| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | Additional Feature | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | CPU Family | ROM (words) | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC908GZ48VFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908gz60cfue-datasheets-6882.pdf | 48-LQFP | MC908GZ48 | Internal | 37 | LVD, POR, PWM | 1.5K x 8 | 8MHz | 3V~5.5V | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, SCI, SPI | A/D 24x10b | ||||||||||||||||||||||||||||||||||||||||||||
| MC9S08RE16FDER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 48-VFQFN Exposed Pad | MC9S08RE16 | 48-QFN-EP (7x7) | Internal | 39 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | S08 | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||||
| MC9S08RE16CFDER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 48-VFQFN Exposed Pad | MC9S08RE16 | 48-QFN-EP (7x7) | Internal | 39 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | S08 | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||||
| MC9S08RD32CPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-DIP (0.600, 15.24mm) | unknown | 8542.31.00.01 | MC9S08RD32 | Internal | 23 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| P80C552IFA/08,512 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 80C | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 4.57mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-p80c552iba08512-datasheets-0447.pdf | 68-LCC (J-Lead) | 24.2316mm | 24.2316mm | 68 | 8542.31.00.01 | e3 | TIN | YES | QUAD | J BEND | 245 | 5V | 1.27mm | P80C552 | 68 | 5.5V | 4.5V | 30 | Microcontrollers | 5V | 55mA | Not Qualified | S-PQCC-J68 | Internal | 40 | POR, PWM, WDT | 256 x 8 | 24MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 24MHz | 16 | 8 | 8051 | 4.5V~5.5V | ROMless | 8-Bit | EBI/EMI, I2C, UART/USART | A/D 8x10b | |||||||||||
| MC9S08RD8CDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-SOIC (0.295, 7.50mm Width) | unknown | 8542.31.00.01 | MC9S08RD8 | Internal | 23 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| MC9S08RD60PE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-DIP (0.600, 15.24mm) | unknown | 8542.31.00.01 | MC9S08RD60 | Internal | 23 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| MC908QT2ACFQE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qy4acdwe-datasheets-0671.pdf | 8-VDFN Exposed Pad | MC908QT2 | 8-DFN-EP (4x4) | Internal | 5 | LVD, POR, PWM | 128 x 8 | 8MHz | HC08 | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | A/D 6x10b | ||||||||||||||||||||||||||||||||||||||||||
| MC9S08RD32PE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-DIP (0.600, 15.24mm) | unknown | 8542.31.00.01 | MC9S08RD32 | Internal | 23 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| MC908KX8VDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908kx8cdwe-datasheets-3383.pdf | 16-SOIC (0.295, 7.50mm Width) | MC908KX8 | 16-SOIC | Internal | 13 | LVD, POR, PWM | 192 x 8 | 8MHz | HC08 | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | A/D 4x8b | |||||||||||||||||||||||||||||||||||||||||
| MC9S08RE16FDE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 48-VFQFN Exposed Pad | unknown | 8542.31.00.01 | MC9S08RE16 | Internal | 39 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| MC908QC16CDZE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qc16mdse-datasheets-0835.pdf | 28-SOIC (0.295, 7.50mm Width) | unknown | 8542.31.00.01 | MC908QC16 | Internal | 24 | LVD, POR, PWM | 512 x 8 | 8MHz | MICROCONTROLLER | 3V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | SCI, SPI | A/D 10x10b | |||||||||||||||||||||||||||||||||||||||
| MC9S08RE32CFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 44-LQFP | unknown | 8542.31.00.01 | MC9S08RE32 | Internal | 39 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| MC9S08RD60CPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-DIP (0.600, 15.24mm) | unknown | 8542.31.00.01 | MC9S08RD60 | Internal | 23 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| MC68HC908QT2VPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc908qy4cdte-datasheets-4172.pdf | 8-DIP (0.300, 7.62mm) | MC68HC908 | Internal | 5 | LVD, POR, PWM | 128 x 8 | 8MHz | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | A/D 4x8b | ||||||||||||||||||||||||||||||||||||||||||||
| MC9S08GT16CFBER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt32cfb-datasheets-0048.pdf | 44-QFP | MC9S08GT16 | Internal | 36 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||||
| MC56F8357VVFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xxx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | 160-BGA | MC56F8357 | External | 76 | POR, PWM, Temp Sensor, WDT | 10K x 16 | 60MHz | 56800E | 2.25V~3.6V | FLASH | 16-Bit | 256KB 128K x 16 | CANbus, EBI/EMI, SCI, SPI | A/D 16x12b | |||||||||||||||||||||||||||||||||||||||||||
| MC68F375BGMZP33 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68f375bgmvr33r-datasheets-0697.pdf | 217-BBGA | 217 | 16 Weeks | 3A991.A.2 | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 220 | 3.3V | MC68F375 | 3.6V | 3V | 30 | S-PBGA-B217 | Internal | 48 | POR, PWM, WDT | 10K x 8 | 33MHz | MICROCONTROLLER | 32 | YES | NO | YES | YES | 33.6MHz | 24 | 16 | CPU32 | 3V~5.25V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, SPI, UART/USART | A/D 16x10b | |||||||||||||||||
