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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Page Size | I/O Type | Standby Voltage-Min | Output Enable |
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| 71V321L25TF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321l25tf8-datasheets-1331.pdf | TQFP | 10mm | 10mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | BATTERY BACKUP;AUTOMATIC POWER DOWN | No | 1 | 100mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
| 71V632S5PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v632s5pfgi-datasheets-1324.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 7 Weeks | 3.63V | 3.135V | 100 | Parallel | 2 Mb | yes | 1.4mm | 1 | ALSO REQUIRES 3.3V I/O SUPPLY | No | 1 | 200mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 256kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 5 ns | 16b | 64KX32 | 32b | Synchronous | COMMON | |||||||||||||||||||||||||
| 6116LA150DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 125°C | -55°C | CMOS | 4.826mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116la150db-datasheets-1315.pdf | CDIP | 32mm | 15.24mm | 5V | Contains Lead | 24 | 10 Weeks | 5.5V | 4.5V | 24 | Parallel | 16 kb | no | 2.9mm | 1 | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 24 | MILITARY | SRAMs | 5V | 0.085mA | MIL-STD-883 Class B | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 150 ns | 11b | 2KX8 | 0.0003A | COMMON | 2V | ||||||||||||||||||||||||||
| 7164S70TDB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s70tdb-datasheets-1314.pdf | CDIP | 37.72mm | 7.62mm | 5V | Contains Lead | 28 | 10 Weeks | 28 | Parallel | 64 kb | no | 3.56mm | 1 | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 28 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | RAM, SRAM - Asynchronous | 3-STATE | 13b | 8KX8 | 0.02A | 70 ns | COMMON | |||||||||||||||||||||||||||||||
| 71V416S15BEI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s15bei8-datasheets-1284.pdf | TFBGA | 9mm | 9mm | 3.3V | Contains Lead | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | no | 1.2mm | 1 | No | 1 | 170mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.75mm | 48 | INDUSTRIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 0.02A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||
| 70V9089S9PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 40MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9089s9pf-datasheets-1265.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 260mA | RAM, SRAM | 20 ns | 32b | 8b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 70P245L65BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p245l65bygi8-datasheets-1260.pdf | TFBGA | 100 | 3V | 1.8V | 100 | Parallel | 64 kb | yes | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.07mA | 8kB | RAM, SDR, SRAM | 3-STATE | 65 ns | 24b | 4KX16 | 16 | 0.000008A | COMMON | |||||||||||||||||||||||||||||||||
| 71V35761S200BGGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761s200bggi8-datasheets-1261.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 119 | RAM, SRAM | 3.1 ns | 17b | 36b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||
| 71V3556S133PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556s133pfgi8-datasheets-1252.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | No | 1 | 310mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 17b | 0.045A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 71V416L12BEI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416l12bei8-datasheets-1253.pdf | TFBGA | 9mm | 9mm | 3.3V | Contains Lead | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | no | 1.2mm | 1 | No | 1 | 170mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.75mm | 48 | INDUSTRIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 18b | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||
| 70V9199L9PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 40MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9199l9pfi-datasheets-1234.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1.1 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 9 ns | 34b | 9b | Synchronous | COMMON | 3V | |||||||||||||||||||||||||
| 71V016SA15BFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa15bfg-datasheets-1177.pdf | 7mm | 7mm | 3.3V | Lead Free | 12 Weeks | 3.6V | 3V | 48 | Parallel | 1 Mb | 1.4mm | 1 | No | 130mA | 128kB | RAM, SDR, SRAM - Asynchronous | 15 ns | 16b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V547XS100PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v547xs100pf8-datasheets-1164.pdf | LQFP | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70P245L65BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | TFBGA | 6mm | 6mm | Lead Free | 100 | 3V | 1.8V | 100 | Parallel | 64 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.07mA | 8kB | RAM, SDR, SRAM | 3-STATE | 65 ns | 24b | 4KX16 | 0.000008A | COMMON | ||||||||||||||||||||||||||||||
| IDT71V416S12PH8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s12ph8-datasheets-1159.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | no | 1 | 3A991.B.2.A | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | COMMERCIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V | YES | ||||||||||||||||||||||||||||
| 71V35761S200BGGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761s200bggi-datasheets-1140.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | No | 119 | 512kB | RAM, SDR, SRAM | 200MHz | 3.1 ns | 17b | ||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V547XS100PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v547xs100pf-datasheets-1059.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | Not Qualified | R-PQFP-G100 | RAM, SRAM | 128KX36 | 36 | 4718592 bit | ||||||||||||||||||||||||||||||||||||||
| 70V24S15J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24s15j8-datasheets-1062.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 84 | 7 Weeks | 3.6V | 3V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 3.3V | 84 | COMMERCIAL | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 24b | 4KX16 | 0.005A | COMMON | 3V | |||||||||||||||||||||||||||||
| 70P244L55BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 85°C | -40°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p244l55bygi8-datasheets-1054.pdf | TFBGA | 1.8V | 1.9V | 1.7V | 81 | Parallel | 64 kb | 2 | No | 8kB | RAM, SDR, SRAM | 55 ns | 24b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V35761S200BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761s200bgg8-datasheets-1056.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 360mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.1 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||
| TC58NVG1S3ETA00 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/toshiba-tc58nvg1s3eta00-datasheets-0987.pdf | TFSOP | 3.3V | 12 Weeks | 3.6V | 2.7V | 48 | Serial | 2 Gb | No | 30mA | EEPROM, NAND, SLC NAND | 30 μs | 1b | 8b | Asynchronous | 2kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5962-8855204XA | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 125°C | -55°C | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-59628855204xa-datasheets-0983.pdf | CDIP | 37.2mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 28 | Parallel | 256 kb | 1.65mm | 1 | No | 115mA | 32kB | RAM, SDR, SRAM - Asynchronous | 45 ns | 15b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
| 70P244L55BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p244l55bygi-datasheets-0968.pdf | TFBGA | 5mm | 5mm | 1.8V | Lead Free | 81 | 1.9V | 1.7V | 81 | Parallel | 64 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 81 | INDUSTRIAL | 30 | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX16 | 0.000006A | COMMON | ||||||||||||||||||||||||||||||
| IDT71V547S90PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v547s90pfi8-datasheets-0947.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.235mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 83MHz | 128KX36 | 36 | 4718592 bit | 0.045A | 9 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| IDT71V67703S80PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67703s80pf8-datasheets-0933.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.21mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 256KX36 | 36 | 9437184 bit | 0.05A | 8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 70T651S10BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s10bc-datasheets-0874.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 405mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 10 ns | 18b | 0.01A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 70V639S15BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v639s15bf-datasheets-0859.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 1.4mm | 2 | No | 1 | 440mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 17b | 0.015A | 18b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 7015L35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7015l35j8-datasheets-0850.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 72 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 9kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 26b | 8KX9 | 0.005A | 9b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 7024S25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024s25pf8-datasheets-0846.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 64 kb | 1.4mm | 2 | No | 265mA | 8kB | RAM, SDR, SRAM | 25 ns | 24b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 7142SA20J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142sa20j-datasheets-0839.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 250mA | 2kB | RAM, SDR, SRAM | 20 ns | 22b | 8b | Asynchronous |
