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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | Additional Feature | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | On Chip Program ROM Width | CPU Family | ROM (words) | RAM (bytes) | Clock Frequency | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| S9S12GN16BVLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s12gn32bvlc-datasheets-3833.pdf | 32-LQFP | 12 Weeks | Internal | 26 | LVD, POR, PWM, WDT | 1K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 512 x 8 | |||||||||||||||||||||||||||||||||||||||||||
| S9S12ZVL16F0VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S12 MagniV | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | YES | QUAD | GULL WING | 3.3V | 0.5mm | 5.5V | 3.135V | S-PQFP-G48 | ISO 26262 | Internal | 34 | LVD, POR, PWM, WDT | 1K x 8 | 32MHz | MICROCONTROLLER, RISC | 16 | YES | NO | YES | NO | 8 | 20MHz | S12Z | 5.5V~18V | FLASH | 16-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | A/D 10x10b | 128 x 8 | ||||||||||||||||||||||
| S9S08RNA32W1MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna32w1vlc-datasheets-0724.pdf | 48-LQFP | 16 Weeks | 260 | 40 | Internal | 39 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||
| MC9S08PT60VLF | NXP USA Inc. | $11.09 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pt32vld-datasheets-4572.pdf | 48-LQFP | 48 | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 0.5mm | MC9S08PT60 | 40 | Microcontrollers | 3/5V | 14.8mA | Not Qualified | S-PQFP-G48 | Internal | 41 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROCONTROLLER | 8 | 61440 | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | ||||||||||||||||||||||
| MKE15Z64VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KE1xZ | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mke16z32vlf4-datasheets-9499.pdf | 44-LQFP | 14 Weeks | compliant | 260 | 40 | Internal | 38 | DMA, LVD, POR, PWM, WDT | 8K x 8 | 48MHz | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | 2.7V~5.5V | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | A/D 12x12b; D/A 1x8b | |||||||||||||||||||||||||||||||||||||||||
| S9S12GN32ACFT | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 48-TFQFN Exposed Pad | 14 Weeks | Internal | 40 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||||||||||||||||||||||||||||||||||||||||
| S9S12GN32BMTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s12gn32bvlc-datasheets-3833.pdf | 20-TSSOP (0.173, 4.40mm Width) | 14 Weeks | Internal | 14 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 1K x 8 | |||||||||||||||||||||||||||||||||||||||||||
| MC9S08JS16LCFK | NXP USA Inc. | $22.38 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1mm | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08js8cwj-datasheets-9654.pdf | 24-VQFN Exposed Pad | 5mm | 5mm | 24 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | NO LEAD | 260 | 3V | 0.65mm | MC9S08JS16 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | Not Qualified | S-XQCC-N24 | Internal | 14 | LVD, POR, PWM | 512 x 8 | 48MHz | MICROCONTROLLER | 8 | NO | NO | YES | NO | 16384 | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI, USB | |||||||||||||||
| S9S12GN32ACFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 48-TFQFN Exposed Pad | 14 Weeks | Internal | 40 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||||||||||||||||||||||||||||||||||||||||
| MC9S08PA32AVLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pa32avlcr-datasheets-6455.pdf | 64-LQFP | 10mm | 10mm | 64 | 20 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 3V | 0.5mm | 5.5V | 2.7V | 40 | S-PQFP-G64 | Internal | 57 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | ||||||||||||||||||
| MC9S08PA60VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pa60vlh-datasheets-4694.pdf | 32-LQFP | 7mm | 7mm | 32 | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3V | 0.8mm | MC9S08PA60 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 14.8mA | Not Qualified | S-PQFP-G32 | Internal | 28 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 61440 | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | A/D 12x12b | 256 x 8 | |||||||||||||
