Products
Manufacturer
RFQ
NEWS
ContactSpecialized ICs(2368)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Density | Pbfree Code | Thickness | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Analog IC - Other Type | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Frequency (Max) | Direction | Access Time | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Memory IC Type | Output Enable | Bus Directional | Retransmit Capability | FWFT Support | Programmable Flags Support | Cycle Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 72V51456L6BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 70°C | 0°C | 166MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51456l6bb-datasheets-9238.pdf | BGA | 17mm | 17mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3.15V | 256 | 2 Mb | 1.76mm | Lead, Tin | 100mA | Dual | 166MHz | Unidirectional | 3.7 ns | 36b | Synchronous | Unidirectional | No | Yes | Yes | |||||||||||||||||||||||||||||||||||||||||||||||
| TSI564A-10GIL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 4 (72 Hours) | 2.66mm | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi564a10gil-datasheets-7674.pdf | FCBGA | 21mm | 21mm | Contains Lead | 399 | 399 | no | 2.3mm | EAR99 | not_compliant | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 3.3V | 399 | INDUSTRIAL | TELECOM CIRCUIT | 85°C | -40°C | NOT SPECIFIED | Not Qualified | ||||||||||||||||||||||||||||||||||||||||||||||||
| TSI564A-10GCL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 4 (72 Hours) | 2.66mm | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi564a10gcl-datasheets-7491.pdf | FCBGA | 21mm | 21mm | Contains Lead | 399 | 399 | no | 2.3mm | EAR99 | not_compliant | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 3.3V | 399 | COMMERCIAL | TELECOM CIRCUIT | 70°C | NOT SPECIFIED | Not Qualified | |||||||||||||||||||||||||||||||||||||||||||||||||
| 72T6360L6BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 70°C | 0°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72t6360l6bb-datasheets-6635.pdf | BGA | 19mm | 19mm | 2.5V | Contains Lead | 2.625V | 2.375V | 324 | 1.76mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1848CRM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 4 (72 Hours) | 70°C | 0°C | 2.83mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848crm-datasheets-6546.pdf | FCBGA | 29mm | 29mm | Contains Lead | 784 | 19 Weeks | 784 | no | 2.75mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1V | 1mm | 784 | COMMERCIAL | TELECOM CIRCUIT | NOT SPECIFIED | Other Telecom ICs | 12.5/3.3V | 7940mA | Not Qualified | |||||||||||||||||||||||||||||||||||||||||
| IDT72P51759L6BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51759l6bb8-datasheets-7405.pdf | BGA | 17mm | 17mm | 256 | 256 | EAR99 | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | 256 | COMMERCIAL | 70°C | 1.9V | 1.7V | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 64KX36 | 36 | 2359296 bit | PARALLEL | 0.1A | 3.7 ns | OTHER FIFO | YES | 6 ns | |||||||||||||||||||||||||||||||||||||
| 72V51456L7-5BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51456l75bb8-datasheets-5024.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.6V | 3.15V | 256 | no | 1.76mm | EAR99 | ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT | Lead, Tin | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | COMMERCIAL | Dual | 133MHz | 64KX36 | 2359296 bit | PARALLEL | 4 ns | YES | Unidirectional | No | Yes | 7.5 ns | ||||||||||||||||||||||||||||||||||
| 80HCPS1848CHMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 85°C | -40°C | 2.83mm | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848chmi-datasheets-3401.pdf | FCBGA | 29mm | 29mm | Contains Lead | 784 | 19 Weeks | 784 | no | 2.75mm | EAR99 | Lead, Tin | not_compliant | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | 784 | INDUSTRIAL | TELECOM CIRCUIT | NOT SPECIFIED | Other Telecom ICs | 12.5/3.3V | 7940mA | Not Qualified | |||||||||||||||||||||||||||||||||||||||||
| IDT72P51759L6BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51759l6bb-datasheets-6281.pdf | BGA | 256 | 256 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | COMMERCIAL | 70°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 64KX36 | 36 | 2359296 bit | 0.1A | 3.7 ns | OTHER FIFO | |||||||||||||||||||||||||||||||||||||||||||||||||
| X90100M8IT1 | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 1.1mm | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/intersil-x90100m8it1-datasheets-0828.pdf | MSOP | 3mm | 3mm | Contains Lead | 8 | 8 | 1 | e0 | TIN LEAD | DUAL | GULL WING | 240 | 5V | 0.65mm | 8 | INDUSTRIAL | -40°C | 5.5V | 2.7V | ANALOG CIRCUIT | NOT SPECIFIED | Other Analog ICs | 5V | Not Qualified | ||||||||||||||||||||||||||||||||||||||||||||||||
| TSI574-10GIL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57410gil-datasheets-5254.pdf | BGA | 21mm | 1.81mm | 21mm | Contains Lead | 399 | 4 Weeks | 399 | no | 1.81mm | EAR99 | No | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.2V | 399 | INDUSTRIAL | TELECOM CIRCUIT | 85°C | -40°C | ||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51759L5BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51759l5bb8-datasheets-5079.pdf | BGA | 17mm | 17mm | 256 | 256 | EAR99 | not_compliant | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | 256 | COMMERCIAL | 70°C | 1.9V | 1.7V | FIFOs | 1.8V | 0.15mA | Not Qualified | 200MHz | 64KX36 | 36 | 2359296 bit | PARALLEL | 0.1A | 3.6 ns | OTHER FIFO | YES | 5 ns | ||||||||||||||||||||||||||||||||||||
| 80HCPS1848CHM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | 2.83mm | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848chm-datasheets-0256.pdf | FCBGA | 29mm | 29mm | Contains Lead | 784 | 19 Weeks | 784 | no | 2.75mm | EAR99 | Lead, Tin | not_compliant | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 225 | 1V | 1mm | 784 | COMMERCIAL | TELECOM CIRCUIT | 70°C | NOT SPECIFIED | Other Telecom ICs | 12.5/3.3V | 7940mA | Not Qualified | ||||||||||||||||||||||||||||||||||||||||||
