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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IDT71V416S15Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s15y8-datasheets-1776.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 1 | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.17mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 15 ns | COMMON | 3V | YES | ||||||||||||||||||||||||||||||
| IDT70P3519S166BFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70p3519s166bfgi-datasheets-1773.pdf | 208 | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V632S6PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v632s6pfi8-datasheets-1775.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.63V | 3.135V | 20 | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 83MHz | 64KX32 | 32 | 2097152 bit | 0.015A | 6 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
| 7164S35DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s35db-datasheets-1763.pdf | CDIP | 37.2mm | 15.24mm | 5V | Contains Lead | 28 | 10 Weeks | 28 | Parallel | 64 kb | no | 1.65mm | 1 | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 28 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | RAM, SRAM - Asynchronous | 3-STATE | 13b | 8KX8 | 0.02A | 35 ns | COMMON | |||||||||||||||||||||||||||||||||
| 70P249L90BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p249l90bygi-datasheets-1756.pdf | TFBGA | 6mm | 6mm | Lead Free | 100 | 3V | 1.8V | 100 | Parallel | 64 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.6V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.06mA | 8kB | RAM, SDR, SRAM | 3-STATE | 90 ns | 24b | 4KX16 | 0.000006A | COMMON | |||||||||||||||||||||||||||||||
| 70T3519S200BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3519s200bcg-datasheets-1731.pdf | 17mm | 17mm | 2.5V | Lead Free | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | yes | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 525mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | COMMERCIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 200MHz | 3-STATE | 3.4 ns | 36b | 0.015A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 7006S20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006s20pf-datasheets-1710.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 28b | 16KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 70V25S35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v25s35pf8-datasheets-1663.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 180mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 26b | 8KX16 | 0.005A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 71V321S25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321s25pf8-datasheets-1660.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | BATTERY BACKUP;AUTOMATIC POWER DOWN | No | 1 | 130mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 11b | 0.005A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 70P249L65BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p249l65bygi8-datasheets-1661.pdf | TFBGA | 100 | 16 Weeks | 3V | 1.8V | 100 | Parallel | 64 kb | yes | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.07mA | 8kB | RAM, SDR, SRAM | 3-STATE | 65 ns | 24b | 4KX16 | 16 | 0.000006A | COMMON | ||||||||||||||||||||||||||||||||||
| 71V35761SA166BGGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa166bggi8-datasheets-1648.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 330mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.035A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 71321SA25PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321sa25pf-datasheets-1646.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 71V67602S133PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67602s133pfg8-datasheets-1595.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 8 Weeks | 3.465V | 3.135V | 100 | Parallel | 9 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 260mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 18b | 256KX36 | 0.05A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 70P249L65BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p249l65bygi-datasheets-1593.pdf | TFBGA | 6mm | 6mm | Lead Free | 100 | 16 Weeks | 3V | 1.8V | 100 | Parallel | 64 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.6V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.07mA | 8kB | RAM, SDR, SRAM | 3-STATE | 65 ns | 24b | 4KX16 | 0.000006A | COMMON | ||||||||||||||||||||||||||||||
| 71V35761SA166BGGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa166bggi-datasheets-1592.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 330mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.035A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 70T3319S166BFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.7mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3319s166bfg-datasheets-1589.pdf | 15mm | 15mm | 2.5V | Lead Free | 208 | 7 Weeks | 208 | Parallel | 4 Mb | yes | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 208 | COMMERCIAL | 30 | SRAMs | 0.45mA | RAM, SRAM | 3-STATE | 18b | 0.015A | 3.6 ns | COMMON | |||||||||||||||||||||||||||||||||
| 71V3556S166PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556s166pfg-datasheets-1578.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | No | 1 | 350mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 70V06S25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06s25j-datasheets-1561.pdf | PLCC | 24mm | 24mm | 3.3V | Contains Lead | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 190mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 28b | 16KX8 | 0.005A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||
| 709089L9PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 40MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709089l9pf8-datasheets-1533.pdf | TQFP | 14mm | 1.4mm | 14mm | 5V | Contains Lead | 350mA | 100 | 7 Weeks | 657.000198mg | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 350mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 9 ns | 32b | 64KX8 | 0.005A | 8b | Synchronous | COMMON | |||||||||||||||||||||||
| 71V35761SA183BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 183MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa183bg-datasheets-1491.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 340mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 183MHz | 3-STATE | 3.3 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 71024S12TYG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.76mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71024s12tyg8-datasheets-1486.pdf | 21.95mm | 7.6mm | 5V | Lead Free | 32 | 7 Weeks | 5.5V | 4.5V | 32 | Parallel | 1 Mb | yes | 2.67mm | 1 | No | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 32 | COMMERCIAL | SRAMs | 5V | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 17b | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||
| 70T3319S133BFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3319s133bfgi8-datasheets-1480.pdf | 15mm | 15mm | 2.5V | Lead Free | 208 | 7 Weeks | 208 | Parallel | 4 Mb | yes | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 208 | INDUSTRIAL | 30 | SRAMs | 0.45mA | RAM, SRAM | 3-STATE | 18b | 15 ns | COMMON | ||||||||||||||||||||||||||||||||||
| IDT71V632S5PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v632s5pfi8-datasheets-1461.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.63V | 3.135V | 20 | SRAMs | 3.3V | 0.2mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 64KX32 | 32 | 2097152 bit | 0.015A | 5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
| 7025S20J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s20j-datasheets-1444.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX16 | 0.015A | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 71V35761SA166BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa166bgg8-datasheets-1439.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 320mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 70V34S15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v34s15pf-datasheets-1431.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 72 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 215mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 9kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 24b | 4KX18 | 0.005A | 18b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 71V35761SA166BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa166bgg-datasheets-1426.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 320mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | SRAMs | 576kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 70T3509MS133BPG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3509ms133bpg-datasheets-1418.pdf | BGA | 17mm | 17mm | 2.5V | Lead Free | 1.12A | 256 | 14 Weeks | 2.6V | 2.4V | 256 | Parallel | 36 Mb | yes | 1.76mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 1.12A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | COMMERCIAL | 30 | SRAMs | 4.5MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 40b | 1MX36 | 0.06A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V05S20J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v05s20j-datasheets-1361.pdf | PLCC | 24mm | 24mm | 3.3V | Contains Lead | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX8 | 0.005A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||
| 70P3519S200BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p3519s200bcg-datasheets-1337.pdf | 17mm | 17mm | 1.8V | Lead Free | 256 | 256 | Parallel | 9 Mb | yes | 1.4mm | 2 | 3A991 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 1mm | 256 | COMMERCIAL | 1.9V | 1.7V | 30 | RAM, SRAM | 18b | 10 ns |
