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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Data Bus Width | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 70P265L65BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p265l65bygi-datasheets-3424.pdf | TFBGA | 6mm | 6mm | Lead Free | 100 | 3V | 1.8V | 100 | Parallel | 256 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.07mA | 32kB | RAM, SDR, SRAM | 3-STATE | 65 ns | 28b | 16KX16 | 0.000008A | COMMON | |||||||||||||||||||||||||||||||||||
| 71V432S5PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | /files/integrateddevicetechnology-71v432s5pfgi8-datasheets-3417.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 1 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.2mA | 128kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 5 ns | 15b | 32KX32 | COMMON | |||||||||||||||||||||||||||||||||||
| IDT71V124SA12TYI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.7592mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa12tyi8-datasheets-3399.pdf | 20.955mm | 7.62mm | 32 | 32 | Parallel | no | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 32 | INDUSTRIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.14mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 3V | |||||||||||||||||||||||||||||||||||||
| IDT71V65602S133PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s133pfi-datasheets-3396.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.32mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.06A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||
| IDT71V65602S133BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 133MHz | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s133bq8-datasheets-3328.pdf | BGA | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70P264L55BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p264l55bygi8-datasheets-3316.pdf | TFBGA | 1.8V | 81 | 1.9V | 1.7V | 81 | Parallel | 256 kb | yes | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 81 | INDUSTRIAL | 30 | SRAMs | 32kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 28b | 16KX16 | 16 | 0.000006A | COMMON | |||||||||||||||||||||||||||||||||||||||
| 70V9079S12PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 33.3MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9079s12pf-datasheets-3311.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 100 | COMMERCIAL | 32kB | RAM, SDR, SRAM | 12 ns | 30b | 8b | Synchronous | ||||||||||||||||||||||||||||||||||||
| 70V26S55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v26s55j-datasheets-3231.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 84 | Parallel | 256 kb | no | 3.63mm | 2 | EAR99 | No | 140mA | 84 | 32kB | RAM, SDR, SRAM | 55 ns | 28b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 70P264L55BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p264l55bygi-datasheets-3223.pdf | TFBGA | 5mm | 5mm | 1.8V | Lead Free | 81 | 1.9V | 1.7V | 81 | Parallel | 256 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 81 | INDUSTRIAL | 30 | SRAMs | 32kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 28b | 16KX16 | 0.000006A | COMMON | ||||||||||||||||||||||||||||||||||||
| 7130LA25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 1997 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la25j-datasheets-3210.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | 3.63mm | 2 | No | 170mA | 1kB | RAM, SDR, SRAM | 25 ns | 20b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V65602S133BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s133bg8-datasheets-3204.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 3.3V | 0.3mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.04A | 4.2 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||
| 71V416L12YG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416l12yg-datasheets-3165.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 2.9mm | 1 | 1 | 170mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 44 | INDUSTRIAL | NOT SPECIFIED | SRAMs | Not Qualified | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 18b | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||||||||
| 70V7599S166BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7599s166bc-datasheets-3164.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 790mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 17b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| 71V65703S80BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65703s80bqi8-datasheets-3154.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 3.3V | 165 | INDUSTRIAL | 3.465V | RAM, SRAM | 18b | 256KX36 | 8 ns | |||||||||||||||||||||||||||||||||||||||||||
| 70125L35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70125l35j8-datasheets-3144.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 18 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2.3kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.015A | COMMON | 2V | |||||||||||||||||||||||||||||||||
| IDT71V3556S133BQGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s133bqgi8-datasheets-3135.pdf | 165 | 165 | Parallel | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 3.3V | 1mm | INDUSTRIAL | SRAMs | 3.3V | 0.31mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.045A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||
| 70121S35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70121s35j8-datasheets-3120.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 18 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2.3kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.015A | COMMON | 2V | ||||||||||||||||||||||||||||||||||
| 7024L15PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024l15pfg-datasheets-3096.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 64 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 260mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 0.5mm | 100 | COMMERCIAL | 30 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 24b | 4KX16 | 0.0015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||
| 70P264L40BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p264l40bygi8-datasheets-3035.pdf | TFBGA | 1.8V | 81 | 1.9V | 1.7V | 81 | Parallel | 256 kb | yes | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 81 | INDUSTRIAL | 30 | SRAMs | 0.04mA | 32kB | RAM, SDR, SRAM | 3-STATE | 40 ns | 28b | 16KX16 | 16 | 0.000006A | COMMON | ||||||||||||||||||||||||||||||||||||||
| IDT71V632S8PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | Non-RoHS Compliant | LQFP | 100 | Parallel | not_compliant | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 3.3V | 0.635mm | COMMERCIAL | SRAMs | 3.3V | 0.24mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 60MHz | 64KX32 | 32 | 2097152 bit | 0.009A | 8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V65903S85PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 91MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65903s85pf-datasheets-3018.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 9 Mb | 1 | FLOW-THROUGH ARCHITECTURE | not_compliant | 1 | 225mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 8.5 ns | 19b | 18 | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||||||||
| 7130SA20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa20j8-datasheets-3013.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 20b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| IDT71V65602S100PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | 100MHz | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s100pfgi8-datasheets-3014.pdf | LQFP | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W971GG8SB25I | Winbond Electronics Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 95°C | -40°C | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | TFBGA | 12.5mm | 1.8V | Lead Free | 60 | 60 | Parallel | 1 Gb | 1 | EAR99 | AUTO/SELF REFRESH | 1 | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | 1.9V | 1.7V | NOT SPECIFIED | DDR2 SDRAM, RAM | 8b | 400 ps | 14b | 128MX8 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
| MX29LV800CBTI-55Q | Macronix | $7.00 |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1.2mm | RoHS Compliant | TFSOP | 8mm | 6mm | 48 | Parallel | yes | 3A991.B.1.A | unknown | 8542.32.00.51 | 1 | e3 | Tin (Sn) | YES | BOTTOM | BALL | 260 | 3V | 0.8mm | 48 | INDUSTRIAL | 3.6V | 2.7V | 40 | Flash Memories | 3.3V | 0.03mA | Not Qualified | R-PBGA-B48 | FLASH, NOR | 3V | 8MX16 | 16 | 134217728 bit | 8 | 0.000005A | 55 ns | YES | YES | 12115 | 16K8K32K64K | YES | BOTTOM | |||||||||||||||||||||||||||||||
| 70T633S10BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t633s10bc8-datasheets-2976.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 405mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 38b | 0.01A | 18b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||
| IDT71V65602S100PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 4 (72 Hours) | 85°C | -40°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65602s100pfgi-datasheets-2953.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | unknown | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | QUAD | GULL WING | 225 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 30 | Not Qualified | R-PQFP-G100 | RAM, SRAM | 256KX36 | 36 | 9437184 bit | 5 ns | |||||||||||||||||||||||||||||||||||||||||
| IDT71V424YS15PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424ys15phi-datasheets-2945.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7054L25PRF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7054l25prf-datasheets-2935.pdf | TQFP | 20mm | 14mm | 5V | Contains Lead | 128 | 7 Weeks | 5.5V | 4.5V | 128 | Parallel | 32 kb | no | 1.4mm | 4 | EAR99 | AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | No | 1 | 250mA | e0 | Tin/Lead (Sn/Pb) | QUAD | FLAT | 225 | 5V | 0.5mm | 128 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 12b | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||
| IDT71V124SA10YI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa10yi8-datasheets-2931.pdf | 20.955mm | 10.16mm | 32 | 32 | Parallel | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 32 | INDUSTRIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.15mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 10 ns | COMMON | 3.15V |