| TSI574-10GCLV | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57410gclv-datasheets-0194.pdf | BGA | 21mm | 21mm | Lead Free | 399 | 4 Weeks | 399 | yes | 1.81mm | No | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 399 | COMMERCIAL | TELECOM CIRCUIT | 70°C | |||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI574-10GCL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57410gcl-datasheets-9702.pdf | BGA | 21mm | 1.81mm | 21mm | Contains Lead | 399 | 4 Weeks | 399 | no | 1.81mm | not_compliant | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.2V | 399 | COMMERCIAL | TELECOM CIRCUIT | 70°C | NOT SPECIFIED | Not Qualified | ||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1848CBRI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 85°C | -40°C | 3.44mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848cbri-datasheets-7363.pdf | FCBGA | 29mm | 29mm | Contains Lead | 784 | 20 Weeks | 784 | no | 3.5mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | 784 | INDUSTRIAL | TELECOM CIRCUIT | NOT SPECIFIED | Other Telecom ICs | 12.5/3.3V | 7940mA | Not Qualified | ||||||||||||||||||||||||||||||||||||||||||
| IDT72P51759L5BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51759l5bb-datasheets-3895.pdf | BGA | 256 | 256 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | COMMERCIAL | 70°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 200MHz | 64KX36 | 36 | 2359296 bit | 0.1A | 3.6 ns | OTHER FIFO | |||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1848CBR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | 3.44mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848cbr-datasheets-4301.pdf | FCBGA | 29mm | 29mm | Contains Lead | 784 | 20 Weeks | 784 | no | 3.5mm | EAR99 | No | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 1mm | 784 | COMMERCIAL | TELECOM CIRCUIT | 70°C | Other Telecom ICs | 12.5/3.3V | 7940mA | |||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51749L6BBI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ASYNCHRONOUS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51749l6bbi8-datasheets-2755.pdf | BGA | 256 | 256 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | INDUSTRIAL | 85°C | -40°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 32KX36 | 36 | 1179648 bit | 0.1A | 3.7 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1848HMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | 2.83mm | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848hmi-datasheets-3017.pdf | FCBGA | 29mm | 29mm | Contains Lead | 784 | 784 | no | 2.75mm | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 225 | 1mm | 784 | TELECOM CIRCUIT | NOT SPECIFIED | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 72V51256L6BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 166MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51256l6bb8-datasheets-1918.pdf | BGA | 17mm | 17mm | 3.3V | Contains Lead | 7 Weeks | 3.45V | 3.15V | 256 | 2 Mb | 1.76mm | Lead, Tin | 100mA | Dual | 166MHz | Unidirectional | 3.7 ns | 36b | Synchronous | Unidirectional | No | Yes | Yes | ||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1432CRMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1432crmi-datasheets-1250.pdf | FCBGA | 25mm | 2.6mm | 25mm | Contains Lead | 576 | 19 Weeks | 576 | no | 2.6mm | EAR99 | No | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | 576 | INDUSTRIAL | TELECOM CIRCUIT | 85°C | -40°C | |||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51749L6BBI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51749l6bbi-datasheets-1611.pdf | BGA | 256 | 256 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | INDUSTRIAL | 85°C | -40°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 32KX36 | 36 | 1179648 bit | 0.1A | 3.7 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||
| 72T6360L6BBG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72t6360l6bbg-datasheets-9536.pdf | BGA | 19mm | 19mm | 2.5V | Lead Free | 2.625V | 2.375V | 324 | 1.76mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1432CRM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1432crm-datasheets-8371.pdf | FCBGA | 25mm | 2.6mm | 25mm | Contains Lead | 576 | 19 Weeks | 576 | no | 2.6mm | EAR99 | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | 576 | COMMERCIAL | TELECOM CIRCUIT | 70°C | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51749L6BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51749l6bb8-datasheets-0498.pdf | BGA | 17mm | 17mm | 256 | 256 | EAR99 | not_compliant | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | 256 | COMMERCIAL | 70°C | 1.9V | 1.7V | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 32KX36 | 36 | 1179648 bit | PARALLEL | 0.1A | 3.7 ns | OTHER FIFO | YES | 6 ns | ||||||||||||||||||||||||||||||||||||
| 72V51256L7-5BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 133MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51256l75bb-datasheets-6319.pdf | BGA | 17mm | 17mm | 3.3V | Contains Lead | 7 Weeks | 3.45V | 3.15V | 256 | 2 Mb | 1.76mm | Lead, Tin | 100mA | Dual | 133MHz | 4 ns | 36b | Synchronous | Unidirectional | No | Yes | ||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51749L6BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51749l6bb-datasheets-9398.pdf | BGA | 256 | 256 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | COMMERCIAL | 70°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 32KX36 | 36 | 1179648 bit | 0.1A | 3.7 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1848CBLGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848cblgi-datasheets-5233.pdf | 29mm | 29mm | Lead Free | 20 Weeks | 784 | yes | 3.5mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 245 | 784 | NOT SPECIFIED | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51549L5BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51549l5bb8-datasheets-9293.pdf | BGA | 17mm | 17mm | 256 | 256 | EAR99 | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | 256 | COMMERCIAL | 70°C | 1.9V | 1.7V | FIFOs | 1.8V | 0.15mA | Not Qualified | 200MHz | 32KX36 | 36 | 1179648 bit | PARALLEL | 0.1A | 3.6 ns | OTHER FIFO | YES | 5 ns |