| MKE02Z32VFM4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KE02 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mke02z64vlh4r-datasheets-7540.pdf | 32-VFQFN Exposed Pad | 7mm | 7mm | 32 | 20 Weeks | 3A991.A.2 | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | YES | QUAD | NO LEAD | 260 | 3V | 0.8mm | 5.5V | 2.7V | 40 | S-XQCC-N32 | Internal | 28 | LVD, PWM, WDT | 4K x 8 | 40MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | 8 | 32768 | 4096 | 20MHz | ARM® Cortex®-M0+ | 2.7V~5.5V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 16x12b; D/A 2x6b | 256 x 8 | |||||||||||||||
| MC9S08PA60VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pa60vlh-datasheets-4694.pdf | 48-LQFP | 7mm | 7mm | 48 | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3V | 0.5mm | MC9S08PA60 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 14.8mA | Not Qualified | S-PQFP-G48 | Internal | 41 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 61440 | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | A/D 12x12b | 256 x 8 | |||||||||||||
| MC9S08SH8MTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08sh8ctj-datasheets-1131.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 4.4mm | 20 | 22 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 3V | 0.65mm | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 7.7mA | Not Qualified | R-PDSO-G20 | Internal | 17 | LVD, POR, PWM, WDT | 512 x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 8192 | 512 | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | A/D 12x10b | ||||||||||||
| S9S08RNA16W2MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna16w2mlcr-datasheets-5909.pdf | 48-LQFP | 16 Weeks | 260 | 40 | Internal | 39 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | A/D 12x12b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||
| LPC1114FHN33/303Y | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC1100L | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc1114fhn333335-datasheets-0622.pdf | 32-VQFN Exposed Pad | 7mm | 7mm | 33 | 16 Weeks | YES | QUAD | NO LEAD | 260 | 3.3V | 0.65mm | 32 | 3.6V | 1.8V | NOT SPECIFIED | Internal | 28 | Brown-out Detect/Reset, POR, WDT | 8K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | NO | 25MHz | ARM® Cortex®-M0 | 1.8V~3.6V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 8x10b | ||||||||||||||||||||||||
| S9S08RN32W1VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna32w1vlc-datasheets-0724.pdf | 48-LQFP | 16 Weeks | 260 | 40 | Internal | 39 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||
| S9S12ZVL16F0VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S12 MagniV | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2013 | 32-LQFP | 7mm | 7mm | 32 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 12V | 0.8mm | 18V | 5.5V | Microcontrollers | 5.5/18V | 26mA | Not Qualified | S-PQFP-G32 | AEC-Q100 | Internal | 19 | LVD, POR, PWM, WDT | 1K x 8 | 32MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 16384 | 1024 | 20MHz | S12Z | 5.5V~18V | FLASH | 16-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | A/D 6x10b | 128 x 8 | ||||||||||||||||
| S9S12ZVL16F0CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S12 MagniV | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | 12 Weeks | Internal | 34 | LVD, POR, PWM, WDT | 1K x 8 | 32MHz | S12Z | 5.5V~18V | FLASH | 16-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | A/D 10x10b | 128 x 8 | ||||||||||||||||||||||||||||||||||||||||||||
| MC9RS08KB8CWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RS08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9rs08kb2csc-datasheets-0863.pdf | 20-SOIC (0.295, 7.50mm Width) | 12.8mm | 7.5mm | 20 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 3V | 1.27mm | MC9RS08KB8 | 5.5V | 1.8V | 40 | Microcontrollers | 2/5V | 7mA | Not Qualified | R-PDSO-G20 | Internal | 18 | LVD, POR, PWM, WDT | 254 x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 8192 | 16MHz | 1.8V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI | A/D 12x10b | ||||||||||||||
| S9S12ZVL16F0MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S12 MagniV | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 32-LQFP | 12 Weeks | Internal | 19 | LVD, POR, PWM, WDT | 1K x 8 | 32MHz | S12Z | 5.5V~18V | FLASH | 16-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | A/D 6x10b | 128 x 8 | ||||||||||||||||||||||||||||||||||||||||||||
