| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Voltage - Rated DC | Current Rating | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Resistance | Number of Pins | Interface | Lifecycle Status | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Number of Elements | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Data Interface | Memory Size | Number of I/O | Peripherals | Core Architecture | RAM Size | Turn On Delay Time | Rise Time | Fall Time (Typ) | Turn-Off Delay Time | Continuous Drain Current (ID) | Gate to Source Voltage (Vgs) | Transistor Element Material | Configuration | Case Connection | Transistor Application | Drain to Source Voltage (Vdss) | Supply Type | Architecture | DS Breakdown Voltage-Min | Number of Outputs | Speed | Power Dissipation-Max | JEDEC-95 Code | Number of Registers | Number of Inputs | Number of Gates | Resolution (Bits) | Pulsed Drain Current-Max (IDM) | Drain-source On Resistance-Max | Avalanche Energy Rating (Eas) | Drain to Source Breakdown Voltage | Core Processor | Connectivity | Number of Logic Elements/Cells | FET Type | Input Capacitance (Ciss) (Max) @ Vds | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Number of CLBs | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Current - Continuous Drain (Id) @ 25°C | Gate Charge (Qg) (Max) @ Vgs | Drive Voltage (Max Rds On,Min Rds On) | Vgs (Max) | Voltage Supply Source | Module/Board Type | Total RAM Bits |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| APT13F120B | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -55°C~150°C TJ | Tube | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | RoHS Compliant | 1997 | /files/microsemicorporation-apt13f120b-datasheets-4878.pdf | 1.2kV | 13A | TO-247-3 | 21.46mm | 5.31mm | 16.26mm | Lead Free | 3 | 22 Weeks | 38.000013g | 1.2Ohm | yes | EAR99 | AVALANCHE RATED | No | e3 | Tin (Sn) | SINGLE | 3 | 625W | 1 | R-PSFM-T3 | 26 ns | 15ns | 24 ns | 85 ns | 14A | 30V | SILICON | SINGLE WITH BUILT-IN DIODE | SWITCHING | 1200V | 625W Tc | TO-247AB | 50A | N-Channel | 4765pF @ 25V | 1.4 Ω @ 7A, 10V | 5V @ 1mA | 14A Tc | 145nC @ 10V | 10V | ±30V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S010S-1TQ144 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | Non-RoHS Compliant | /files/microsemicorporation-m2s005s1vfg400t2-datasheets-2817.pdf | 144-LQFP | OBSOLETE (Last Updated: 1 month ago) | 144-TQFP (20x20) | 84 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APT56M50B2 | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -55°C~150°C TJ | Tube | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | RoHS Compliant | 1997 | /files/microsemicorporation-apt56m50b2-datasheets-4368.pdf | 500V | 56A | TO-247-3 Variant | 21.46mm | 5.31mm | 16.26mm | Lead Free | 3 | 18 Weeks | 3 | IN PRODUCTION (Last Updated: 3 weeks ago) | yes | AVALANCHE RATED, HIGH RELIABILITY | No | e3 | PURE MATTE TIN | SINGLE | 3 | 780W | 1 | 38 ns | 45ns | 33 ns | 100 ns | 56A | 30V | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 780W Tc | 500V | N-Channel | 8800pF @ 25V | 100m Ω @ 28A, 10V | 5V @ 2.5mA | 56A Tc | 220nC @ 10V | 10V | ±30V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150TS-1FCG1152M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.9mm | RoHS Compliant | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | IN PRODUCTION (Last Updated: 1 month ago) | 3A001.A.2.C | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APT58M50J | Microsemi |
Min: 1 Mult: 1 |
download | POWER MOS 8™ | Chassis Mount, Screw | Chassis Mount | -55°C~150°C TJ | Tube | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | RoHS Compliant | 1997 | /files/microsemicorporation-apt58m50j-datasheets-1042.pdf | 500V | 58A | SOT-227-4, miniBLOC | Lead Free | 4 | 22 Weeks | 4 | IN PRODUCTION (Last Updated: 3 weeks ago) | yes | FAST SWITCHING, AVALANCHE RATED, UL RECOGNIZED | No | UPPER | UNSPECIFIED | 4 | 540W | 1 | 60 ns | 70ns | 50 ns | 155 ns | 58A | 30V | SILICON | SINGLE WITH BUILT-IN DIODE | ISOLATED | SWITCHING | 540W Tc | 270A | 0.065Ohm | N-Channel | 13500pF @ 25V | 65m Ω @ 42A, 10V | 5V @ 2.5mA | 58A Tc | 340nC @ 10V | 10V | ±30V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060-1VFG400 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.51mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 400-LFBGA | 17mm | 17mm | 400 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B400 | 207 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 207 | 166MHz | 207 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX2N6768 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/543 | Through Hole | Through Hole | -55°C~150°C TJ | Bulk | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | Non-RoHS Compliant | 1997 | /files/microsemicorporation-jan2n6768-datasheets-1755.pdf | TO-204AE | 2 | no | Lead, Tin | not_compliant | e0 | Tin/Lead (Sn/Pb) | BOTTOM | PIN/PEG | NOT SPECIFIED | 2 | NOT SPECIFIED | 4W | 1 | Qualified | O-MBFM-P2 | 190ns | 14A | 20V | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 400V | 400V | 4W Ta 150W Tc | TO-204AA | 56A | 0.3Ohm | 700 mJ | N-Channel | 400m Ω @ 14A, 10V | 4V @ 250μA | 14A Tc | 110nC @ 10V | 10V | ±20V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050T-1FG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 166MHz | Non-RoHS Compliant | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 8 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050T | 484-FPBGA (23x23) | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LX1801ILQ | Microsemi |
Min: 1 Mult: 1 |
