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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Density | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Additional Feature | Radiation Hardening | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Number of Bits | Number of ADC Channels | Oscillator Type | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Output Type | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Watchdog Timer | Number of Timers/Counters | On Chip Program ROM Width | CPU Family | Number of GPIO | ROM (words) | Number of UART Channels | RAM (words) | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of Serial I/Os | Number of A/D Converters | Number of PWM Channels | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Number of Ethernet Channels | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC9S12XDT256VAA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xdp512cal-datasheets-2633.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | 3A991.A.2 | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12XDT256 | 2.75V | 2.35V | 40 | Microcontrollers | 2.55V | Not Qualified | S-PQFP-G80 | External | 59 | LVD, POR, PWM, WDT | 16K x 8 | 80MHz | MICROCONTROLLER | 16 | YES | YES | YES | NO | CPU12 | 262144 | 80MHz | 2.35V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | A/D 8x10b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2064DAB288-I/4J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 288-LFBGA | 15mm | 15mm | 288 | 1 Weeks | 8542.31.00.01 | e3 | Matte Tin (Sn) - annealed | YES | BOTTOM | BALL | 1.8V | 0.8mm | PIC32MZ2064DA | 1.9V | 1.7V | S-PBGA-B288 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC2458FET180,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2400 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2458fet180551-datasheets-7151.pdf | 180-TFBGA | 12mm | 12mm | 180 | 12 Weeks | EAR99 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | LPC2458 | 180 | 3.6V | 3V | NOT SPECIFIED | Microcontrollers | 3.3V | Not Qualified | S-PBGA-B180 | Internal | 136 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 98K x 8 | 72MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 524288 | 24MHz | 20 | 16 | ARM7® | 3V~3.6V | FLASH | 16/32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | A/D 8x10b; D/A 1x10b | ||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1025DAH176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 1.8V | 0.4mm | PIC32MZ1025DA | 1.9V | 1.7V | NOT SPECIFIED | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF52234CAL60 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5223x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2000 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf52235cal60-datasheets-8797.pdf | 112-LQFP | 20mm | 20mm | 112 | 10 Weeks | 3A991.A.2 | ALSO OPERATES AT 3V SUPPLY | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | MCF52234 | 3.6V | 3V | 40 | Microcontrollers | 3.3V | Not Qualified | S-PQFP-G112 | Internal | 73 | DMA, LVD, POR, PWM, WDT | 32K x 8 | 60MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 262144 | 60MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, Ethernet, I2C, SPI, UART/USART | A/D 8x12b | ||||||||||||||||||||||||||||||||||||||||||||||
| MSP430F5340IRGZR | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MSP430F5xx | Surface Mount | -40°C~85°C TA | Digi-Reel® | 3 (168 Hours) | CMOS | 25MHz | ROHS3 Compliant | 48-VFQFN Exposed Pad | 7mm | 1mm | 7mm | Lead Free | 48 | 6 Weeks | 48 | I2C, IrDA, SCI, SPI, UART, USART | ACTIVE (Last Updated: 1 day ago) | yes | 900μm | IT ALSO OPERATES IN 1.8V MIN SUPPLY AT 8MHZ | No | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | QUAD | 260 | 3.3V | 0.5mm | MSP430 | 48 | 3.6V | Microcontrollers | 11mA | 64kB | Internal | 38 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 6K x 8 | 16b | MICROCONTROLLER, RISC | 16 | YES | YES | YES | NO | Yes | 4 | 31 | 65536 | 2 | 6 | YES | YES | FIXED-POINT | NO | 2 | 9 | CPUXV2 | 1.8V~3.6V | FLASH | 16-Bit | 64KB 64K x 8 | I2C, IrDA, SCI, SPI, UART/USART | A/D 9x12b | |||||||||||||||||||||||||||||||||||
| MK60FX512VLQ15 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | /files/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf | 144-LQFP | 20mm | 20mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MK60FX512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 210mA | Not Qualified | S-PQFP-G144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 150MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 524288 | 60MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 58x16b; D/A 2x12b | 16K x 8 | |||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAG169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | PIC32MZ2025DA | 1.9V | 1.7V | NOT SPECIFIED | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12A128CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12a128cfue-datasheets-7067.pdf | 80-QFP | 14mm | 14mm | 80 | 15 Weeks | 3A991.A.2 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12A128 | 2.75V | 2.35V | 40 | Microcontrollers | 2.55V | 65mA | Not Qualified | S-PQFP-G80 | Internal | 59 | PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 131072 | 50MHz | 16 | 16 | 2.35V~5.25V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | A/D 