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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Turn On Delay Time | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VSX25-10FFG668CS2 | Xilinx |
Min: 1 Mult: 1 |
download | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/xilinx-xc4vsx2510ffg668cs2-datasheets-9296.pdf | FCBGA | 1.2V | 668 | yes | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 250 | 1mm | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | S-PBGA-B668 | 288kB | 10 | 320 | 320 | FIELD PROGRAMMABLE GATE ARRAY | 23040 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z100-2FFG900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.35mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4558.pdf | 900-BBGA, FCBGA | 31mm | 900 | 10 Weeks | 900 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z100 | 1.05V | 0.95V | 30 | 212 | DMA | ARM | 256KB | 32b | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 444K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC9536XV-7VQ44I | Xilinx |
Min: 1 Mult: 1 |
3 | 85°C | -40°C | CMOS | RoHS Compliant | 10mm | 10mm | 2.5V | 44 | 44 | EAR99 | YES | No | e0 | TIN LEAD | YES | QUAD | GULL WING | 225 | 2.5V | 0.8mm | 44 | INDUSTRIAL | 30 | Programmable Logic Devices | 34 | FLASH | 7.5 ns | 7 | 7.5 ns | 125MHz | 0 DEDICATED INPUTS, 34 I/O | 36 | MACROCELL | 2 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-2FFG900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.35mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 31mm | 1V | 900 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z045 | 1.05V | 30 | S-PBGA-B900 | 130 | ROMless | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||
| XCV2000E-6FG860CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-1FFG676C | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 3.24mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||
| XC9572XL7TQ100CPROG | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-2FBG676CES | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | 85°C | 0°C | 800MHz | RoHS Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 7 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | XC7Z045 | 676-FCBGA (27x27) | 130 | DMA | ARM | 256KB | MCU, FPGA | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XQ4013XL3PQ240N | Xilinx |
Min: 1 Mult: 1 |
Bulk | 3 (168 Hours) | CMOS | 4.1mm | Non-RoHS Compliant | PQFP | 32mm | 32mm | Contains Lead | 240 | 240 | 3A001.A.2.C | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 240 | MILITARY | 125°C | -55°C | 3.6V | 3V | 30 | Field Programmable Gate Arrays | 3.3V | Not Qualified | MIL-PRF-38535 | 192 | 166MHz | 576 CLBS, 10000 GATES | 30000 | FIELD PROGRAMMABLE GATE ARRAY | 1368 | 10000 | 576 | 1.6 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z015-L1CLG485I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 667MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-LFBGA, CSPBGA | 19mm | 19mm | 485 | 10 Weeks | 1.05V | 950mV | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B485 | 130 | DMA | ARM | 256KB | 120 ps | MCU, FPGA | 92400 | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 74K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||
| XQ5VLX85-1EF676I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | CMOS | 3mm | RoHS Compliant | FCBGA | 27mm | 27mm | 676 | no | 3A991.D | 8542.39.00.01 | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 676 | INDUSTRIAL | 1.05V | 0.95V | NOT SPECIFIED | Field Programmable Gate Arrays | 12.5V | Not Qualified | S-PBGA-B676 | 440 | 432kB | 440 | 440 | 1098MHz | 3240 | FIELD PROGRAMMABLE GATE ARRAY | 82944 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-L2FBG484I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | 2.54mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-BBGA, FCBGA | 23mm | 23mm | 484 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | not_compliant | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 250 | 1V | 1mm | 1.05V | 0.95V | 30 | S-PBGA-B484 | 130 | DMA | ARM | 256KB | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX25-L1FT256C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 1.55mm | RoHS Compliant | BGA | 17mm | 17mm | 1V | 256 | 256 | no | EAR99 | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 240 | 1V | 1mm | 256 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 186 | 117kB | 186 | 30064 | 24051 | 1879 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV150-4FGG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 17mm | 17mm | 256 | yes | EAR99 | 8542.39.