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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | HTS Code | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Number of I/O | Core Architecture | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | CPU Family | Number of UART Channels | Boundary Scan | Low Power Mode | Format | Integrated Cache | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Number of Cores | USB | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA |
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| MPC8241LZQ200D | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.56mm | Non-RoHS Compliant | 1998 | /files/nxpusainc-mpc8241lzq200d-datasheets-1310.pdf | 357-BBGA | 25mm | 357 | 3A991.A.2 | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 260 | 1.8V | 1.27mm | MPC8241 | 1.9V | 1.7V | 40 | S-PBGA-B357 | 200MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 66MHz | 32 | 64 | PowerPC 603e | 3.3V | 1 Core 32-Bit | No | SDRAM | I2C, I2O, PCI, UART | ||||||||||||||||||||||||||||||||||||||||
| MPC870CZT66 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | -40°C~100°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | /files/rochesterelectronicsllc-mpc870czt66-datasheets-1228.pdf | 256-BBGA | 256-PBGA (23x23) | 66MHz | USB 2.0 (1) | MPC8xx | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | I2C, PCMCIA, SPI, TDM, UART | Communications; CPM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S1AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6s4avm08ac-datasheets-0412.pdf | 624-LFBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 1.5V | 1.275V | 40 | S-PBGA-B624 | 800MHz | MICROPROCESSOR, RISC | 64 | YES | YES | FIXED POINT | YES | 24MHz | 16 | 32 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | |||||||||||||||||||||||||||||||||||
| MPC8313VRAFFB | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | 0°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/rochesterelectronicsllc-mpc8313vraffb-datasheets-1229.pdf&product=rochesterelectronicsllc-mpc8313vraffb-4781091 | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | 333MHz | USB 2.0 + PHY (1) | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | DUART, HSSI, I2C, PCI, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6U4AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6DL | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6s4avm08ac-datasheets-0412.pdf | 624-LFBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 1.5V | 1.275V | 40 | S-PBGA-B624 | 800MHz | MICROPROCESSOR, RISC | 64 | YES | YES | FIXED POINT | YES | 24MHz | 16 | 64 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | |||||||||||||||||||||||||||||||||||
| MPC8280ZUUPEA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 4 (72 Hours) | CMOS | 1.65mm | Non-RoHS Compliant | 1994 | /files/nxpusainc-mpc8270zuupea-datasheets-9856.pdf | 480-LBGA Exposed Pad | 37.5mm | 480 | 18 Weeks | 3A991.A.2 | 8542.31.00.01 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | YES | BOTTOM | BALL | 260 | 1.5V | 1.27mm | MPC8280 | 1.6V | 1.45V | 40 | Other uPs/uCs/Peripheral ICs | 1.53.3V | S-PBGA-B480 | 450MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 32 | 64 | USB 2.0 (1) | PowerPC G2_LE | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | |||||||||||||||||||||||||||||||||||
| MPC852TVR100A | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tray | 3 (168 Hours) | CMOS | 2.54mm | Non-RoHS Compliant | 1999 | /files/nxpusainc-mpc852tvr100a-datasheets-1187.pdf | 256-BBGA | 23mm | 256 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1.8V | 1.27mm | MPC852 | 1.9V | 1.7V | 30 | Other uPs/uCs/Peripheral ICs | 1.83.3V | S-PBGA-B256 | 100MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 66MHz | 32 | 32 | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | ||||||||||||||||||||||||||||||||||||
| MPC885ZP80 | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | https://pdf.utmel.com/r/datasheets/rochesterelectronicsllc-mpc885zp80-datasheets-1192.pdf | 357-BBGA | 357-PBGA (25x25) | 80MHz | USB 2.0 (1) | MPC8xx | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM1808BZWTD4 | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~90°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 361-LFBGA | 361-NFBGA (16x16) | 456MHz | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | SATA 3Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6DP6AVT8AA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6DP | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.16mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6dp5eym1aa-datasheets-9404.pdf | 624-FBGA, FCBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.4V | 0.8mm | 1.5V | 1.225V | NOT SPECIFIED | S-PBGA-B624 | 852MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 26 | 64 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||
