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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Capacitance | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | HTS Code | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Oscillator Type | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | Number of Timers/Counters | Number of Programmable I/O | CPU Family | Number of UART Channels | RAM (words) | Bus Compatibility | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of External Interrupts | On Chip Data RAM Width | Number of DMA Channels | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Number of Cores | USB | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA |
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| AM3517AZCNA | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 600MHz | ROHS3 Compliant | /files/texasinstruments-am3517azcna-datasheets-6698.pdf | 491-LFBGA | 17mm | 1.3mm | 17mm | 1.2V | Lead Free | 491 | 6 Weeks | No SVHC | 1.248V | 1.152V | 491 | DDR2 | ACTIVE (Last Updated: 6 days ago) | yes | 900μm | Copper, Silver, Tin | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.248V | YES | BOTTOM | BALL | 260 | 1.2V | 0.65mm | AM3517 | 491 | Microprocessors | 1GB | ARM | 64kB | 16b | MICROPROCESSOR, RISC | 16 | 12 | 4 | 65536 | YES | YES | FLOATING POINT | YES | 1 | USB 2.0 (3), USB 2.0 + PHY (1) | ARM® Cortex®-A8 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | LCD | ||||||||||||||||||||||||||||||||||||||||||||
| SVF522R3K1CMK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF5xxR | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.5mm | ROHS3 Compliant | 2014 | 364-LFBGA | 17mm | 364 | 15 Weeks | 5A002.A.1 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | SVF522 | 3.6V | 3V | 40 | S-PBGA-B364 | 400MHz, 133MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | 16 | 16 | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3505AZER | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 600MHz | ROHS3 Compliant | 484-BBGA Exposed Pad | 23mm | 2.48mm | 23mm | 1.2V | Lead Free | 484 | 6 Weeks | 484 | I2C, UART | ACTIVE (Last Updated: 5 days ago) | yes | 1.78mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.248V | YES | BOTTOM | BALL | 260 | 1.2V | AM3505 | 484 | Microprocessors | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 16 | 4 | 65536 | YES | YES | FLOATING POINT | YES | 1 | USB 2.0 (3), USB 2.0 + PHY (1) | ARM® Cortex®-A8 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8321ECVRAFDCA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.55mm | ROHS3 Compliant | 2004 | 516-BBGA | 27mm | 516 | 12 Weeks | 5A002.A.1 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | 1V | 1mm | 1.05V | 0.95V | 40 | S-PBGA-B516 | 333MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 66.67MHz | USB 2.0 (1) | PowerPC e300c2 | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| KU80960CA16 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i960 | Surface Mount | 0°C~100°C TC | Tray | 5 (48 Hours) | MOS | 16MHz | 4.57mm | Non-RoHS Compliant | 1994 | /files/intel-ku80960ca16-datasheets-0409.pdf | 196-QFP | 34.29mm | 5V | 196 | 5.5V | 4.5V | 196 | 3A991.A.2 | 8542.31.00.01 | 5V | QUAD | GULL WING | 225 | 5V | 0.635mm | Microprocessors | 5V | 550mA | 1kB | MICROPROCESSOR, RISC | 32 | 1000 | NO | NO | FIXED POINT | NO | 9 | 8 | 4 | 16 μs | 32 | 32 | 5.0V | 1 Core 32-Bit | No | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S4AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6s4avm08ac-datasheets-0412.pdf | 624-LFBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 1.5V | 1.275V | NOT SPECIFIED | S-PBGA-B624 | 800MHz | MICROPROCESSOR, RISC | 64 | YES | YES | FIXED POINT | YES | 24MHz | 16 | 32 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NG80960JD3V50 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i960 | Through Hole | 0°C~100°C TC | Tray | 3 (168 Hours) | 50MHz | Non-RoHS Compliant | 2002 | /files/intel-ng80960jf3v25-datasheets-0089.pdf | 132-QFP | 132 | 3V | 132-PQFP (24.13x24.13) | 1kB | 50MHz | 50 μs | i960 | 3.3V | 1 Core 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LS1012AXE7KKB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | /files/nxpusainc-ls1012ase7hkb-datasheets-9707.pdf | 211-VFLGA | 24 Weeks | 1.0GHz | USB 2.0 (1), USB 3.0 + PHY | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | Secure Boot, TrustZone® | SATA 6Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6X1CVO08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6SX | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.53mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6q7cvt08ae-datasheets-9281.pdf | 400-LFBGA | 17mm | 400 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 0.8mm | 1.5V | 1.275V | 40 | S-PBGA-B400 | 200MHz, 800MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | 15 | 32 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4378BZDNA80 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | Surface Mount | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | ROHS3 Compliant | 491-LFBGA | 17mm | 1.3mm | 17mm | Lead Free | 491 | 6 Weeks | 491 | CAN, I2C, SPI, UART | ACTIVE (Last Updated: 1 day ago) | yes | 900μm | 5A992.C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.26V | AM4378 | 491 | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FLOATING POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A9 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DDR3L | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | Crypto Accelerator | TSC, WXGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LS1021ASN7KQB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | 0°C~105°C | Tray | 3 (168 Hours) | CMOS | 2.07mm | ROHS3 Compliant | 2002 | /files/nxpusainc-ls1021axe7kqb-datasheets-9537.pdf | 525-FBGA, FCBGA | 19mm | 525 | 18 Weeks | 3A991.A.1 | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | 1.03V | 0.97V | 40 | S-PBGA-B525 | 1.0GHz | MICROPROCESSOR CIRCUIT | USB 3.0 (1) + PHY | ARM® Cortex®-A7 | GbE (3) | 2 Core 32-Bit | DDR3L, DDR4 | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM5706BCBDD | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | 0°C~90°C TJ | 3 (168 Hours) | CMOS | 1.298mm | ROHS3 Compliant | 538-LFBGA, FCBGA | 17mm | 538 | 16 Weeks | yes | 5A992C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 1.15V | 0.65mm | AM5706 | 1.2V | 1.1V | S-PBGA-B538 | 533MHz | MICROPROCESSOR, RISC | YES | YES | FIXED POINT | YES | 32MHz | 16 | 32 | USB 2.0 (2), USB 3.0 (2) | ARM® Cortex®-A15 | 1.35V 1.5V 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | DDR3, DDR3L | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | ARM® Cortex®-M4, C66x | HDMI, Video | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX7D3EVK10SD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX7D | -20°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 1.1mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mcimx7d3evk10sd-datasheets-0350.pdf | 488-TFBGA | 12mm | 488 | 16 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 1.1V | 0.4mm | 1.25V | 1.045V | 40 | S-PBGA-B488 | 1.0GHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 16 | 32 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OMAPL138EZCED4E | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-L1x | -40°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 456MHz | ROHS3 Compliant | /files/texasinstruments-omapl138ezced4e-datasheets-0355.pdf | 361-LFBGA | 3pF | 13mm | 1.3mm | 13mm | Lead Free | 361 | 6 Weeks | 361 | ACTIVE (Last Updated: 3 days ago) | yes | 890μm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.3V | 0.65mm | OMAPL138 | 361 | ARM | 456 MHz | MICROPROCESSOR CIRCUIT | 3 | I2C; SPI; UART; USB | 1 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SVF311R3K2CKU2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF3xxR | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | /files/nxpusainc-svf311r3k2cku2-datasheets-0263.pdf&product=nxpusainc-svf311r3k2cku2-4780938 | 176-LQFP Exposed Pad | 24mm | 176 | 15 Weeks | yes | YES | QUAD | GULL WING | 260 | 1.23V | 0.5mm | 1.26V | 1.16V | 40 | S-PQFP-G176 | 266MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Z8S18033VEG | Zilog |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Z180 | Surface Mount | -40°C~100°C TA | Tube | 3 (168 Hours) | CMOS | 33MHz | 4.57mm | ROHS3 Compliant | 2000 | 68-LCC (J-Lead) | 5V | Lead Free | 68 | 13 Weeks | 68 | SCI | yes | EAR99 | e3 | MATTE TIN | 5V | QUAD | J BEND | 260 | 5V | 68 | 40 | ROMless | 8b | MICROPROCESSOR | 8 | 2 | NO | YES | FIXED POINT | NO | 20 | Z8S180 | 5.0V | 1 Core 8-Bit | No | DRAM | ASCI, CSIO, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4377BZDND80 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | Surface Mount | -40°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | ROHS3 Compliant | 491-LFBGA | 17mm | 1.3mm | 17mm | Lead Free | 491 | 6 Weeks | 491 | CAN, I2C, SPI, UART | ACTIVE (Last Updated: 3 days ago) | yes | 900μm | 5A992.C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.26V | AM4377 | 491 | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FLOATING POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A9 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | Crypto Accelerator | TSC, WXGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NG80960JD3V40 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i960 | Surface Mount | 0°C~100°C TC | Tray | 4 (72 Hours) | CMOS | 40MHz | Non-RoHS Compliant | 2002 | /files/intel-ng80960jf3v25-datasheets-0089.pdf | 132-QFP | 132 | 8542.31.00.01 | 3V | QUAD | GULL WING | 3.3V | 132 | S-PQFP-G132 | 1kB | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 40 μs | 32 | 32 | 3.3V | 1 Core 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX7S5EVM08SD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX7S | -20°C~105°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 541-LFBGA | 16 Weeks | 8542.31.00.01 | 260 | 40 | 800MHz | MICROPROCESSOR, RISC | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MVF50NN151CMK40 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF5xx | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | /files/nxpusainc-mvf51ns151cmk50-datasheets-0241.pdf&product=nxpusainc-mvf50nn151cmk40-4780943 | 364-LFBGA | 17mm | 364 | 15 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.23V | 0.8mm | MVF50NN151 | 1.26V | 1.16V | 40 | Microcontrollers | 3.3V | 850mA | Not Qualified | S-PBGA-B364 | 131 | 400MHz | MICROCONTROLLER, RISC | 16 | YES | YES | NO | YES | FLASH | CORTEX-A5 | 16 | 16 | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | DCU, GPU, LCD, VideoADC, VIU | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NG80960JS25 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i960 | Surface Mount | 0°C~100°C TC | Tray | 4 (72 Hours) | CMOS | 25MHz | Non-RoHS Compliant | 2002 | /files/intel-ng80960jf3v25-datasheets-0089.pdf&product=intel-ng80960js25-4780944 | 132-BQFP Bumpered | 3.3V | 132 | 3.45V | 3.15V | 132 | 3V | QUAD | GULL WING | 3.3V | 0.635mm | 132 | Microprocessors | 3.33.3/5V | 190mA | 1kB | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 25 μs | 32 | 32 | 1 Core 32-Bit | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NG80960JA3V25 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i960 | Surface Mount | 0°C~100°C TC | Tray | 4 (72 Hours) | CMOS | 25MHz | Non-RoHS Compliant | 2002 | /files/intel-ng80960jf3v25-datasheets-0089.pdf | 132-QFP | 3.3V | 132 | 3.45V | 3.15V | 132 | 8542.31.00.01 | 3V | QUAD | GULL WING | 3.3V | 132 | 1kB | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 25 μs | 32 | 32 | 1 Core 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SVF311R3K1CKU2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF3xxR | -40°C~85°C TA | Bulk | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2014 | 176-LQFP Exposed Pad | 24mm | 176 | 15 Weeks | 5A002.A.1 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | SVF311 | 3.6V | 3V | 40 | S-PQFP-G176 | 266MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM5726BABCXEA | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | /files/texasinstruments-am5726babcxa-datasheets-0173.pdf | 760-BFBGA, FCBGA | 23mm | 2.96mm | 23mm | Lead Free | 760 | 6 Weeks | 760 | ACTIVE (Last Updated: 1 week ago) | 2.39mm | 5A992C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 1.15V | 0.8mm | AM5726 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | 10 | YES | YES | FLOATING POINT | NO | 38.4MHz | USB 2.0 (1), USB 3.0 (1) | ARM® Cortex®-A15 | 1.8V 3.3V | GbE | 2 Core 32-Bit | No | DDR3, SRAM | DSP, IPU, VPE | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8309CVMADDCA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.61mm | ROHS3 Compliant | 2002 | 489-LFBGA | 19mm | 489 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | MPC8309 | 1.05V | 0.95V | 40 | Microprocessors | 1V | S-PBGA-B489 | 266MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 66.67MHz | USB 2.0 (1) | PowerPC e300c3 | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | CAN, DUART, I2C, MMC/SD, SPI, TDM | Communications; QUICC Engine | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4376BZDND100 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | Surface Mount | -40°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 1GHz | ROHS3 Compliant | 491-LFBGA | 17mm | 1.3mm | 17mm | Lead Free | 491 | 6 Weeks | 491 | CAN, I2C, SPI, UART | ACTIVE (Last Updated: 1 day ago) | yes | 900μm | 5A992.C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.325V | AM4376 | 491 | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FLOATING POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A9 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | Crypto Accelerator | TSC, WXGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NG80960JS33 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i960 | Surface Mount | 0°C~100°C TC | Tray | 4 (72 Hours) | CMOS | 33MHz | Non-RoHS Compliant | 2002 | /files/intel-ng80960jf3v25-datasheets-0089.pdf | 132-BQFP Bumpered | 132 | 3A991.A.2 | 8542.31.00.01 | 3V | QUAD | GULL WING | 3.3V | 0.635mm | 132 | Microprocessors | 3.33.3/5V | 250mA | S-PQFP-G132 | 1kB | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 33 μs | 32 | 32 | 3.3V | 1 Core 32-Bit | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TG80960JS33 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i960 | Surface Mount | 0°C~100°C TC | Tray | 4 (72 Hours) | CMOS | 33MHz | Non-RoHS Compliant | 2002 | /files/intel-ng80960jf3v25-datasheets-0089.pdf | 132-QFP | 132 | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3V | QUAD | GULL WING | 260 | 3.3V | 0.635mm | 132 | Microprocessors | 3.33.3/5V | 240mA | S-PQFP-G132 | 1kB | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 33 μs | 32 | 32 | 3.3V | 1 Core 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| GD80960JA25 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i960 | Surface Mount | 0°C~100°C TC | Tray | Not Applicable | CMOS | 25MHz | Non-RoHS Compliant | 1998 | /files/intel-ng80960jf3v25-datasheets-0089.pdf | 196-BGA | 3.3V | 196 | 3.45V | 3.15V | 196 | BURST BUS | 3V | BOTTOM | BALL | 3.3V | 196 | Microprocessors | 3.33.3/5V | 260mA | 1kB | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | NO | 25 μs | 32 | 32 | 1 Core 32-Bit | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT91SAM9XE256-CU | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAM9XE | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | 85°C | -40°C | 180MHz | ROHS3 Compliant | 1997 | /files/microchiptechnology-at91sam9xe256cu-datasheets-0148.pdf | 217-LFBGA | 15mm | 3.3V | 3.6V | 1.65V | 217 | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | No | 180MHz | AT91SAM9XE256 | 217-LFBGA (15x15) | 32kB | Internal | 96 | FLASH, ROM | Brown-out Detect/Reset, POR, PWM, WDT | ARM | 32kB | 32b | 180MHz | 6 | 96 | USB 2.0 (3) | ARM926EJ-S | 1.8V 2.5V 3.3V | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | LCD, Touchscreen |
