| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | ECCN Code | Additional Feature | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC9S08GB60CFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt32cfb-datasheets-0048.pdf | 64-LQFP | MC9S08GB60 | Internal | 56 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| MC9S12C96VFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | 14mm | 14mm | 80 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | YES | QUAD | GULL WING | 2.5V | 0.65mm | MC9S12C96 | 2.75V | 2.35V | S-PQFP-G80 | Internal | 60 | POR, PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | |||||||||||||||||
| MC908QY1ACPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qy4acdwe-datasheets-0671.pdf | 16-DIP (0.300, 7.62mm) | MC908QY1 | 16-DIP | Internal | 13 | LVD, POR, PWM | 128 x 8 | 8MHz | HC08 | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | |||||||||||||||||||||||||||||||||||||||||
| MC9S12C128CPBER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 52-LQFP | MC9S12C128 | Internal | 35 | POR, PWM, WDT | 4K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| MC9S12DB128MPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12dp512cpve-datasheets-2453.pdf | 112-LQFP | MC9S12DB128 | Internal | 91 | PWM, WDT | 8K x 8 | 25MHz | 2.35V~5.25V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | A/D 16x10b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||
| MC9S12E256MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12e256cpve-datasheets-1831.pdf | 80-QFP | MC9S12E256 | 80-QFP (14x14) | Internal | 60 | POR, PWM, WDT | 16K x 8 | 25MHz | HCS12 | 2.35V~2.75V | FLASH | 16-Bit | 256KB 256K x 8 | EBI/EMI, I2C, SCI, SPI | A/D 16x10b; D/A 2x8b | |||||||||||||||||||||||||||||||||||||||
| P80C31SBAA,512 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 80C | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | 4.57mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/nxpusainc-p80c31sbpn112-datasheets-0325.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 44 | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | J BEND | 245 | 5V | 1.27mm | P80C31 | 44 | 5.5V | 2.7V | 30 | Microcontrollers | 3/5V | 50mA | Not Qualified | S-PQCC-J44 | Internal | 32 | POR | 128 x 8 | 16MHz | MICROCONTROLLER | 8 | NO | NO | NO | NO | 16MHz | 16 | 8 | 8051 | 2.7V~5.5V | ROMless | 8-Bit | UART/USART | ||||||||||
| MC9S08RD8PE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | 0°C~70°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-DIP (0.600, 15.24mm) | MC9S08RD8 | 28-PDIP | Internal | 23 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | S08 | 1.8V~3.6V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| MC9S08GT32CFBER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt32cfb-datasheets-0048.pdf | 44-QFP | MC9S08GT32 | Internal | 36 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||
| MC9S12C32MFUE25R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | MC9S12C32 | Internal | 60 | POR, PWM, WDT | 2K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| MC9S12DJ64MPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12a32cfue-datasheets-5962.pdf | 112-LQFP | MC9S12DJ64 | 112-LQFP (20x20) | Internal | 91 | PWM, WDT | 4K x 8 | 25MHz | HCS12 | 2.35V~5.25V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||||||||||||||||||||||||||||||||||
| MC9S12C96CPBER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 52-LQFP | MC9S12C96 | Internal | 35 | POR, PWM, WDT | 4K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| MC908KX8MDWER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~125°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908kx8cdwe-datasheets-3383.pdf | 16-SOIC (0.295, 7.50mm Width) | MC908KX8 | 16-SOIC | Internal | 13 | LVD, POR, PWM | 192 x 8 | 8MHz | HC08 | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | A/D 4x8b | |||||||||||||||||||||||||||||||||||||||
| MC9S12C128MPBER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 52-LQFP | MC9S12C128 | Internal | 35 | POR, PWM, WDT | 4K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| MC9S12C128VFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 48-LQFP | 7mm | 7mm | 48 | 3A001.A.3 | ALSO REQUIRES 5V SUPPLY | YES | QUAD | GULL WING | 2.5V | 0.5mm | MC9S12C128 | 2.75V | 2.35V | Not Qualified | S-PQFP-G48 | Internal | 31 | POR, PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||
