| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Additional Feature | Radiation Hardening | HTS Code | JESD-609 Code | Terminal Finish | Halogen Free | Surface Mount | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Number of Bits | Number of ADC Channels | Oscillator Type | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | Watchdog Timer | Number of Timers/Counters | Number of Programmable I/O | On Chip Program ROM Width | CPU Family | ROM (words) | Number of UART Channels | RAM (words) | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of Serial I/Os | Number of Timers | Number of A/D Converters | Number of PWM Channels | RAM (bytes) | Number of I2C Channels | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Barrel Shifter | Internal Bus Architecture | Core Processor | Number of Ethernet Channels | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC56F8346VFVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xxx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1998 | /files/nxpusainc-mc56f8346mfve-datasheets-3278.pdf | 144-LQFP | 20mm | 20mm | 144 | 10 Weeks | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.5mm | MC56F8346 | 2.75V | 2.25V | 40 | Microcontrollers | 2.53.3V | Not Qualified | S-PQFP-G144 | External | 62 | POR, PWM, Temp Sensor, WDT | 6K x 16 | 60MHz | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | 131072 | YES | YES | FIXED POINT | 120MHz | 17 | 16 | YES | MULTIPLE | 56800E | 2.25V~3.6V | FLASH | 16-Bit | 128KB 64K x 16 | CANbus, EBI/EMI, SCI, SPI | A/D 16x12b | |||||||||||||||||||||||||||||||||||||||||||||||
| STM32F302CCT6TR | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F3 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/stmicroelectronics-stm32f302cct6-datasheets-3945.pdf | 48-LQFP | 7mm | 7mm | 48 | 10 Weeks | ACTIVE (Last Updated: 7 months ago) | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | STM32F302 | 3.6V | 2V | NOT SPECIFIED | Microcontrollers | 2.5/3.3V | Not Qualified | S-PQFP-G48 | Internal | 37 | DMA, I2S, POR, PWM, WDT | 40K x 8 | 72MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 262144 | 32MHz | ARM® Cortex®-M4 | 2V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB | A/D 9x12b; D/A 1x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DF2368VTE34V | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | H8® H8S/2300 | Surface Mount | Surface Mount | -20°C~75°C TA | Tray | 3 (168 Hours) | 34MHz | ROHS3 Compliant | 2009 | 120-TQFP | 3.3V | Lead Free | 20 Weeks | 120 | I2C, IrDA, SCI | No | DF2368 | 512kB | Internal | 83 | DMA, POR, PWM, WDT | 32K x 8 | 16b | 8 | 34 μs | H8S/2000 | 3V~3.6V | FLASH | 16-Bit | 512KB 512K x 8 | I2C, IrDA, SCI, SmartCard | A/D 10x10b; D/A 2x8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS80C320-ENG+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 80C | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2009 | /files/maximintegrated-ds80c320mng-datasheets-7144.pdf | 44-TQFP | 10mm | 10mm | Lead Free | 44 | 6 Weeks | 44 | yes | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.8mm | DS80C320 | 44 | 5.5V | 4.5V | 30 | Microcontrollers | 5V | 45mA | Not Qualified | External | 32 | Power-Fail Reset, WDT | 256 x 8 | 25MHz | MICROCONTROLLER | 8 | NO | NO | NO | NO | MROM | 25MHz | 16 | 8 | 8051 | 4.5V~5.5V | ROMless | 8-Bit | EBI/EMI, SIO, UART/USART | |||||||||||||||||||||||||||||||||||||||||||||||
| STM32F217IGH6 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F2 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 120MHz | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/stmicroelectronics-stm32f215rgt6-datasheets-1735.pdf | 201-UFBGA | 10.05mm | 500μm | 10.05mm | Lead Free | 201 | 12 Weeks | No SVHC | 176 | CAN, Ethernet, I2C, I2S, IrDA, LIN, MMC, SPI, UART, USART, USB | ACTIVE (Last Updated: 7 months ago) | No | YES | 513mW | BOTTOM | BALL | STM32F217 | 176 | Microcontrollers | 1MB | 24 | Internal | 140 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | ARM | 132K x 8 | 32b | 32 | Yes | 14 | 2 | 6 | 3 | ARM® Cortex®-M3 | 1 | 1.8V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, Ethernet, I2C, IrDA, LINbus, Memory Card, SPI, UART/USART, USB OTG | A/D 24x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF52233CAF60 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5223x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2001 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf52235cal60-datasheets-8797.pdf | 80-LQFP | 14mm | 14mm | 80 | 10 Weeks | 3A991.A.2 | ALSO OPERATES AT 3V SUPPLY | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | MCF52233 | 3.6V | 3V | 40 | Microcontrollers | 3.3V | Not Qualified | S-PQFP-G80 | Internal | 73 | DMA, LVD, POR, PWM, WDT | 32K x 8 | 60MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 262144 | 60MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | Ethernet, I2C, SPI, UART/USART | A/D 8x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DF2117VBG20V | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | H8® H8S/2100 | Surface Mount | Surface Mount | -20°C~75°C TA | Tray | 3 (168 Hours) | 20MHz | ROHS3 Compliant | 2009 | 176-LFBGA | 3.3V | 20 Weeks | 176 | I2C, SCI | No | DF2117 | 160kB | External | 128 | POR, PWM, WDT | 8K x 8 | 10 | H8S/2600 | 3V~3.6V | FLASH | 16-Bit | 160KB 160K x 8 | FIFO, I2C, LPC, SCI, SmartCard | A/D 16x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12XDP512VAL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xdp512cal-datasheets-2633.pdf | 112-LQFP | 20mm | 20mm | 112 | 10 Weeks | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12XDP512 | 2.75V | 2.35V | 40 | Microcontrollers | 2.55V | Not Qualified | S-PQFP-G112 | External | 91 | LVD, POR, PWM, WDT | 32K x 8 | 80MHz | MICROCONTROLLER | 16 | YES | YES | YES | NO | CPU12 | 524288 | 80MHz | 2.35V~5.5V | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | A/D 16x10b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12XD256CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2001 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xdp512cal-datasheets-2633.pdf | 112-LQFP | 20mm | 20mm | 112 | 10 Weeks | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 9S12XD256 | 2.75V | 2.35V | 40 | Microcontrollers | 2.55V | Not Qualified | S-PQFP-G112 | External | 91 | LVD, POR, PWM, WDT | 14K x 8 | 80MHz | MICROCONTROLLER | 16 | YES | YES | YES | NO | CPU12 | 262144 | 80MHz | 2.35V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | A/D 16x10b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAH176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | CMOS | 1.6mm | ROHS3 Compliant | 2018 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 1.8V | 0.4mm | PIC32MZ1064DA | 1.9V | 1.7V | NOT SPECIFIED | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC56F8357VPYE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xxx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1998 | 160-LQFP | 24mm | 24mm | 160 | 10 Weeks | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.5mm | MC56F8357 | 2.75V | 2.25V | 40 | Microcontrollers | 2.53.3V | Not Qualified | S-PQFP-G160 | External | 76 | POR, PWM, Temp Sensor, WDT | 10K x 16 | 60MHz | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | 262144 | YES | YES | FIXED POINT | 120MHz | 24 | 16 | YES | MULTIPLE | 56800E | 2.25V~3.6V | FLASH | 16-Bit | 256KB 128K x 16 | CANbus, EBI/EMI, SCI, SPI | A/D 16x12b | ||||||||||||||||||||||||||||||||||||||||||||||||
| MC56F8345MFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xxx | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1998 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc56f8345vfge-datasheets-7310.pdf | 128-LQFP | 20mm | 14mm | 128 | 10 Weeks | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.5mm | MC56F8345 | 2.75V | 2.25V | 40 | Microcontrollers | 2.53.3V | Not Qualified | R-PQFP-G128 | External | 49 | POR, PWM, Temp Sensor, WDT | 6K x 16 | 60MHz | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | 131072 | YES | YES | FIXED POINT | 120MHz | 11 | 4 | YES | MULTIPLE | 56800E | 2.25V~3.6V | FLASH | 16-Bit | 128KB 64K x 16 | CANbus, EBI/EMI, SCI, SPI | A/D 16x12b | |||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12C128CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2005 | /files/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | EAR99 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12C128 | 2.75V | 2.35V | 40 | Microcontrollers | 2.53.3/5V | 45mA | Not Qualified | S-PQFP-G80 | Internal | 60 | POR, PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 131072 | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12XDT512CAA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xdp512cal-datasheets-2633.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | 3A991.A.2 | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 9S12XDT512 | 2.75V | 2.35V | 40 | Microcontrollers | 2.55V | Not Qualified | S-PQFP-G80 | External | 59 | LVD, POR, PWM, WDT | 20K x 8 | 80MHz | MICROCONTROLLER | 16 | YES | YES | YES | NO | CPU12 | 524288 | 80MHz | 2.35V~5.5V | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | A/D 8x10b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||