16x10b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| MAXQ7667AACM/V+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, MAXQ® | Surface Mount | -40°C~125°C TA | Tray | 1 (Unlimited) | CMOS | 16MHz | 1.6mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/maximintegrated-maxq7667aacmv-datasheets-7075.pdf | 48-LQFP | 7mm | 5V | 48 | 6 Weeks | Unknown | 48 | LIN, SPI, UART | yes | EAR99 | No | YES | QUAD | GULL WING | 2.5V | 0.8mm | MAXQ7667 | 48 | 32kB | Internal | 16 | Brown-out Detect/Reset, POR, WDT | RISC | 2K x 16 | 16b | Digital | 16 | YES | NO | YES | NO | 3 | 2.25V~2.75V | FLASH | 16-Bit | 32KB 16K x 16 | LINbus, SPI, UART/USART | A/D 5x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MK70FN1M0VMJ12 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K70 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mk10fx512vlq12-datasheets-0933.pdf | 256-LBGA | 17mm | 17mm | 256 | 13 Weeks | 3A991.A.2 | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | MK70FN1M0 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 177mA | Not Qualified | S-PBGA-B256 | Internal | 128 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 1048576 | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 71x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||
| MK61FX512VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3V | 1mm | MK61FX512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.32.5/3.3V | 177mA | Not Qualified | S-PBGA-B144 | Internal | 95 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 524288 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 53x16b; D/A 2x12b | 16K x 8 | ||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAH169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | CMOS | 1.56mm | ROHS3 Compliant | 2018 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | PIC32MZ1064DA | 1.9V | 1.7V | NOT SPECIFIED | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DSP56F826BU80E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1998 | https://pdf.utmel.com/r/datasheets/nxpusainc-dsp56f826bu80e-datasheets-7124.pdf | 100-LQFP | 10 Weeks | DSP56F826 | 100-LQFP (14x14) | External | 46 | POR, WDT | 4K x 16 | 80MHz | 56800 | 2.25V~2.75V | FLASH | 16-Bit | 64KB 32K x 16 | EBI/EMI, SCI, SPI, SSI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF5208CAB166 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF520x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 3.85mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5208cvm166-datasheets-8685.pdf | 160-BQFP | 28mm | 28mm | 160 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 1.5V | 0.65mm | MCF5208 | 1.6V | 1.4V | 40 | Microprocessors | 1.51.8/3.3V | Not Qualified | S-PQFP-G160 | External | 50 | DMA, WDT | 16K x 8 | 166.67MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 40MHz | 24 | 32 | Coldfire V2 | 1.4V~3.6V | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART | ||||||||||||||||||||||||||||||||||||||||||||||||
| MCF52255CAF80 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5225x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2004 | 100-LQFP | 14mm | 14mm | 100 | 10 Weeks | 5A992 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MCF52255 | 3.6V | 3V | 40 | Microcontrollers | 3.3V | Not Qualified | S-PQFP-G100 | Internal | 56 | DMA, LVD, POR, PWM, WDT | 64K x 8 | 80MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 524288 | 80MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG | A/D 8x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAG176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2018 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 1.8V | 0.4mm | PIC32MZ1064DA | 1.9V | 1.7V | NOT SPECIFIED | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAG176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2018 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 1.8V | 0.4mm | PIC32MZ2025DA | 1.9V | 1.7V | NOT SPECIFIED | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5604PGF1VLQ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2007 | 144-LQFP | 20mm | 20mm | 144 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.5mm | SPC5604 | 5.5V | 4.5V | Microcontrollers | 3.3/5V | 89mA | Not Qualified | S-PQFP-G144 | AEC-Q100 | Internal | 108 | DMA, POR, PWM, WDT | 40K x 8 | 64MHz | MICROCONTROLLER | 32 | YES | YES | YES | 524288 | 40MHz | 32 | e200z0h | 3V~5.5V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | A/D 30x10b | 64K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF52236CAF50 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5223x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2004 | /files/nxpusainc-mcf52235cal60-datasheets-8797.pdf | 80-LQFP | 14mm | 14mm | 80 | 10 Weeks | 3A991.A.2 | ALSO OPERATES AT 3V SUPPLY | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | MCF52236 | 3.6V | 3V | 40 | Microcontrollers | 3.3V | Not Qualified | S-PQFP-G80 | Internal | 56 | DMA, LVD, POR, PWM, WDT | 32K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 262144 | 50MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | Ethernet, I2C, SPI, UART/USART | A/D 8x12b | ||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAG169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | PIC32MZ1064DA | 1.9V | 1.7V | NOT SPECIFIED | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC18F86J65-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 18J | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 41.667MHz | ROHS3 Compliant | 2008 | /files/microchiptechnology-pic18f66j60ipt-datasheets-4783.pdf | 80-TQFP | 12mm | 1.05mm | 12mm | 3.6V | Lead Free | 80 | 7 Weeks | No SVHC | 80 | Ethernet, I2C, SPI, UART, USART | 768 kb | yes | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ | No | e3 | Matte Tin (Sn) | 1W | QUAD | GULL WING | 260 | 2.5V | PIC18F86J65 | 80 | 40 | Microcontrollers | 96kB | 8 | 15 | Internal | 55 | Brown-out Detect/Reset, POR, PWM, WDT | 3808 x 8 | 8b | MICROCONTROLLER | 16 | YES | NO | 5 | PIC | 14 | 42 μs | PIC | 1 | 2V~3.6V | FLASH | 8-Bit | 96KB 48K x 16 | Ethernet, I2C, SPI, UART/USART | A/D 15x10b | |||||||||||||||||||||||||||||||||||||||
