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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Pbfree Code | ECCN Code | Additional Feature | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Source Url Status Check Date | Supplier Device Package | Screening Level | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | On Chip Program ROM Width | CPU Family | ROM (words) | Boundary Scan | Low Power Mode | Integrated Cache | Number of Timers | RAM (bytes) | On Chip Data RAM Width | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CY8C3866AXA-055 | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PSOC® 3 CY8C38xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/rochesterelectronicsllc-cy8c3846axe175-datasheets-1980.pdf | 100-LQFP | 100-TQFP (14x14) | Internal | 62 | CapSense, DMA, POR, PWM, WDT | 8K x 8 | 67MHz | 8051 | 1.71V~5.5V | FLASH | 8-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | A/D 16x20b; D/A 4x8b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12ZVL32F0CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S12 MagniV | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | 12 Weeks | Internal | 34 | LVD, POR, PWM, WDT | 1K x 8 | 32MHz | S12Z | 5.5V~18V | FLASH | 16-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | A/D 10x10b | 128 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12VR32F0CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S12 MagniV | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2011 | 32-LQFP | 7mm | 7mm | 32 | 12 Weeks | YES | QUAD | GULL WING | 0.8mm | 18V | 6V | 22mA | S-PQFP-G32 | Internal | 16 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | 8 | HCS12 | 32768 | NO | YES | NO | 5 | 2048 | 8 | 20MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 2x10b | 128 x 8 | |||||||||||||||||||||||
| S9S12GNA16F0MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2008 | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.5mm | 5.5V | 3.13V | Microcontrollers | 3.3/5V | 17mA | Not Qualified | S-PQFP-G48 | AEC-Q100 | Internal | 40 | LVD, POR, PWM, WDT | 1K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 16384 | 1024 | 16MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x12b | 512 x 8 | |||||||||||||||||||||||||
| MC9S08QA4CPAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | Not Applicable | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qa2cpae-datasheets-4332.pdf | 8-DIP (0.300, 7.62mm) | 7.62mm | 8 | 10 Weeks | 3A991.A.2 | e3 | Matte Tin (Sn) | NO | DUAL | NOT SPECIFIED | 3V | MC9S08QA4 | 3.6V | 1.8V | NOT SPECIFIED | Microcontrollers | 2/3.3V | 5mA | Not Qualified | R-PDIP-T8 | Internal | 4 | LVD, POR, PWM, WDT | 256 x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | A/D 4x10b | ||||||||||||||||||||||||||||
| MKV42F64VLF16R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KV | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mkv42f64vlf16r-datasheets-7698.pdf | 48-LQFP | 7mm | 7mm | 48 | 2 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 3.3V | 0.5mm | 3.6V | 1.71V | Internal | 38 | DMA, LVD, POR, PWM, WDT | 16K x 8 | 168MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, SPI, UART/USART | A/D 21x12b | |||||||||||||||||||||||||||||||||||
| LPC2146FBD64,557 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2100 | Surface Mount | -40°C~85°C TA | Tray | 2 (1 Year) | CMOS | 1.6mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2146fbd64151-datasheets-1270.pdf | 64-LQFP | 10mm | 10mm | 64 | 12 Weeks | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | LPC214* | 64 | 3.6V | 3V | NOT SPECIFIED | Microcontrollers | 3.3V | Not Qualified | S-PQFP-G64 | 2013-06-14 00:00:00 | Internal | 45 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 40K x 8 | 60MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | YES | 262144 | 25MHz | ARM7® | 3V~3.6V | FLASH | 16/32-Bit | 256KB 256K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | A/D 14x10b; D/A 1x10b | |||||||||||||||||||||
| SPC5603PEF1MLL4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | 100-LQFP | 12 Weeks | yes | 260 | SPC5603 | 40 | Internal | 79 | DMA, POR, PWM, WDT | 36K x 8 | 40MHz | MICROCONTROLLER, RISC | e200z0h | 3V~5.5V | FLASH | 32-Bit | 384KB 384K x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | A/D 30x10b | 64K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||