| MC9S08RD16CPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-DIP (0.600, 15.24mm) | unknown | 8542.31.00.01 | MC9S08RD16 | Internal | 23 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| MC908QC8MDSE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~125°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2006 | /files/nxpusainc-mc908qc16mdse-datasheets-0835.pdf | 20-TSSOP (0.173, 4.40mm Width) | MC908QC8 | Internal | 16 | LVD, POR, PWM | 384 x 8 | 8MHz | 3V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI, SPI | A/D 10x10b | |||||||||||||||||||||||||||||||||||||||||||
| LPC2106BBD48,151 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2100 | Surface Mount | 0°C~70°C TA | Tray | 1 (Unlimited) | CMOS | 1.6mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2106fbd480115-datasheets-5000.pdf | 48-LQFP | 7mm | 7mm | 48 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | e3/e4 | TIN/SILVER | YES | QUAD | GULL WING | 1.8V | 0.5mm | LPC2106 | 48 | 1.95V | 1.65V | Microcontrollers | 1.83.3V | Not Qualified | S-PQFP-G48 | Internal | 32 | POR, PWM, WDT | 64K x 8 | 60MHz | MICROCONTROLLER, RISC | 32 | NO | NO | YES | NO | 131072 | 25MHz | ARM7® | 1.65V~3.6V | FLASH | 16/32-Bit | 128KB 128K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | ||||||||||||||
| MC908QT2ACPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~85°C TA | Tube | Not Applicable | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qy4acdwe-datasheets-0671.pdf | 8-DIP (0.300, 7.62mm) | MC908QT2 | 8-PDIP | Internal | 5 | LVD, POR, PWM | 128 x 8 | 8MHz | HC08 | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | A/D 6x10b | ||||||||||||||||||||||||||||||||||||||||||
| MC908QC8CDXE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qc16mdse-datasheets-0835.pdf | 16-SOIC (0.295, 7.50mm Width) | 3A991.A.2 | 8542.31.00.01 | NOT SPECIFIED | MC908QC8 | NOT SPECIFIED | Internal | 12 | LVD, POR, PWM | 384 x 8 | 8MHz | MICROCONTROLLER | 3V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI, SPI | A/D 10x10b | |||||||||||||||||||||||||||||||||||||
| PXAS30KBA,512 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XA | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | 4.57mm | ROHS3 Compliant | 2000 | https://pdf.utmel.com/r/datasheets/nxpusainc-pxas30kbbe557-datasheets-0614.pdf | 68-LCC (J-Lead) | 24.2316mm | 24.2316mm | 68 | CAN ALSO OPERATE AT 2.7V MINIMUM SUPPLY | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | J BEND | 245 | 5V | 1.27mm | PXAS3 | 68 | 5.5V | 4.5V | 30 | Microcontrollers | 3/5V | 80mA | Not Qualified | S-PQCC-J68 | External | 50 | PWM, WDT | 1K x 8 | 30MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | XA | 30MHz | 24 | 16 | 2.7V~5.5V | ROMless | 16-Bit | EBI/EMI, I2C, UART/USART | A/D 8x8b | ||||||||||
| MC908QY8CDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 2.65mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qb8cdwe-datasheets-8087.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.3mm | 7.5mm | 16 | 3A991.A.2 | OPERATES AT 3V SUPPLY AT 4 MHZ | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 1.27mm | MC908QY8 | 5.5V | 4.5V | 40 | Not Qualified | R-PDSO-G16 | External | 13 | LVD, POR, PWM | 256 x 8 | 8MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 32MHz | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | A/D 4x10b | ||||||||||||||||
| MC9S08RE16CFDE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1mm | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | unknown | 8542.31.00.01 | YES | QUAD | NO LEAD | 260 | 3V | 0.5mm | MC9S08RE16 | 3.6V | 1.8V | 40 | Not Qualified | S-XQCC-N48 | Internal | 39 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | MICROCONTROLLER | 8 | NO | NO | YES | NO | 16MHz | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | SCI | |||||||||||||||||||
| MC9S08GT60CFBER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt32cfb-datasheets-0048.pdf | 44-QFP | MC9S08GT60 | Internal | 36 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||||
| MC9S08RD32DWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-SOIC (0.295, 7.50mm Width) | unknown | 8542.31.00.01 | MC9S08RD32 | Internal | 23 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||
| MC908QY8CPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qb8cdwe-datasheets-8087.pdf | 16-DIP (0.300, 7.62mm) | MC908QY8 | External | 13 | LVD, POR, PWM | 256 x 8 | 8MHz | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | A/D 4x10b | |||||||||||||||||||||||||||||||||||||||||||||
| MC908QC8MDRE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~125°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qc16mdse-datasheets-0835.pdf | 28-TSSOP (0.173, 4.40mm Width) | MC908QC8 | Internal | 24 | LVD, POR, PWM | 384 x 8 | 8MHz | 3V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI, SPI | A/D 10x10b |
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