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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | UV Erasable | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VFX60-12FFG672CS1 | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 1.2V | 672 | yes | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1mm | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | S-PBGA-B672 | 522kB | 12 | 352 | 352 | 1181MHz | FIELD PROGRAMMABLE GATE ARRAY | 56880 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-2FFVC1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC95108-15PQG100I | Xilinx |
Min: 1 Mult: 1 |
3 | 85°C | -40°C | CMOS | 3.4mm | RoHS Compliant | PQFP | 20mm | 14mm | 5V | 100 | 100 | yes | EAR99 | YES | No | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 245 | 5V | 0.65mm | 100 | INDUSTRIAL | 30 | Programmable Logic Devices | 81 | FLASH | 15 | 15 ns | 55.6MHz | 108 | MACROCELL | 8 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-1FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4EG-1SFVC784IES9819 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-1FFVF1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV300E-8PQ240CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU19EG-1FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX110-3FF1760C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/xilinx-xc5vlx1103ff1760c-datasheets-7387.pdf | FCBGA | 42.5mm | 42.5mm | 1V | 6 Weeks | 1760 | e0 | BOTTOM | BALL | 225 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 800 | 576kB | 3 | 800 | 1412MHz | 110592 | 8640 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-1FFVE1924I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1924-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 668 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX45-L1FG676I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 100°C | -40°C | CMOS | 2.44mm | RoHS Compliant | BGA | 27mm | 27mm | 1V | 676 | 676 | no | 3A991.D | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 676 | INDUSTRIAL | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 358 | 261kB | 358 | 54576 | 43661 | 3411 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU15EG-2FFVB1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 328 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VFX100T-3FFG1738C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1738 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 680 | 1MB | 3 | 680 | 1412MHz | 102400 | 8000 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-3FFVD1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 308 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX20T-2FF323I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | RoHS Compliant | FCBGA | 19mm | 19mm | 1V | 323 | 323 | EAR99 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 323 | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 172 | 117kB | 2 | 172 | 19968 | 1560 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-L1FFVC1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 360 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC9536-6CS48C | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z015-2CLG485I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 766MHz | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 484-LFBGA, CSPBGA | 10 Weeks | 485 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | Copper, Silver, Tin | 766MHz | 485-CSBGA (19x19) | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | 766MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 74K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC9536XL4VQ64C | Xilinx |
Min: 1 Mult: 1 |
3 | CMOS | 1.2mm | Non-RoHS Compliant | 10mm | 10mm | 64 | EAR99 | 36 MACROCELLS | 8542.39.00.01 | e0 | TIN LEAD | YES | QUAD | GULL WING | 245 | 3.3V | 0.5mm | 64 | COMMERCIAL | 70°C | 3.6V | 3V | 30 | Not Qualified | S-PQFP-G64 | 36 | 4 ns | 200MHz | 0 DEDICATED INPUTS, 36 I/O | MACROCELL | FLASH PLD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-1FFG676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 3.24mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | yes | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 676 | 1.05V | 30 | Other uPs/uCs/Peripheral ICs | 11.8V | 130 | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||||||||
| XCV600-4FG676CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-L1SBVA484I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 484-BFBGA, FCBGA | 484 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B484 | 82 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC4VFX60-10FF1152IS1 | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 100°C | -40°C | CMOS | Non-RoHS Compliant | BGA | 1.2V | 1152 | no | 3A991.D | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1mm | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 522kB | 10 | 576 | 576 | FIELD PROGRAMMABLE GATE ARRAY | 56880 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2FBG676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 2.54mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||
| XCR3384XL-12FTG256I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 | 85°C | -40°C | CMOS | 1.55mm | RoHS Compliant | 17mm | 17mm | 3.3V | 256 | 256 | yes | 3A991.D | YES | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | INDUSTRIAL | 3.6V | 30 | Programmable Logic Devices | Not Qualified | 212 | EEPROM | 12 | 12 ns | 83MHz | 9000 | 384 | MACROCELL | 24 | EE PLD | YES | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9EG-2FFVB1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 328 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCR3384XL-7TQ144C | Xilinx |
Min: 1 Mult: 1 |
3 | 70°C | 0°C | CMOS | 1.6mm | Non-RoHS Compliant | TQFP | 20mm | 20mm | 3.3V | 144 | 144 | no | EAR99 | YES | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 144 | COMMERCIAL | 3.6V | 30 | Programmable Logic Devices | Not Qualified | 118 | EEPROM | 7 | 7.5 ns | 135MHz | 0 DEDICATED INPUTS, 118 I/O | 384 | MACROCELL | 24 | EE PLD | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z010-3CLG400E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 866MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | XC7Z010 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -3 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 28K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||
| XQV600-4CB228M | Xilinx |
Min: 1 Mult: 1 |
CMOS | 3.302mm | Non-RoHS Compliant | 39.37mm | 39.37mm | 228 | 228 | no | 3A001.A.2.C | 8542.39.00.01 | e0 | TIN LEAD | YES | QUAD | FLAT | NOT SPECIFIED | 2.5V | 0.635mm | 228 | MILITARY | 125°C | -55°C | 2.625V | 2.375V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2/3.62.5V | Not Qualified | MIL-PRF-38535 | 162 | 3456 CLBS, 661111 GATES | FIELD PROGRAMMABLE GATE ARRAY | 15552 | 661111 | 3456 | 0.8 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z012S-2CLG485E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2016 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-LFBGA, CSPBGA | 19mm | 19mm | 485 | 10 Weeks | yes | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B485 | 150 | DMA | 256KB | MCU, FPGA | 766MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 800MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 55K Logic Cells |