download | ADC, DAC | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | RoHS Compliant | 2006 | /files/microsemicorporation-lx1801ilq-datasheets-3400.pdf | 16-VFQFN Exposed Pad | 3mm | 3mm | 16 | OBSOLETE (Last Updated: 1 month ago) | yes | 1 | e3 | MATTE TIN | YES | 2.7V~5.5V | QUAD | NO LEAD | 260 | 5V | 0.5mm | 16 | 5.5V | 4.5V | 1 | 40 | Not Qualified | SMBus | Single | 8 b | Single Supply | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060-1FGG676 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 387 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 387 | 166MHz | 387 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM84CQ-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025TS-1VFG256T2 | Microsemi |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, SmartFusion®2 | -40°C~125°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | /files/microsemicorporation-m2s005s1vfg400t2-datasheets-2815.pdf | 256-LBGA | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | yes | NOT SPECIFIED | NOT SPECIFIED | 138 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SK-AX250-CQ352RTFG484S | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2003 | /files/microsemicorporation-lg1272daisychain-datasheets-8022.pdf | Metal | 20 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050-1FG896 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 166MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 896-BGA | 10 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050 | 896-FBGA (31x31) | 377 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-81CS-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | Hardware | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-FCSG325 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.16mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 13.5mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | R-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMAX-729BG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | Cable | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060T-1FG676I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 387 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 387 | 166MHz | 387 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-196CS-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | Hardware | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060-VFG400I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.51mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 400-LFBGA | 17mm | 17mm | 400 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B400 | 207 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 207 | 166MHz | 207 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-201CS-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | Hardware | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-FGG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S090T | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 267 | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMAX-624LG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090-1FG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 23mm | 23mm | 484 | 8 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S090 | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 267 | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL005-FGG484 | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 2.44mm | RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 484 | 11 Weeks | 484 | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | M2GL005 | 30 | Field Programmable Gate Arrays | 1.2V | Not Qualified | 87.9kB | 209 | 87.9kB | 209 | 6060 | FIELD PROGRAMMABLE GATE ARRAY | 719872 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-FCV484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 3.15mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BFBGA | 19mm | 19mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 273 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 273 | 166MHz | 273 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL030V5-VQ100I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2014 | /files/microsemicorporation-agl600v5fgg256i-datasheets-6582.pdf | 100-TQFP | 14mm | 1mm | 14mm | 1.5V | 100 | 22 Weeks | 100 | IN PRODUCTION (Last Updated: 3 weeks ago) | 892.86MHz | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | GULL WING | 230 | 1.5V | 0.5mm | AGL030 | 30 | Not Qualified | 77 | 30000 | 768 | FIELD PROGRAMMABLE GATE ARRAY | 768 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-FCV484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.15mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0686.pdf | 484-BFBGA | 19mm | 19mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 273 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 273 | 166MHz | 273 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PN010-QNG48I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1mA | RoHS Compliant | 2013 | /files/microsemi-a3pn010qng48i-datasheets-0029.pdf | 48-VFQFN Exposed Pad | 6mm | 880μm | 6mm | 1.5V | Lead Free | 48 | 21 Weeks | 48 | IN PRODUCTION (Last Updated: 3 weeks ago) | No | 350MHz | 8542.39.00.01 | 1.425V~1.575V | QUAD | 260 | 1.5V | 0.4mm | A3PN010 | 30 | 34 | 260 | 10000 | FIELD PROGRAMMABLE GATE ARRAY | 260 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090TS-FGG676 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0686.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 425 | 166MHz | 425 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB |
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