| MVF60NN151CMK50 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF6xx | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | /files/nxpusainc-mvf51ns151cmk50-datasheets-0241.pdf&product=nxpusainc-mvf60nn151cmk50-4781066 | 364-LFBGA | 17mm | 364 | 15 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.23V | 0.8mm | MVF60NN151 | 1.26V | 1.16V | 40 | Microcontrollers | 3.3V | 850mA | Not Qualified | S-PBGA-B364 | 131 | 500MHz, 167MHz | MICROCONTROLLER, RISC | 16 | YES | YES | NO | YES | FLASH | 16 | 16 | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | DCU, GPU, LCD, VideoADC, VIU | |||||||||||||||||||||||||||||||
| MC68EC020AA16 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M680x0 | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/rochesterelectronicsllc-mc68ec020aa16-datasheets-1205.pdf | 100-BQFP | 100-QFP (14x20) | 16MHz | 68020 | 5.0V | 1 Core 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX535DVV1C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX53 | -20°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2011 | 529-FBGA | 15 Weeks | 1GHz | USB 2.0 (2), USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8343CZQADDB | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | -40°C~105°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | /files/rochesterelectronicsllc-mpc8343czqaddb-datasheets-1206.pdf | 620-BBGA Exposed Pad | 620-PBGA (29x29) | 266MHz | USB 2.0 + PHY (2) | PowerPC e300 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | DUART, I2C, PCI, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SVF512R3K1CMK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF5xxR | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.5mm | ROHS3 Compliant | 2014 | 364-LFBGA | 17mm | 364 | 15 Weeks | 5A002.A.1 | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | SVF512 | 3.6V | 3V | NOT SPECIFIED | S-PBGA-B364 | 400MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | 16 | 16 | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | |||||||||||||||||||||||||||||||||||||||
| OMAP3530DCBCA | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-35xx | -40°C~105°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/rochesterelectronicsllc-omap3530dcbca-datasheets-1207.pdf | 515-VFBGA, FCBGA | 515-POP-FCBGA (14x14) | 720MHz | USB 1.x (3), USB 2.0 (1) | ARM® Cortex®-A8 | 1.8V 3.0V | 1 Core 32-Bit | Yes | LPDDR | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8308CVMAFDA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | 473-LFBGA | 473 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | MPC8308 | 40 | S-PBGA-B473 | 333MHz | MICROPROCESSOR, RISC | USB 2.0 (1) | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MIMX8MQ5DVAJZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX8MQ | 0°C~95°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mimx8md6dvajzab-datasheets-0694.pdf | 621-FBGA, FCBGA | 15 Weeks | 1.5GHz | USB 3.0 (2) | ARM® Cortex®-A53 | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8308VMAFDA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | 473-LFBGA | 473 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | MPC8308 | 40 | S-PBGA-B473 | 333MHz | MICROPROCESSOR, RISC | USB 2.0 (1) | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LS1024ASN7ELA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 2.67mm | ROHS3 Compliant | 2014 | /files/nxpusainc-ls1024ase7mla-datasheets-9862.pdf | 625-BFBGA, FCBGA | 21mm | 625 | 12 Weeks | YES | BOTTOM | BALL | 1.1V | 0.8mm | 1.155V | 1.045V | 1200mA | S-PBGA-B625 | 1.2GHz | MULTIFUNCTION PERIPHERAL | YES | 650MHz | 26 | USB 2.0 + PHY (1), USB 3.0 + PHY | ARM® Cortex®-A9 | GbE (3) | 2 Core 32-Bit | DDR3 | Secure Boot, TrustZone® | SATA 3Gbps (2) | |||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S8DVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | 0°C~95°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6s5dvm10ad-datasheets-9762.pdf | 624-LFBGA | 21mm | 624 | 15 Weeks | YES | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | MCIMX6 | 1.5V | 1.35V | NOT SPECIFIED | S-PBGA-B624 | 1.0GHz | MICROPROCESSOR, RISC | YES | YES | FIXED POINT | YES | 26 | 32 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | |||||||||||||||||||||||||||||||||||||||||
