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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Voltage - Rated DC | Package / Case | Capacitance | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Impedance | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Packing Method | Number of Functions | Tolerance | JESD-609 Code | Terminal Finish | Polarity | Reference Standard | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Number of Elements | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Number of I/O | Peripherals | Core Architecture | RAM Size | Speed Grade | Max Reverse Leakage Current | Zener Voltage | Configuration | Case Connection | Power Dissipation-Max (Abs) | Test Current | Architecture | Number of Outputs | Speed | Voltage - Isolation | Diode Element Material | Reference Voltage | Voltage Tol-Max | Diode Type | Voltage Tolerance | Dynamic Impedance-Max | Collector Emitter Voltage (VCEO) | Max Collector Current | Number of Registers | Number of Inputs | Number of Gates | Impedance-Max | Core Processor | Connectivity | Number of Logic Elements/Cells | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Number of CLBs | Current - Reverse Leakage @ Vr | Voltage - Forward (Vf) (Max) @ If | Voltage - Zener (Nom) (Vz) | Module/Board Type | Total RAM Bits |
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| SMAX-256CQ-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2009 | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S010TS-1FGG484M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | 3A001.A.2.C | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 233 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 233 | 166MHz | 233 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMSF-256FG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | Hardware | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050T-1FG896I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 896-BGA | 1.2V | 8 Weeks | 1.26V | 1.14V | 896 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050T | 896-FBGA (31x31) | 377 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM2S-325FCSR-MSSOC | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-1FGG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 23mm | 23mm | 1.2V | 484 | 10 Weeks | 484 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | M2S090T | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 267 | DDR, PCIe, SERDES | ARM | 64KB | 1 | MCU, FPGA | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P250-FG256I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 231MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3p600pqg208i-datasheets-5753.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 256 | 8 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 1 month ago) | 3A001.A.7.B | No | 8542.39.00.01 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | A3P250 | 30 | 157 | 4.5kB | 6144 | 250000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050T-1FGG484M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | /files/microsemicorporation-m2s005s1vfg400t2-datasheets-2817.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 3A001.A.2.C | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL030V2-UCG81I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 4μA | RoHS Compliant | 2016 | /files/microsemicorporation-agl600v5fgg256i-datasheets-6582.pdf | 81-WFBGA, CSBGA | 4mm | 660μm | 4mm | 1.5V | 81 | 22 Weeks | 81 | IN PRODUCTION (Last Updated: 3 weeks ago) | 250MHz | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | AGL030 | NOT SPECIFIED | Not Qualified | 66 | 30000 | 768 | FIELD PROGRAMMABLE GATE ARRAY | 768 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-FCS536 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0686.pdf | 536-LFBGA, CSPBGA | 536 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGLN010V5-QNG48I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3μA | RoHS Compliant | 2013 | /files/microsemicorporation-agln010v5ucg36i-datasheets-4103.pdf | 48-VFQFN Exposed Pad | 6mm | 880μm | 6mm | 1.5V | Lead Free | 48 | 22 Weeks | 48 | IN PRODUCTION (Last Updated: 1 month ago) | 250MHz | 8542.39.00.01 | 1.425V~1.575V | QUAD | NO LEAD | NOT SPECIFIED | 1.5V | 0.4mm | AGLN010 | NOT SPECIFIED | Not Qualified | 34 | 10000 | 260 | FIELD PROGRAMMABLE GATE ARRAY | 260 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-FCSG536I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA150-TQG100 | Microsemi |
Min: 1 Mult: 1 |
download | ProASICPLUS | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 180MHz | 5mA | RoHS Compliant | 2007 | /files/microsemicorporation-apa150pqg208-datasheets-1175.pdf | 100-LQFP | 14mm | 1.4mm | 14mm | 2.5V | Lead Free | 100 | 12 Weeks | 657.000198mg | 100 | IN PRODUCTION (Last Updated: 1 month ago) | No | 8542.39.00.01 | e3 | Matte Tin (Sn) | 2.3V~2.7V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | APA150 | 40 | Field Programmable Gate Arrays | 2.52.5/3.3V | 4.5kB | 66 | 4.5kB | 66 | 6144 | 150000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-1FCG1152 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.9mm | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 12 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S150 | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 574 | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P125-FG144T | Microsemi |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, ProASIC3 | Surface Mount | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3p060vqg100t-datasheets-8475.pdf | 144-LBGA | 13mm | 1.05mm | 13mm | 1.5V | 144 | 18 Weeks | 400.011771mg | 144 | IN PRODUCTION (Last Updated: 1 month ago) | No | 231MHz | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 235 | 1.5V | 1mm | A3P125 | 20 | Field Programmable Gate Arrays | 1.5/3.3V | 97 | 4.5kB | 97 | 3072 | 125000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090-FGG676I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 425 | 166MHz | 425 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL005-1VFG400I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 1.51mm | RoHS Compliant | 2013 | /files/microsemicorporation-m2gl005s1vf400i-datasheets-6764.pdf | 400-LFBGA | 17mm | 17mm | Lead Free | 400 | 12 Weeks | 400 | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | M2GL005 | 30 | Field Programmable Gate Arrays | 1.2V | Not Qualified | 169 | 87.9kB | 171 | 6060 | FIELD PROGRAMMABLE GATE ARRAY | 719872 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-1FC1152 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.9mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 10 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S150T | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 574 | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL600V2-FG144I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2013 | /files/microsemicorporation-agl600v5fgg256i-datasheets-6582.pdf | 144-LBGA | 13mm | 1.05mm | 13mm | 1.5V | 144 | 17 Weeks | 400.011771mg | 144 | IN PRODUCTION (Last Updated: 1 month ago) | 892.86MHz | 8542.39.00.01 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | YES | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | AGL600 | 30 | Not Qualified | 97 | 13.5kB | 600000 | 13824 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-1FCS536I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL600V2-FG256I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2013 | /files/microsemicorporation-agl600v5fgg256i-datasheets-6582.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 256 | 17 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 1 month ago) | 892.86MHz | 8542.39.00.01 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | AGL600 | 30 | Not Qualified | 177 | 13.5kB | 600000 | 13824 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LX7203-15ISM | Microsemi |
Min: 1 Mult: 1 |
download | USB | Surface Mount | Surface Mount | -40°C~125°C | Tube | 1 (Unlimited) | Gull Wing | 900MHz | RoHS Compliant | 1997 | 5.25V | 6-TSSOP, SC-88, SOT-363 | 47pF | 1mm | 1.35mm | Lead Free | 2 | OBSOLETE (Last Updated: 1 month ago) | no | EAR99 | No | 8504.50.80.00 | TAPE AND REEL | 2 | LX7203 | Data Line Filters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA750-BGG456I | Microsemi |
Min: 1 Mult: 1 |
download | ProASICPLUS | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2007 | /files/microsemicorporation-apa150pqg208-datasheets-1175.pdf | 456-BBGA | 35mm | 1.73mm | 35mm | 2.5V | 456 | 18 Weeks | 456 | IN PRODUCTION (Last Updated: 2 weeks ago) | No | 180MHz | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.3V~2.7V | BOTTOM | BALL | 245 | 2.5V | 1.27mm | APA750 | 40 | Field Programmable Gate Arrays | 2.52.5/3.3V | 356 | 18kB | 356 | 32768 | 750000 | FIELD PROGRAMMABLE GATE ARRAY | 147456 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APTLGF300A1208G | Microsemi |
Min: 1 Mult: 1 |
download | IGBT | Screw | Through Hole | 1 (Unlimited) | 85°C | -40°C | RoHS Compliant | 2001 | /files/microsemicorporation-aptlgf300a1208g-datasheets-5737.pdf | 6-PowerSIP Module | 9 | Dual | 1 | Insulated Gate BIP Transistors | Half Bridge | 1780W | 2500Vrms | 1.2kV | 400A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P1000-1FG256T | Microsemi |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, ProASIC3 | Surface Mount | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 8mA | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3p060vqg100t-datasheets-8475.pdf | 256-LBGA | 1.5V | 256 | 20 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 1 month ago) | 272MHz | e0 | TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | A3P1000 | 20 | Field Programmable Gate Arrays | Not Qualified | 177 | 18kB | 1 | 177 | 24576 | 1000000 | FIELD PROGRAMMABLE GATE ARRAY | 147456 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1N753A-1 | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-1n751a1-datasheets-0716.pdf | DO-204AH, DO-35, Axial | Contains Lead | 2 | 13 Weeks | 2 | IN PRODUCTION (Last Updated: 4 weeks ago) | no | 3Ohm | EAR99 | METALLURGICALLY BONDED | Lead, Tin | not_compliant | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | 500mW | WIRE | NOT SPECIFIED | Single | NOT SPECIFIED | 1 | Not Qualified | 6.2V | ISOLATED | SILICON | 6.2V | 5% | ZENER DIODE | 3Ohm | 5μA @ 6.2V | 1.1V @ 200mA | 6.2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P1000-1FG484T | Microsemi |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, ProASIC3 | Surface Mount | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 8mA | 2.44mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3p060vqg100t-datasheets-8475.pdf | 484-BGA | 23mm | 23mm | 1.5V | 484 | 20 Weeks | 400.011771mg | 484 | IN PRODUCTION (Last Updated: 1 month ago) | No | 272MHz | e0 | TIN LEAD | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | A3P1000 | 20 | Field Programmable Gate Arrays | 300 | 18kB | 1 | 300 | 24576 | 1000000 | FIELD PROGRAMMABLE GATE ARRAY | 147456 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX1N4956 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/356 | Through Hole | Through Hole | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-1n4962-datasheets-2405.pdf | E, Axial | 2 | 14 Weeks | 2 | IN PRODUCTION (Last Updated: 1 month ago) | 1.5Ohm | EAR99 | No | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500/356H | 5W | WIRE | 1N4956 | Single | 5W | 1 | Qualified | 50μA | 8.2V | ISOLATED | 150mA | SILICON | 8.2V | 5% | ZENER DIODE | 5% | 1.5Ohm | 50μA @ 6.2V | 1.5V @ 1A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P1000L-FGG256I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3L | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2009 | /files/microsemicorporation-a3p600lfgg144-datasheets-3290.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.2V | Lead Free | 256 | 12 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 1 month ago) | No | 781.25MHz | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | A3P1000L | 40 | Field Programmable Gate Arrays | 1.5/3.3V | 177 | 18kB | 177 | 24576 | 1000000 | FIELD PROGRAMMABLE GATE ARRAY | 147456 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1N5969 | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-1n4962-datasheets-2405.pdf | E, Axial | 2 | 7 Weeks | 2 | IN PRODUCTION (Last Updated: 1 month ago) | no | EAR99 | HIGH RELIABILITY | Yes | 8541.10.00.50 | ±5% | e0 | TIN LEAD | UNIDIRECTIONAL | 5W | WIRE | NOT SPECIFIED | 1N5969 | 2 | Single | NOT SPECIFIED | 5W | 1 | Voltage Reference Diodes | Not Qualified | 1mA | 6.2V | ISOLATED | 220mA | SILICON | 6.2V | 5% | ZENER DIODE | 5% | 1Ohm | 1mA @ 4.74V | 1.5V @ 1A |