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | OTHER | 85°C | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B256 | 250MHz | 164674 | FIELD PROGRAMMABLE GATE ARRAY | 864 | 0.8 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-2SFVA625I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 625-BFBGA, FCBGA | 625 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | 0.825V | NOT SPECIFIED | R-PBGA-B625 | 180 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6VHX255T-1FFG1923C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.85mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vhx255t1ffg1923c-datasheets-1723.pdf | FCBGA | 45mm | 45mm | 1V | 6 Weeks | 1923 | yes | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | OTHER | 30 | Field Programmable Gate Arrays | 480 | 2.3MB | 1 | 480 | 253440 | 19800 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-1SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6VHX255T-2FFG1155I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 35mm | 35mm | 1V | 1155 | yes | 3A991.D | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 1mm | INDUSTRIAL | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 440 | 2.3MB | 2 | 440 | 253440 | 19800 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-2SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3S250E-4FTG256CS1 | Xilinx |
Min: 1 Mult: 1 |
Standard | 3 (168 Hours) | 85°C | 0°C | CMOS | 1.55mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc3s250e4ftg256cs1-datasheets-2186.pdf | 17mm | 17mm | 1.2V | 256 | 256 | yes | EAR99 | No | e1 | BOTTOM | BALL | 260 | 1.2V | 1mm | OTHER | 1.26V | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 27kB | 4 | 132 | 4896 | 572MHz | 612 CLBS, 250000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 5508 | 250000 | 612 | 0.76 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-1FFG900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 3.35mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4559.pdf | 900-BBGA, FCBGA | 1V | 900 | 10 Weeks | 900 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 30 | 130 | DMA | ARM | 256KB | 1 | 130 ps | MCU, FPGA | 343800 | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 275K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC9572-15TQ100Q | Xilinx |
Min: 1 Mult: 1 |
3 | 125°C | -40°C | CMOS | 1.6mm | Non-RoHS Compliant | TQFP | 14mm | 14mm | 5V | 100 | EAR99 | YES | No | e0 | YES | QUAD | GULL WING | 225 | 5V | 0.5mm | 100 | AUTOMOTIVE | 30 | Programmable Logic Devices | S-PQFP-G100 | 72 | FLASH | 15 | 7.5 ns | 125MHz | 72 I/O | 72 | MACROCELL | 8 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4EV-L1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5eg2fbvb900e-datasheets-4584.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XQ7K325T-1RF676M | Xilinx |
Min: 1 Mult: 1 |
3.37mm | Non-RoHS Compliant | 27mm | 27mm | 676 | 3A001.A.2.C | 8542.39.00.01 | YES | BOTTOM | BALL | 1V | 1mm | MILITARY | 125°C | -55°C | 1.03V | 0.97V | S-PBGA-B676 | 25475 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 25475 | 0.74 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-1FFG900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 3.35mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 31mm | 1V | 900 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z045 | 1.05V | 30 | S-PBGA-B900 | 130 | ROMless | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC2S150E-6FT256C | Xilinx |
Min: 1 Mult: 1 |
Standard | 3 (168 Hours) | 85°C | 0°C | CMOS | 2mm | RoHS Compliant | 17mm | 17mm | 1.8V | 256 | 256 | no | EAR99 | MAXIMUM USABLE GATES = 150000 | No | 8542.39.00.01 | e0 | BOTTOM | BALL | 240 | 1.8V | 1mm | 256 | COMMERCIAL EXTENDED | 1.89V | 30 | Field Programmable Gate Arrays | 6kB | 6 | 263 | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 3888 | 52000 | 864 | 0.47 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-1FBG676C | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 667MHz | 2.54mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 27mm | 676 | 10 Weeks | 1.05V | 950mV | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | S-PBGA-B676 | 130 | DMA | ARM | 256KB | 1 | 120 ps | MCU, FPGA | 343800 | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 275K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV200E-8CS144I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.2mm | Non-RoHS Compliant | BGA | 12mm | 12mm | 144 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 240 | 1.8V | 0.8mm | 144 | 1.89V | 1.71V | 30 | Field Programmable Gate Arrays | 1.2/3.61.8V | Not Qualified | 94 | 94 | 416MHz | 1176 CLBS, 63504 GATES | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 63504 | 1176 | 0.4 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XAZU3EG-1SFVC784Q | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~125°C TJ | Tray | 4 (72 Hours) | CMOS | 3.32mm | ROHS3 Compliant | /files/xilinxinc-xazu5ev1sfvc784q-datasheets-4797.pdf | 784-BFBGA, FCBGA | 23mm | 23mm | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B784 | 128 | DMA, WDT | 1.8MB | MPU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, I2C, SPI, UART/USART, USB | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