| MCF52277CVM160 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5227x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2006 | /files/nxpusainc-mcf52277cvm160-datasheets-7390.pdf | 196-LBGA | 15mm | 15mm | 196 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.5V | 0.5mm | MCF52277 | 1.6V | 1.4V | NOT SPECIFIED | Microprocessors | 1.51.82.53.3V | 0.7mA | Not Qualified | S-PBGA-B196 | External | 55 | DMA, LCD, PWM, WDT | 128K x 8 | 166.67MHz | MICROPROCESSOR, RISC | 32 | YES | NO | FIXED POINT | YES | 66.67MHz | 24 | 32 | Coldfire V2 | 1.4V~1.6V | ROMless | 32-Bit | CANbus, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MK70FX512VMJ15 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K70 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | /files/nxpusainc-mk10fx512vlq12-datasheets-0933.pdf | 256-LBGA | 17mm | 17mm | 256 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | MK70FX512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 210mA | Not Qualified | S-PBGA-B256 | Internal | 128 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 150MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 524288 | 60MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 71x16b; D/A 2x12b | 16K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAML21J18B-MNT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAM L21J | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-atsaml21e18bmut-datasheets-1217.pdf | 64-VFQFN Exposed Pad | 9mm | 9mm | 64 | 9 Weeks | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | NO LEAD | 3.3V | 0.5mm | ATSAML21J | 3.63V | 1.62V | S-XQCC-N64 | TS 16949 | Internal | 51 | DMA, POR, PWM, WDT | 32K x 8 | 48MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 8 | 32MHz | ARM® Cortex®-M0+ | 1.62V~3.63V | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SCI, SPI, UART/USART, USB | A/D 20x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC58EC80E1Q0C0Y | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SPC58 C-Line, Chorus | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/stmicroelectronics-spc58ec80e5qmc0y-datasheets-3140.pdf | 64-TQFP | 10mm | 10mm | 64 | 35 Weeks | ACTIVE (Last Updated: 7 months ago) | YES | QUAD | GULL WING | 0.5mm | SPC58E | Internal | 48 | DMA | 512K x 8 | 180MHz | MICROCONTROLLER, RISC | 32 | YES | YES | NO | e200z4d | 3.3V 5V | FLASH | 32-Bit Dual-Core | 4MB 4M x 8 | CANbus, I2C, LINbus, SPI | 128K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12XEQ512CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1996 | /files/nxpusainc-mc9s12xep100cal-datasheets-5105.pdf | 112-LQFP | 20mm | 20mm | 112 | 12 Weeks | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 1.8V | 0.65mm | MC9S12XEQ512 | 1.98V | 1.72V | 40 | Microcontrollers | 3.3/5V | Not Qualified | S-PQFP-G112 | External | 91 | LVD, POR, PWM, WDT | 32K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | CPU12 | 524288 | 40MHz | 1.72V~5.5V | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | A/D 16x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MC56F8345VFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xxx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1998 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc56f8345vfge-datasheets-7310.pdf | 128-LQFP | 20mm | 14mm | 128 | 10 Weeks | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.5mm | MC56F8345 | 2.75V | 2.25V | 40 | Microcontrollers | 2.53.3V | Not Qualified | R-PQFP-G128 | External | 49 | POR, PWM, Temp Sensor, WDT | 6K x 16 | 60MHz | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | 131072 | YES | YES | FIXED POINT | 120MHz | 11 | 4 | YES | MULTIPLE | 56800E | 2.25V~3.6V | FLASH | 16-Bit | 128KB 64K x 16 | CANbus, EBI/EMI, SCI, SPI | A/D 16x12b | |||||||||||||||||||||||||||||||||||||||||||||||
| MCF5270VM100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF527x | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5270vm100-datasheets-7182.pdf | 196-LBGA | 15mm | 15mm | 196 | 5A992 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.5V | 1mm | MCF5270 | 1.6V | 1.4V | 40 | Not Qualified | S-PBGA-B196 | External | 61 | DMA, WDT | 64K x 8 | 100MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 75MHz | 24 | 32 | Coldfire V2 | 1.4V~1.6V | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TM4C1299NCZADI3 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tiva™ C | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 120MHz | 1mm | ROHS3 Compliant | 212-VFBGA | 10mm | 10mm | 3.3V | Lead Free | 212 | 6 Weeks | No SVHC | 212 | CAN, EBI/EMI, Ethernet, I2C, IrDA, SPI, UART, USART, USB | ACTIVE (Last Updated: 2 days ago) | yes | 650μm | 5A992.C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 1.018W | BOTTOM | BALL | 1.2V | 0.5mm | M4C1299 | 1.32V | 1MB | 12 | Internal | 140 | Brown-out Detect/Reset, DMA, Motion Control PWM, POR, PWM, WDT | ARM | 256K x 8 | 32b | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | Yes | 140 | CORTEX-M3 | 8 | 256 | YES | YES | FLOATING-POINT | YES | 3 | 8 | 24 | ARM® Cortex®-M4F | 2.97V~3.63V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, QEI, SPI, SSI, UART/USART, USB OTG | A/D 24x12b | 6K x 8 | |||||||||||||||||||||||||||||||||||||