| MC9S08GT16CFDER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt32cfb-datasheets-0048.pdf | 48-VFQFN Exposed Pad | MC9S08GT16 | Internal | 39 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||
| MC9S12B128CPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12b64cfue-datasheets-8362.pdf | 112-LQFP | MC9S12B128 | 112-LQFP (20x20) | Internal | 91 | POR, PWM, WDT | 4K x 8 | 25MHz | HCS12 | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | A/D 16x10b | 1K x 8 | ||||||||||||||||||||||||||||||||||||||
| MC9S12DJ64VPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12a32cfue-datasheets-5962.pdf | 112-LQFP | MC9S12DJ64 | Internal | 91 | PWM, WDT | 4K x 8 | 25MHz | 2.35V~5.25V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||||||||||||||||||||||||||||||||||||
| MC9S12GC96MPBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 52-LQFP | MC9S12GC96 | Internal | 35 | POR, PWM, WDT | 4K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 96KB 96K x 8 | EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||
| MC9S12C128VPBER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 52-LQFP | MC9S12C128 | Internal | 35 | POR, PWM, WDT | 4K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| MC908LJ24CPBER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908lj24cfue-datasheets-5467.pdf | 64-LQFP | MC908LJ24 | Internal | 40 | LCD, LVD, POR, PWM | 768 x 8 | 8MHz | 3V~5.5V | FLASH | 8-Bit | 24KB 24K x 8 | I2C, IRSCI, SPI | A/D 6x10b | |||||||||||||||||||||||||||||||||||||||||
| P89C51RC2FA/01,529 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 89C | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 4.57mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89c51rc2ba01512-datasheets-0543.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 44 | 3A991.A.2 | unknown | 8542.31.00.01 | YES | QUAD | J BEND | 5V | 1.27mm | P89C51 | 44 | 5.5V | 4.5V | Not Qualified | S-PQCC-J44 | Internal | 32 | POR, PWM, WDT | 512 x 8 | 33MHz | MICROCONTROLLER | 8 | NO | NO | YES | NO | 33MHz | 16 | 8 | 8051 | 4.5V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | UART/USART | ||||||||||||||
| MC9S08RD32CPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-DIP (0.600, 15.24mm) | unknown | 8542.31.00.01 | MC9S08RD32 | Internal | 23 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||
| P80C552IFA/08,512 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 80C | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 4.57mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-p80c552iba08512-datasheets-0447.pdf | 68-LCC (J-Lead) | 24.2316mm | 24.2316mm | 68 | 8542.31.00.01 | e3 | TIN | YES | QUAD | J BEND | 245 | 5V | 1.27mm | P80C552 | 68 | 5.5V | 4.5V | 30 | Microcontrollers | 5V | 55mA | Not Qualified | S-PQCC-J68 | Internal | 40 | POR, PWM, WDT | 256 x 8 | 24MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 24MHz | 16 | 8 | 8051 | 4.5V~5.5V | ROMless | 8-Bit | EBI/EMI, I2C, UART/USART | A/D 8x10b | |||||||||
| MC9S08RD8CDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-SOIC (0.295, 7.50mm Width) | unknown | 8542.31.00.01 | MC9S08RD8 | Internal | 23 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||
| MC9S08RD60PE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-DIP (0.600, 15.24mm) | unknown | 8542.31.00.01 | MC9S08RD60 | Internal | 23 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||
| MC908QT2ACFQE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qy4acdwe-datasheets-0671.pdf | 8-VDFN Exposed Pad | MC908QT2 | 8-DFN-EP (4x4) | Internal | 5 | LVD, POR, PWM | 128 x 8 | 8MHz | HC08 | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | A/D 6x10b | ||||||||||||||||||||||||||||||||||||||||
| MC9S08RD32PE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-DIP (0.600, 15.24mm) | unknown | 8542.31.00.01 | MC9S08RD32 | Internal | 23 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||
| MC908KX8VDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908kx8cdwe-datasheets-3383.pdf | 16-SOIC (0.295, 7.50mm Width) | MC908KX8 | 16-SOIC | Internal | 13 | LVD, POR, PWM | 192 x 8 | 8MHz | HC08 | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | A/D 4x8b | |||||||||||||||||||||||||||||||||||||||
| MC9S08RE16FDE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 48-VFQFN Exposed Pad | unknown | 8542.31.00.01 | MC9S08RE16 | Internal | 39 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | SCI |
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