EAR99 | 1 | 100mA | e0 | DUAL | 225 | 5V | 2.54mm | 28 | COMMERCIAL | 30 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 20 ns | 13b | 8KX8 | 8 | 8b | Asynchronous | COMMON | YES | |||||||||||||||||||||||||||||||
| 7130SA25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa25j-datasheets-2693.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 20b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||
| 70P259L65BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p259l65bygi8-datasheets-2634.pdf | TFBGA | 100 | 3V | 1.8V | 100 | Parallel | 128 kb | yes | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 100 | INDUSTRIAL | 30 | 16kB | RAM, SDR, SRAM | 65 ns | 26b | 8KX16 | 16 | |||||||||||||||||||||||||||||||||||||
| 70V35L15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v35l15pf-datasheets-2621.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 185mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 18kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 26b | 8KX18 | 18b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||
| 71V35761SA200BGGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa200bggi-datasheets-2619.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | INDUSTRIAL | 512kB | RAM, SDR, SRAM | 200MHz | 3.1 ns | 17b | 36b | Synchronous | |||||||||||||||||||||||||||||||
| IDT71V65602S100BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s100bg8-datasheets-2617.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 3.3V | 0.25mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.04A | 5 ns | COMMON | 3V |