| MVF60NS151CMK40 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF6xx | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | /files/nxpusainc-mvf51ns151cmk50-datasheets-0241.pdf&product=nxpusainc-mvf60ns151cmk40-4781073 | 364-LFBGA | 17mm | 364 | 15 Weeks | 5A002.A.1 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.23V | 0.8mm | MVF60NS151 | 1.26V | 1.16V | 40 | Microcontrollers | 3.3V | 850mA | Not Qualified | S-PBGA-B364 | 131 | 400MHz, 167MHz | MICROCONTROLLER, RISC | 16 | YES | YES | NO | YES | FLASH | 16 | 16 | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ||||||||||||||||||||||||||||||
| LS1021ASN7HNB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | 0°C~105°C | Tray | 3 (168 Hours) | CMOS | 2.07mm | ROHS3 Compliant | 2002 | /files/nxpusainc-ls1021axe7kqb-datasheets-9537.pdf | 525-FBGA, FCBGA | 19mm | 525 | 18 Weeks | 3A991.A.1 | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | 1.03V | 0.97V | 40 | S-PBGA-B525 | 800MHz | MICROPROCESSOR CIRCUIT | USB 3.0 (1) + PHY | ARM® Cortex®-A7 | GbE (3) | 2 Core 32-Bit | DDR3L, DDR4 | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S6AVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | /files/nxpusainc-mcimx6u6avm10ac-datasheets-9968.pdf | 624-LFBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 1.5V | 1.4V | NOT SPECIFIED | S-PBGA-B624 | 1GHz | MICROPROCESSOR, RISC | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | |||||||||||||||||||||||||||||||||||||||||||||||
| MPC8309VMAFDCA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.61mm | ROHS3 Compliant | 2002 | 489-LFBGA | 19mm | 489 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | MPC8309 | 1.05V | 0.95V | 40 | Microprocessors | 1V | S-PBGA-B489 | 333MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 66.67MHz | USB 2.0 (1) | PowerPC e300c3 | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM | Communications; QUICC Engine | |||||||||||||||||||||||||||||||||||||
| AT91SAM9XE256-QU | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAM9XE | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/rochesterelectronicsllc-at91sam9xe256qu-datasheets-1062.pdf | 208-BFQFP | 208-PQFP (28x28) | 180MHz | USB 2.0 (3) | ARM926EJ-S | 1.8V 2.5V 3.3V | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NG80960JD3V66 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i960 | Surface Mount | 0°C~100°C TC | Tray | 4 (72 Hours) | CMOS | 66MHz | Non-RoHS Compliant | 2002 | /files/intel-ng80960jf3v25-datasheets-0089.pdf | 132-QFP | 3.3V | 132 | 3.45V | 3.15V | 132 | 3A991.A.2 | 8542.31.00.01 | 3V | QUAD | GULL WING | 3.3V | 132 | 1kB | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 66 μs | 32 | 32 | 1 Core 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||
| AM5K2E04XABDA4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~100°C TC | Tray | 4 (72 Hours) | CMOS | 1.4GHz | 3.55mm | ROHS3 Compliant | /files/texasinstruments-am5k2e04xabda4-datasheets-1019.pdf | 1089-BFBGA, FCBGA | 27mm | 27mm | Lead Free | 20 Weeks | 1089 | ACTIVE (Last Updated: 3 days ago) | yes | 2.98mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 1V | 0.8mm | AM5K2E04 | 1.05V | 0.95V | ARM | MICROPROCESSOR, RISC | 2 | YES | YES | FLOATING POINT | YES | 4 | USB 3.0 (2) | ARM® Cortex®-A15 | 1.35V 1.5V 1.8V 3.3V | 1GBE (8), 10GBE (2) | 4 Core 32-Bit | No | DDR3, SRAM | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | ||||||||||||||||||||||||||||||||||||||
| MVF30NS151CKU26 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF3xx | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | /files/nxpusainc-mvf51ns151cmk50-datasheets-0241.pdf&product=nxpusainc-mvf30ns151cku26-4781063 | 176-LQFP Exposed Pad | 176 | 15 Weeks | 5A002.A.1 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 1.23V | 0.5mm | MVF30NS151 | 1.26V | 1.16V | 40 | Microcontrollers | 3.3V | 850mA | Not Qualified | S-PQFP-G176 | 111 | 266MHz | MICROCONTROLLER, RISC | 16 | YES | YES | NO | YES | FLASH | CORTEX-A5 | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ||||||||||||||||||||||||||||||||
| MPC8308CVMAGD | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/rochesterelectronicsllc-mpc8308cvmagd-datasheets-1027.pdf | 473-LFBGA | 473-MAPBGA (19x19) | 400MHz | USB 2.0 (1) | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | DUART, HSSI, I2C, MMC/SD/SDIO, SPI |
