Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Density | Pbfree Code | Thickness | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code | Max Dual Supply Voltage | Supply Type | Min Dual Supply Voltage | Neg Supply Voltage-Nom (Vsup) | Frequency (Max) | uPs/uCs/Peripheral ICs Type | Direction | Access Time | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Memory IC Type | Output Enable | Bus Directional | Retransmit Capability | FWFT Support | Programmable Flags Support | Off-state Isolation-Nom | Cycle Time | Primary Clock/Crystal Frequency-Nom | Output Clock Frequency-Max |
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TSI578A-10GIL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi578a10gil-datasheets-8896.pdf | FCBGA | 8 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TSI620-10GCL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 2.26mm | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi62010gcl-datasheets-8436.pdf | 27mm | 27mm | Contains Lead | 675 | 675 | no | 2.13mm | EAR99 | No | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.2V | 1mm | 675 | COMMERCIAL | TELECOM CIRCUIT | 70°C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
83PN161AKILFT | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-83pn161akilft-datasheets-7905.pdf | 7mm | 5mm | Lead Free | 10 Weeks | 10 | 900μm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
843242AGLFT | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-843242aglft-datasheets-7896.pdf | TSSOP | 5mm | 4.4mm | Lead Free | 16 | 16 | yes | 1mm | EAR99 | 8542.39.00.01 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 3.3V | 16 | COMMERCIAL | 70°C | 3.465V | 3.135V | 30 | Clock Generators | 3.3V | Not Qualified | CLOCK GENERATOR, OTHER | 31.25MHz | 625MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
80HVPS1616RMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hvps1616rmi-datasheets-7478.pdf | FCBGA | 20 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
80HVPS1616RM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | RoHS Compliant | 20 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
80KSW0004AR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 4 (72 Hours) | 3.42mm | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80ksw0004ar-datasheets-7321.pdf | FCBGA | 19mm | 19mm | Contains Lead | 324 | 19 Weeks | 324 | no | 3.27mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 1mm | 324 | COMMERCIAL | TELECOM CIRCUIT | 70°C | NOT SPECIFIED | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
88P8344BHGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | CMOS | 2.44mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-88p8344bhgi-datasheets-6922.pdf | 35mm | 35mm | 820 | 820 | yes | EAR99 | No | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | 260 | 1.8V | 1mm | 820 | INDUSTRIAL | 1.96V | 1.68V | 30 | Other Microprocessor ICs | 1.83.3V | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
80HCPS1432RMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 2.83mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1432rmi-datasheets-6651.pdf | 25mm | 25mm | Contains Lead | 576 | 576 | no | 2.6mm | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 1mm | 576 | INDUSTRIAL | TELECOM CIRCUIT | 85°C | -40°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
80HCPS1432HMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | 2.83mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1432hmi-datasheets-6378.pdf | FCBGA | 25mm | 25mm | Contains Lead | 576 | 576 | no | 2.6mm | No | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 225 | 1mm | 576 | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
80HCPS1432HM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | 2.83mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1432hm-datasheets-6258.pdf | FCBGA | 25mm | 25mm | Contains Lead | 576 | 576 | no | 2.6mm | No | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 225 | 1V | 1mm | 576 | COMMERCIAL | TELECOM CIRCUIT | 70°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IDT72P51777L7-5BBI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51777l75bbi-datasheets-3554.pdf | BGA | 376 | no | EAR99 | not_compliant | 8542.32.00.71 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 1mm | INDUSTRIAL | 85°C | -40°C | NOT SPECIFIED | FIFOs | 1.8V | 0.2mA | Not Qualified | 133MHz | 256KX40 | 40 | 10485760 bit | 0.12A | 3.8 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
80HSPS1616CRMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hsps1616crmi-datasheets-3356.pdf | FCBGA | 21mm | 2.75mm | 21mm | Contains Lead | 400 | 18 Weeks | 400 | no | 2.75mm | 5A002.A.1.A | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 400 | INDUSTRIAL | 85°C | -40°C | 1.05V | 0.95V | NOT SPECIFIED | MICROPROCESSOR CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
80HSPS1616CRM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | CMOS | RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hsps1616crm-datasheets-3249.pdf | FCBGA | 21mm | 2.75mm | 21mm | Contains Lead | 400 | 18 Weeks | 400 | no | 2.75mm | 5A002.A.1.A | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 400 | COMMERCIAL | 70°C | 1.05V | 0.95V | NOT SPECIFIED | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
8430S10BYI-03LF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | CMOS | 1.2mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-8430s10byi03lf-datasheets-2591.pdf | 7mm | 7mm | Lead Free | 48 | 12 Weeks | 48 | yes | 1mm | EAR99 | 8542.39.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 48 | INDUSTRIAL | 85°C | -40°C | 3.465V | 3.135V | NOT SPECIFIED | Clock Generators | 3.3V | 150mA | Not Qualified | CLOCK GENERATOR, PROCESSOR SPECIFIC | 25MHz | 133.333MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||
