Products
Manufacturer
RFQ
NEWS
ContactSpecialized ICs(2368)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Density | Number of Drivers | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code | Number of I/O | Throw Configuration | Neg Supply Voltage-Nom (Vsup) | Frequency (Max) | uPs/uCs/Peripheral ICs Type | Access Time | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Memory IC Type | Output Enable | Bus Directional | Retransmit Capability | FWFT Support | Off-state Isolation-Nom | Switching | Neg Supply Voltage-Max (Vsup) | Neg Supply Voltage-Min (Vsup) | Normal Position | Cycle Time | Primary Clock/Crystal Frequency-Nom | Output Clock Frequency-Max | Signal Current-Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 72V51446L6BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51446l6bb-datasheets-8593.pdf | BGA | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.6V | 3.15V | 256 | 1.1 Mb | no | 1.76mm | EAR99 | ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT | Lead, Tin | 8542.32.00.71 | 1 | 100mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | COMMERCIAL | Dual | 166MHz | 3.7 ns | 32KX36 | PARALLEL | 36b | Synchronous | YES | Unidirectional | No | Yes | 6 ns | ||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51769L5BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51769l5bb8-datasheets-5436.pdf | BGA | 17mm | 17mm | 256 | 256 | EAR99 | not_compliant | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | 256 | COMMERCIAL | 70°C | 1.9V | 1.7V | FIFOs | 1.8V | 0.15mA | Not Qualified | 200MHz | 128KX36 | 36 | 4718592 bit | PARALLEL | 0.1A | 3.6 ns | OTHER FIFO | YES | 5 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI578-10GILV | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | Non-RoHS Compliant | 27mm | 27mm | Lead Free | 675 | yes | 2.41mm | 8542.39.00.01 | e3 | Tin (Sn) | 245 | 675 | TELECOM CIRCUIT | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HVPS1848CRMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | RoHS Compliant | FCBGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 844201BKI-45LF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-844201bki45lf-datasheets-5777.pdf | 3mm | 3mm | 3.3V | Lead Free | 16 | 12 Weeks | 16 | yes | 1mm | EAR99 | 8542.39.00.01 | e3 | Matte Tin (Sn) - annealed | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 16 | INDUSTRIAL | 3.63V | 30 | Clock Generators | 95mA | Not Qualified | CLOCK GENERATOR, OTHER | 25MHz | 125MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI574-10GILV | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57410gilv-datasheets-4730.pdf | BGA | 21mm | 21mm | Lead Free | 399 | 4 Weeks | 399 | yes | 1.81mm | No | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 399 | INDUSTRIAL | TELECOM CIRCUIT | 85°C | -40°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI578-10GILH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | Non-RoHS Compliant | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57810gilh-datasheets-4314.pdf | 27mm | 27mm | Contains Lead | 675 | no | 2.41mm | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 225 | 675 | TELECOM CIRCUIT | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HVPS1848CRM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | RoHS Compliant | FCBGA | 784 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51769L5BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51769l5bb-datasheets-4258.pdf | BGA | 256 | 256 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | COMMERCIAL | 70°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 200MHz | 128KX36 | 36 | 4718592 bit | 0.1A | 3.6 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLS32AIA020A4USON10XTMA2 | Infineon |
Min: 1 Mult: 1 |
0 | 0x0x0 | Non-RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/infineon-sls32aia020a4uson10xtma2-datasheets-2201.pdf | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI578-10GCLV | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | Non-RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57810gclv-datasheets-3163.pdf | 27mm | 27mm | Lead Free | 675 | yes | 2.41mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 245 | 675 | TELECOM CIRCUIT | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51767L7-5BBI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51767l75bbi-datasheets-3154.pdf | BGA | 376 | no | EAR99 | not_compliant | 8542.32.00.71 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 1mm | INDUSTRIAL | 85°C | -40°C | NOT SPECIFIED | FIFOs | 1.8V | 0.2mA | Not Qualified | 133MHz | 128KX40 | 40 | 5242880 bit | 0.12A | 3.8 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HVPS1616CBRI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hvps1616cbri8-datasheets-3149.pdf | FCBGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 72V51253L6BBG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.5mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51253l6bbg-datasheets-0464.