| XC167CI16F40FBBKXQMA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XC16x | Surface Mount | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 40MHz | 1.6mm | ROHS3 Compliant | 2001 | https://pdf.utmel.com/r/datasheets/infineontechnologies-xc167ci16f40fbbkxqma1-datasheets-7196.pdf | 144-LQFP | 20mm | Contains Lead | 144 | 144 | CAN, EBI/EMI, I2C, SPI, UART, USART | No | e3 | Tin (Sn) | 800mW | QUAD | GULL WING | 2.5V | 144 | 2.7V | 128kB | Internal | 103 | PWM, WDT | 8K x 8 | 16b | MICROCONTROLLER | 16 | YES | NO | YES | NO | Yes | 5 | 24 | C166SV2 | 2.35V~2.7V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | A/D 16x8/10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DF2318VTE25V | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | H8® H8S/2300 | Surface Mount | Surface Mount | -20°C~75°C TA | Tray | 3 (168 Hours) | 25MHz | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/renesas-df2318vte25v-datasheets-8281.pdf | 100-TQFP | 3.3V | Lead Free | 20 Weeks | 100 | SCI | No | DF2318 | 256kB | Internal | 70 | POR, PWM, WDT | 8K x 8 | 16b | 8 | 25 μs | H8S/2000 | 2.7V~3.6V | FLASH | 16-Bit | 256KB 256K x 8 | SCI, SmartCard | A/D 8x10b; D/A 2x8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2064DAH169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | 2018 | /files/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | PIC32MZ2064DA | 1.9V | 1.7V | NOT SPECIFIED | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC908MR32CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.4mm | ROHS3 Compliant | 2005 | /files/nxpusainc-mc908mr16cfue-datasheets-5396.pdf | 64-QFP | 14mm | 14mm | 64 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 5V | 0.8mm | MC908MR32 | 5.5V | 4.5V | 40 | S-PQFP-G64 | Internal | 44 | LVD, POR, PWM | 768 x 8 | 8MHz | MICROCONTROLLER | 8 | YES | YES | YES | NO | 32MHz | 4.5V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | A/D 10x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAH176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | CMOS | 1.6mm | ROHS3 Compliant | 2018 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 1.8V | 0.4mm | PIC32MZ2025DA | 1.9V | 1.7V | NOT SPECIFIED | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12A128CPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12a128cfue-datasheets-7067.pdf | 112-LQFP | 20mm | 20mm | 112 | 15 Weeks | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12A128 | 2.75V | 2.35V | 40 | Microcontrollers | 2.55V | 65mA | Not Qualified | S-PQFP-G112 | Internal | 91 | PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 131072 | 50MHz | 20 | 16 | 2.35V~5.25V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | A/D 16x10b | 2K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||
| CY90F362TESPMCR-GN9E1 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | F2MC-16LX MB90360E | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 48-LQFP | 7mm | 7mm | 48 | 23 Weeks | YES | QUAD | GULL WING | NOT SPECIFIED | 5V | 0.5mm | 5.5V | 4V | NOT SPECIFIED | S-PQFP-G48 | External | 36 | DMA, POR, WDT | 3K x 8 | 24MHz | MICROCONTROLLER | 16 | YES | NO | NO | NO | 8 | 3072 | 24MHz | F2MC-16LX | 3V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, LINbus, UART/USART | A/D 16x8/10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XMC4700E196K2048AAXQMA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XMC4000 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 144MHz | 1.7mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/infineontechnologies-xmc4800f144k2048aaxqma1-datasheets-7341.pdf | 196-LFBGA | 12mm | 3.3V | Lead Free | 196 | 14 Weeks | 196 | CAN, EBI/EMI, Ethernet, I2C, I2S, LIN, MMC, SD, SPI, UART, USART, USB | yes | 3A991.A.2 | Halogen Free | YES | 1.4W | BOTTOM | BALL | NOT SPECIFIED | 1.3V | 0.8mm | NOT SPECIFIED | 2MB | External | 155 | DMA, I2S, LED, POR, Touch-Sense, WDT | ARM | 352K x 8 | 32b | MICROCONTROLLER, RISC | 32 | YES | YES | NO | YES | Yes | 4 | 153 | 8 | 2097152 | ARM® Cortex®-M4 | 3.13V~3.63V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC | A/D 32x12b; D/A 2x12b |
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