| MC9S12C64MFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2005 | /files/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 48-LQFP | 7mm | 7mm | 48 | 10 Weeks | EAR99 | ALSO REQUIRES 5V SUPPLY | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.5mm | MC9S12C64 | 2.75V | 2.35V | 40 | Microcontrollers | 2.53.3/5V | 45mA | Not Qualified | S-PQFP-G48 | Internal | 31 | POR, PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 65536 | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||||
| MC908GZ60CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | HCMOS | 2.45mm | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908gz60cfue-datasheets-6882.pdf | 64-QFP | 14mm | 14mm | 64 | 10 Weeks | 3A991.A.2 | OPERATES AT 3.3V SUPPLY @ 4MHZ | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.8mm | MC908GZ60 | 5.5V | 4.5V | 40 | Not Qualified | S-PQFP-G64 | Internal | 53 | LVD, POR, PWM | 2K x 8 | 8MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 32MHz | 3V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, SCI, SPI | A/D 24x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2064DAA176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 8 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 1.8V | 0.4mm | PIC32MZ2064DA | 1.9V | 1.7V | NOT SPECIFIED | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC2377FBD144,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2300 | Surface Mount | -40°C~85°C TA | Tray | 2 (1 Year) | CMOS | 1.6mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2378fbd144551-datasheets-1331.pdf | 144-LQFP | 20mm | 20mm | 144 | 12 Weeks | EAR99 | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | LPC237* | 144 | 3.6V | 3V | NOT SPECIFIED | Microcontrollers | 3.3V | Not Qualified | S-PQFP-G144 | Internal | 104 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 58K x 8 | 72MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 524288 | 25MHz | 16 | 8 | ARM7® | 3V~3.6V | FLASH | 16/32-Bit | 512KB 512K x 8 | EBI/EMI, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART | A/D 8x10b; D/A 1x10b | ||||||||||||||||||||||||||||||||||||||||||||
| MCF5207CVM166 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF520x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5208cvm166-datasheets-8685.pdf | 144-LBGA | 13mm | 13mm | 144 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | Tin/Silver/Copper - with Nickel barrier | YES | BOTTOM | BALL | 260 | 1.5V | 1mm | MCF5207 | 1.6V | 1.4V | 40 | Microprocessors | 1.51.8/3.3V | Not Qualified | S-PBGA-B144 | External | 30 | DMA, WDT | 16K x 8 | 166.67MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 40MHz | 24 | 32 | Coldfire V2 | 1.4V~3.6V | ROMless | 32-Bit | EBI/EMI, I2C, SPI, UART/USART | |||||||||||||||||||||||||||||||||||||||||||||||||
| STM32F769IGT6 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F7 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/stmicroelectronics-stm32f765vgt6-datasheets-2257.pdf | 176-LQFP | 24mm | 24mm | 176 | 12 Weeks | ACTIVE (Last Updated: 7 months ago) | YES | QUAD | GULL WING | NOT SPECIFIED | 3V | 0.5mm | STM32F769 | 3.6V | 1.8V | NOT SPECIFIED | Internal | 140 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 512K x 8 | 216MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | 26MHz | ARM® Cortex®-M7 | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | A/D 24x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF52232CAF50 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5223x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2004 | /files/nxpusainc-mcf52235cal60-datasheets-8797.pdf | 80-LQFP | 14mm | 14mm | 80 | 10 Weeks | 3A991.A.2 | ALSO OPERATES AT 3V SUPPLY | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | MCF52232 | 3.6V | 3V | 40 | Microcontrollers | 3.3V | Not Qualified | S-PQFP-G80 | Internal | 56 | DMA, LVD, POR, PWM, WDT | 32K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 131072 | 50MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | Ethernet, I2C, SPI, UART/USART | A/D 8x12b | ||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MX274F256DT-V/PT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, PIC® XLP™ 32MX | Surface Mount | -40°C~105°C TA | Cut Tape (CT) | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mx174f256bimm-datasheets-0697.pdf | 44-TQFP | 10mm | 10mm | 44 | 6 Weeks | YES | QUAD | GULL WING | 3.3V | 0.8mm | PIC32MX274F256D | 3.6V | 2.5V | S-PQFP-G44 | AEC-Q100; TS 16949 | Internal | 34 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 64K x 8 | 72MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 8 | 50MHz | MIPS32® M4K™ | 2.5V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | A/D 13x10b |