| FS32K148HFT0VLLT | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S32K | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | 16 Weeks | Internal | 156 | I2S, POR, PWM, WDT | 256K x 8 | 80MHz | ARM® Cortex®-M4F | 2.7V~5.5V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART | A/D 32x12b SAR; D/A 1x8b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MKE15Z64VLF4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KE1xZ | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | https://pdf.utmel.com/r/datasheets/nxpusainc-mke16z32vlf4-datasheets-9499.pdf | 48-LQFP | 14 Weeks | Internal | 42 | DMA, LVD, POR, PWM, WDT | 8K x 8 | 48MHz | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | 2.7V~5.5V | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | A/D 12x12b; D/A 1x8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY8C3866AXA-039 | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PSOC® 3 CY8C38xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/rochesterelectronicsllc-cy8c3846axe175-datasheets-1980.pdf | 100-LQFP | 100-TQFP (14x14) | Internal | 62 | CapSense, DMA, LCD, POR, PWM, WDT | 8K x 8 | 67MHz | 8051 | 1.71V~5.5V | FLASH | 8-Bit | 64KB 64K x 8 | EBI/EMI, I2C, LINbus, SPI, UART/USART, USB | A/D 16x20b; D/A 4x8b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MKL26Z64VFT4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KL2 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mkl26z64vlh4-datasheets-5823.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 3.6V | 1.71V | 40 | Internal | 36 | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 8K x 8 | 48MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | 48MHz | ARM® Cortex®-M0+ | 1.71V~3.6V | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | A/D - 16bit; D/A - 12bit | |||||||||||||||||||||||||||||||
| MKE04Z128VLD4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mke04z128vld4r-datasheets-7659.pdf | 10mm | 10mm | 44 | 15 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.8mm | 5.5V | 2.7V | 38 | 48 MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | 24MHz | |||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12GN32AVFT | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 48-TFQFN Exposed Pad | 14 Weeks | Internal | 40 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 1K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC1114LVFHN24/303 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC1100LV | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc1101lvukz-datasheets-6504.pdf | 24-VFQFN Exposed Pad | 4mm | 4mm | 24 | 16 Weeks | EAR99 | 8542.31.00.01 | YES | QUAD | NO LEAD | NOT SPECIFIED | 1.8V | 0.5mm | LPC1114 | 24 | 1.95V | 1.65V | NOT SPECIFIED | Microcontrollers | 1.8V | Not Qualified | S-PQCC-N24 | Internal | 20 | Brown-out Detect/Reset, POR, WDT | 8K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | NO | CORTEX-M0 | 32768 | 25MHz | ARM® Cortex®-M0 | 1.65V~1.95V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 8x8b | |||||||||||||||||||||||
| S9S08SG32E1WTG | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~150°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 1999 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08sg32e1mtg-datasheets-0710.pdf | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 4.4mm | 16 | 12 Weeks | 8542.31.00.01 | YES | DUAL | GULL WING | 260 | 3V | 0.65mm | S9S08SG32 | 5.5V | 2.7V | NOT SPECIFIED | Internal | 12 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||
| MC9RS08KB12CWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RS08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9rs08kb2csc-datasheets-0863.pdf | 20-SOIC (0.295, 7.50mm Width) | 12.8mm | 7.5mm | 20 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 3V | 1.27mm | MC9RS08KB12 | 5.5V | 1.8V | 40 | Microcontrollers | 2/5V | 7mA | Not Qualified | R-PDSO-G20 | Internal | 18 | LVD, POR, PWM, WDT | 254 x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 12288 | 16MHz | 1.8V~5.5V | FLASH | 8-Bit | 12KB 12K x 8 | I2C, SPI | A/D 12x10b | |||||||||||||||||||||||
| S9S08SG16E1WTLR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1999 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08sg32e1mtg-datasheets-0710.pdf | 28-TSSOP (0.173, 4.40mm Width) | 9.7mm | 4.4mm | 28 | 12 Weeks | 3A001.A.2.A | 8542.31.00.01 | YES | DUAL | GULL WING | 3V | 0.65mm | S9S08SG16 | 5.5V | 2.7V | Microcontrollers | 3/5V | 10mA | Not Qualified | R-PDSO-G28 | AEC-Q100 | Internal | 22 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | 16384 | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | A/D 16x10b | |||||||||||||||||||||||||||
| S9S12GN32F0VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2008 | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.5mm | 5.5V | 3.13V | Microcontrollers | 3.3/5V | 16mA | Not Qualified | S-PQFP-G48 | AEC-Q100 | Internal | 40 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 32768 | 2048 | 16MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 1K x 8 | |||||||||||||||||||||||||