| S9S12GN16F1CLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s12g96f0clf-datasheets-4388.pdf | 32-LQFP | 7mm | 7mm | 32 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.8mm | S9S12GN16 | 5.5V | 3.13V | Microcontrollers | 3.3/5V | 16mA | Not Qualified | S-PQFP-G32 | AEC-Q100 | Internal | 26 | LVD, POR, PWM, WDT | 1K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 16384 | 16MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 512 x 8 | |||||||||||||||
| MCHC908QY1VDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | CMOS | 2.65mm | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc908qy4cdte-datasheets-4172.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.3mm | 7.5mm | 16 | 3A991.A.2 | OPERATES AT 3V NOMINAL SUPPLY AT 4 MHZ | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 1.27mm | MCHC908QY1 | 5.5V | 4.5V | 40 | R-PDSO-G16 | Internal | 13 | LVD, POR, PWM | 128 x 8 | 8MHz | MICROCONTROLLER | 8 | NO | NO | YES | NO | 24MHz | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | |||||||||||||||||||
| MCHC908QT2CDWER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc908qy4cdte-datasheets-4172.pdf | 8-SOIC (0.209, 5.30mm Width) | 8 | 10 Weeks | 3A991.A.2 | OPERATES AT 3V NOMINAL SUPPLY AT 4 MHZ | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 1.27mm | MCHC908QT2 | 40 | R-PDSO-G8 | Internal | 5 | LVD, POR, PWM | 128 x 8 | 8MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 24MHz | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | A/D 4x8b | |||||||||||||||||||||||
| S9S12GN32J0CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | 14 Weeks | Internal | 40 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||||||||||||||||||||||||||||||||||||||||
| S9S12GN16F0MLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s12g96f0clf-datasheets-4388.pdf | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.5mm | S9S12GN16 | 5.5V | 3.13V | Microcontrollers | 3.3/5V | 16mA | Not Qualified | S-PQFP-G48 | AEC-Q100 | Internal | 40 | LVD, POR, PWM, WDT | 1K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 16384 | 16MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 512 x 8 | |||||||||||||||
| LPC1104UK,118 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC1104 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc1102uk118-datasheets-1071.pdf | 16-UFBGA, WLCSP | 2.32mm | 2.17mm | 16 | 16 Weeks | YES | BOTTOM | BALL | 3.3V | 0.5mm | 16 | 3.6V | 1.8V | Microcontrollers | 3.3V | Not Qualified | S-PBGA-B16 | Internal | 11 | Brown-out Detect/Reset, POR, WDT | 8K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | NO | CORTEX-M0 | 32768 | 8192 | 25MHz | ARM® Cortex®-M0 | 1.8V~3.6V | FLASH | 32-Bit | 32KB 32K x 8 | SPI, UART/USART | A/D 5x10b | ||||||||||||||||||
| MC9S08PT60VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pt32vld-datasheets-4571.pdf | 32-LQFP | 7mm | 7mm | 32 | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.8mm | MC9S08PT60 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 14.8mA | Not Qualified | S-PQFP-G32 | Internal | 28 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 61440 | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | ||||||||||||||
| MKL04Z32VFM4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KL0 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | 32-VFQFN Exposed Pad | 5mm | 5mm | 32 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | MKL04Z32 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 6.8mA | Not Qualified | S-XQCC-N32 | Internal | 28 | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 4K x 8 | 48MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | CORTEX-M0 | 32768 | 32MHz | ARM® Cortex®-M0+ | 1.71V~3.6V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 14x12b | ||||||||||||||
| LPC1112LVFHI33/103 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC1100LV | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc1101lvukz-datasheets-6504.pdf | 32-VFQFN Exposed Pad | 5mm | 5mm | 32 | 16 Weeks | EAR99 | 8542.31.00.01 | YES | QUAD | NO LEAD | NOT SPECIFIED | 1.8V | 0.5mm | LPC1112 | 32 | 1.95V | 1.65V | NOT SPECIFIED | Microcontrollers | 1.8V | Not Qualified | S-PQCC-N32 | Internal | 27 | Brown-out Detect/Reset, POR, WDT | 4K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | NO | CORTEX-M0 | 16384 | 25MHz | ARM® Cortex®-M0 | 1.65V~1.95V | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | A/D 6x8b |