IDT72P51777L7-5BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51777l75bb-datasheets-2388.pdf | BGA | 376 | no | EAR99 | not_compliant | 8542.32.00.71 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 1mm | COMMERCIAL | 70°C | NOT SPECIFIED | FIFOs | 1.8V | 0.2mA | Not Qualified | 133MHz | 256KX40 | 40 | 10485760 bit | 0.12A | 3.8 ns | OTHER FIFO | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IDT72P51549L6BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51549l6bb8-datasheets-2266.pdf | BGA | 17mm | 17mm | 256 | 256 | EAR99 | not_compliant | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | 256 | COMMERCIAL | 70°C | 1.9V | 1.7V | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 32KX36 | 36 | 1179648 bit | PARALLEL | 0.1A | 3.7 ns | OTHER FIFO | YES | 6 ns | |||||||||||||||||||||||||||||||||||||||||||||||
80HCPS1848CHMGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1848chmgi-datasheets-2250.pdf | 29mm | 29mm | Lead Free | 20 Weeks | 784 | yes | 2.75mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | 784 | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IDT72P51777L6BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | CMOS | ASYNCHRONOUS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51777l6bb-datasheets-1088.pdf | BGA | 376 | no | EAR99 | 8542.32.00.71 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 1mm | COMMERCIAL | 70°C | NOT SPECIFIED | FIFOs | 1.8V | 0.2mA | Not Qualified | 166MHz | 256KX40 | 40 | 10485760 bit | 0.12A | 3.6 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
HA4344BCBZ96 | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | 1.75mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/intersil-ha4344bcbz96-datasheets-1047.pdf | SOIC | 9.9mm | 3.9mm | 5V | 16 | No | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) - annealed | GULL WING | 260 | 5V | 1.27mm | 16 | COMMERCIAL | 4 | CROSS POINT SWITCH | 30 | Multiplexer or Switches | 15.5mA | R-PDSO-G16 | 5.5V | Dual | 4.5V | -5V | 70 dB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
X90100M8IZT1 | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 5 (48 Hours) | 85°C | -40°C | 1.1mm | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/intersil-x90100m8izt1-datasheets-0219.pdf | MSOP | 3mm | 3mm | 8 | 8542.39.00.01 | 1 | e3 | MATTE TIN | DUAL | GULL WING | 260 | 5V | 0.65mm | 8 | INDUSTRIAL | 5.5V | 2.7V | ANALOG CIRCUIT | 40 | Not Qualified | S-PDSO-G8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SLS32AIA020A2USON10XTMA2 | Infineon | $2.49 |
Min: 1 Mult: 1 |
0 | 0x0x0 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IDT72P51769L6BBI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ASYNCHRONOUS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51769l6bbi8-datasheets-9979.pdf | BGA | 256 | 256 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | INDUSTRIAL | 85°C | -40°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 128KX36 | 36 | 4718592 bit | 0.1A | 3.7 ns | OTHER FIFO | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IDT72T6480L7-5BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | 1.72mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72t6480l75bb-datasheets-9762.pdf | BGA | 19mm | 19mm | 324 | not_compliant | 8542.31.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 324 | INDUSTRIAL | 85°C | -40°C | 2.625V | 2.375V | 30 | Memory Controllers | 2.53.3V | 650mA | Not Qualified | MICROPROCESSOR CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
72V51243L7-5BBI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51243l75bbi-datasheets-8922.pdf | BGA | 17mm | 17mm | Contains Lead | 256 | 256 | no | 1.76mm | EAR99 | ALTERNATIVE MEMORY WIDTH:9-BIT | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | 85°C | -40°C | 3.45V | 3.15V | NOT SPECIFIED | FIFOs | 3.3V | 0.1mA | Not Qualified | 133MHz | 64KX18 | 1179648 bit | PARALLEL | 0.01A | 4 ns | OTHER FIFO | YES | 7.5 ns | ||||||||||||||||||||||||||||||||||||||||||
IDT72P51769L6BBI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51769l6bbi-datasheets-8807.pdf | BGA | 256 | 256 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | INDUSTRIAL | 85°C | -40°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 128KX36 | 36 | 4718592 bit | 0.1A | 3.7 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IDT72P51769L6BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | Non-RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51769l6bb8-datasheets-7690.pdf | BGA | 17mm | 17mm | 256 | 256 | EAR99 | not_compliant | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | 256 | COMMERCIAL | 70°C | 1.9V | 1.7V | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 128KX36 | 36 | 4718592 bit | PARALLEL | 0.1A | 3.7 ns | OTHER FIFO | YES | 6 ns | |||||||||||||||||||||||||||||||||||||||||||||||
80HCPS1616CRM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 70°C | 0°C | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1616crm-datasheets-1621.pdf | FCBGA | 21mm | 2.75mm | 21mm | Contains Lead | 400 | 18 Weeks | 400 | no | 2.75mm | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 400 | COMMERCIAL | TELECOM CIRCUIT | Other Telecom ICs | 12.5/3.3V | 4730mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
72V51443L6BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | 166MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51443l6bb8-datasheets-9634.pdf | BGA | 17mm | 17mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3.15V | 256 | 1.1 Mb | 1.76mm | Lead, Tin | 100mA | Dual | 166MHz | Unidirectional | 3.7 ns | 18b | Synchronous | Unidirectional | No | Yes | Yes | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IDT72P51769L6BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51769l6bb-datasheets-6571.pdf | BGA | 256 | 256 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | COMMERCIAL | 70°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 128KX36 | 36 | 4718592 bit | 0.1A | 3.7 ns | OTHER FIFO |
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