| S9S08RNA32W1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 32-LQFP | 16 Weeks | yes | 260 | S9S08RNA32 | 40 | Internal | 26 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08LL16CGTR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1mm | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08ll8clf-datasheets-4961.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 15 Weeks | 3A991.A.2 | YES | QUAD | NO LEAD | 260 | 3V | 0.5mm | 3.6V | 1.8V | 40 | Microcontrollers | 1.8/3.6V | Not Qualified | S-XQCC-N48 | Internal | 31 | LCD, LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 16384 | 2048 | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | A/D 8x12b | |||||||||||||||||||||||||
| FS32K148HNT0VLUR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S32K | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-fs32k116lat0mlft-datasheets-8830.pdf | 176-LQFP | 16 Weeks | Internal | I2S, POR, PWM, WDT | 256K x 8 | 80MHz | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | 2.7V~5.5V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART | A/D 32x12b; D/A 1x8b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08SG4E2CSC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 1.75mm | ROHS3 Compliant | 1999 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08sg4e2mtj-datasheets-6362.pdf | 8-SOIC (0.154, 3.90mm Width) | 5mm | 3.9mm | 8 | 12 Weeks | EAR99 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 1.27mm | S9S08SG4 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 120mA | Not Qualified | R-PDSO-G8 | AEC-Q100 | Internal | 4 | LVD, POR, PWM, WDT | 256 x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | A/D 4x10b | ||||||||||||||||||||||
| S9S12VR16F0VLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S12 MagniV | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2011 | 32-LQFP | 12 Weeks | Internal | 16 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | A/D 2x10b | 128 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12GN48F0CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s12g96f0clf-datasheets-4388.pdf | 48-LQFP | 48 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 0.5mm | S9S12GN48 | Microcontrollers | 3.3/5V | 20mA | Not Qualified | S-PQFP-G48 | AEC-Q100 | Internal | 40 | LVD, POR, PWM, WDT | 4K x 8 | 25MHz | 16 | CPU12 | 49152 | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | A/D 12x10b | 1.5K x 8 | ||||||||||||||||||||||||||||||||||
| S9S12GN32F1MLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s12g96f0clf-datasheets-4388.pdf | 32-LQFP | 7mm | 7mm | 32 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.8mm | 5.5V | 3.13V | Microcontrollers | 3.3/5V | 16mA | Not Qualified | S-PQFP-G32 | AEC-Q100 | Internal | 26 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 32768 | 2048 | 16MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||||||||||||||||||||
| MKL17Z64VDA4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KL1 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.5mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mkl17z64vlh4-datasheets-2167.pdf | 36-XFBGA | 3.5mm | 3.5mm | 36 | 14 Weeks | 3A991.A.2 | DIFFERENTIAL ANALOG CHANNEL INPUTS: 4-CH 16-BIT | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 3V | 0.5mm | 3.6V | 1.71V | NOT SPECIFIED | S-PBGA-B36 | Internal | 32 | DMA, I2S, PWM, WDT | 16K x 8 | 48MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 48MHz | ARM® Cortex®-M0+ | 1.71V~3.6V | FLASH | 32-Bit | 64KB 64K x 8 | I2C, FlexIO, SPI, UART/USART | A/D 15x16b | |||||||||||||||||||||||||||
| S9S12GN16F0MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s12g96f0clf-datasheets-4388.pdf | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.5mm | S9S12GN16 | 5.5V | 3.13V | Microcontrollers | 3.3/5V | 16mA | Not Qualified | S-PQFP-G48 | AEC-Q100 | Internal | 40 | LVD, POR, PWM, WDT | 1K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 16384 | 16MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 512 x 8 | ||||||||||||||||||||||||
| S9S08EL16F1CTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1998 | 20-TSSOP (0.173, 4.40mm Width) | 20mm | 20mm | 144 | 12 Weeks | YES | QUAD | GULL WING | 260 | 3V | 0.5mm | 5.5V | 2.7V | 40 | External | 16 | LVD, POR, PWM, WDT | 512 x 8 | 40MHz | MICROCONTROLLER | 32 | NO | NO | YES | 24 | 16 | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | A/D 12x10b | 256 x 8 | ||||||||||||||||||||||||||||||||||
| MKE04Z64VLK4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KE04 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2006 | 80-LQFP | 14mm | 14mm | 80 | 20 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.65mm | 5.5V | 2.7V | 40 | Internal | 71 | LVD, PWM, WDT | 8K x 8 | 48MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | 24MHz | ARM® Cortex®-M0+ | 2.7V~5.5V | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | A/D 16x12b; D/A 2x6b |