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 1.724105g | 3.45V | 3.15V | 256 | yes | 1.76mm | EAR99 | ALTERNATIVE MEMORY WIDTH:9-BIT | Copper, Silver, Tin | 8542.32.00.71 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | COMMERCIAL | Dual | 30 | FIFOs | 0.1mA | 166MHz | 128KX18 | 2359296 bit | PARALLEL | 0.025A | 3.7 ns | OTHER FIFO | YES | Unidirectional | No | Yes | 6 ns | ||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1616CRMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 85°C | -40°C | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1616crmi-datasheets-2522.pdf | FCBGA | 21mm | 2.75mm | 21mm | Contains Lead | 400 | 18 Weeks | 400 | no | 2.75mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 400 | INDUSTRIAL | TELECOM CIRCUIT | NOT SPECIFIED | Other Telecom ICs | 12.5/3.3V | 4730mA | Not Qualified | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI578-10GCLH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | Non-RoHS Compliant | 27mm | 27mm | Contains Lead | 675 | no | 2.41mm | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 225 | 675 | TELECOM CIRCUIT | NOT SPECIFIED | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HVPS1616CBRI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | RoHS Compliant | 2011 | FCBGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51767L7-5BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51767l75bb-datasheets-2007.pdf | BGA | 376 | no | EAR99 | not_compliant | 8542.32.00.71 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 1mm | COMMERCIAL | 70°C | NOT SPECIFIED | FIFOs | 1.8V | 0.2mA | Not Qualified | 133MHz | 128KX40 | 40 | 5242880 bit | 0.12A | 3.8 ns | OTHER FIFO | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI572-10GCL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57210gcl-datasheets-5935.pdf | BGA | 21mm | 1.81mm | 21mm | Contains Lead | 399 | 399 | no | 1.81mm | EAR99 | No | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.2V | 399 | COMMERCIAL | TELECOM CIRCUIT | 70°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HVPS1616CBR8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hvps1616cbr8-datasheets-0908.pdf | FCBGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51767L6BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51767l6bb-datasheets-0888.pdf | BGA | 376 | no | EAR99 | not_compliant | 8542.32.00.71 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 1mm | COMMERCIAL | 70°C | NOT SPECIFIED | FIFOs | 1.8V | 0.2mA | Not Qualified | 166MHz | 128KX40 | 40 | 5242880 bit | 0.12A | 3.6 ns | OTHER FIFO | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1848CHMG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848chmg-datasheets-5357.pdf | 29mm | 29mm | Lead Free | 20 Weeks | 784 | yes | 2.75mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | 784 | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51549L6BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51549l6bb-datasheets-0816.pdf | BGA | 256 | 256 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | COMMERCIAL | 70°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 32KX36 | 36 | 1179648 bit | 0.1A | 3.7 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HA4404BCB96 | Intersil (Renesas Electronics America) | $3.62 |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | BIPOLAR | 1.75mm | Non-RoHS Compliant | 1998 | https://pdf.utmel.com/r/datasheets/intersil-ha4404bcb96-datasheets-4919.pdf | SOIC | 9.9mm | 3.9mm | Contains Lead | 16 | not_compliant | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 240 | 5V | 1.27mm | COMMERCIAL | 70°C | 5.5V | 4.5V | 4 | CROSS POINT SWITCH | 30 | Multiplexer or Switches | +-5V | 15.5mA | Not Qualified | R-PDSO-G16 | 4PST | -5V | 70 dB | -5.5V | -4.5V | 0.02A | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| HA4201CB96 | Intersil (Renesas Electronics America) | $6.95 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 1 (Unlimited) | CMOS | 1.75mm | RoHS Compliant | 1998 | https://pdf.utmel.com/r/datasheets/intersil-ha4201cb96-datasheets-3670.pdf | SOIC | 4.9mm | 3.9mm | Contains Lead | 8 | VIDEO APPLICATION | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 240 | 5V | 1.27mm | COMMERCIAL | 70°C | 5.5V | 4.5V | 1 | CROSS POINT SWITCH | 30 | Multiplexer or Switches | +-5V | Not Qualified | R-PDSO-G8 | SPST | -5V | 85 dB | MAKE-BEFORE-BREAK | -5.5V | -4.5V | NO | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HVPS1616CBR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hvps1616cbr-datasheets-9697.pdf | FCBGA | 20 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51759L6BBI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51759l6bbi8-datasheets-9670.pdf | BGA | 256 | 256 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | INDUSTRIAL | 85°C | -40°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 64KX36 | 36 | 2359296 bit | 0.1A | 3.7 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HF08P08AG3YAHLG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | RoHS Compliant | FCBGA | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1848CRMI | Integrated Device Technology (IDT) | $580.12 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 85°C | -40°C | 2.83mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848crmi-datasheets-9407.pdf | FCBGA | 29mm | 29mm | 1.05V | Contains Lead | 784 | 19 Weeks | 784 | no | 2.75mm | 18 | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1V | 1mm | 784 | INDUSTRIAL | TELECOM CIRCUIT | NOT SPECIFIED | Other Telecom ICs | 12.5/3.3V | 7940mA | Not Qualified | 48 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51759L6BBI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51759l6bbi-datasheets-8584.pdf | BGA | 256 | 256 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | INDUSTRIAL | 85°C | -40°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 64KX36 | 36 | 2359296 bit | 0.1A | 3.7 ns | OTHER FIFO |
