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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | Combinatorial Delay of a CLB-Max |
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| XCZU6CG-L1FFVC900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5962-9752301QYC | Xilinx |
Min: 1 Mult: 1 |
download | CMOS | 3.302mm | Non-RoHS Compliant | 34.29mm | 34.29mm | 196 | 3A001.A.2.C | TYP. GATES = 7000-20000 | 8542.39.00.01 | e4 | GOLD | YES | QUAD | FLAT | 5V | 0.635mm | 196 | MILITARY | 125°C | -55°C | 5.5V | 4.5V | Field Programmable Gate Arrays | 5V | Not Qualified | S-CQFP-F196 | MIL-PRF-38535 Class Q | 160 | 160 | 111MHz | 400 CLBS, 7000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 950 | 7000 | 400 | 3.9 ns | |||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7CG-L1FBVB900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6VLX130T-1FFG784C4217 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vlx130t1ffg784c4217-datasheets-4892.pdf | 111 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4EV-3FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC2V1500-4FG676C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 2.6mm | RoHS Compliant | FBGA | 27mm | 27mm | 1.5V | 676 | no | 3A991.D | No | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.5V | 1mm | 676 | OTHER | 1.575V | 30 | Field Programmable Gate Arrays | 1.51.5/3.33.3V | S-PBGA-B676 | 108kB | 4 | 392 | 15360 | 392 | 650MHz | 1920 CLBS, 1500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 17280 | 1500000 | 1920 | ||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EV-1FFVF1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | 1517-FCBGA (40x40) | 464 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3S200A-4VQ100C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 1.2mm | RoHS Compliant | TQFP | 1.2V | 100 | 100 | EAR99 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 1.2V | 0.5mm | 100 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.33.3V | Not Qualified | 68 | 36kB | 4 | 62 | 667MHz | 200000 | 4032 | 448 | FIELD PROGRAMMABLE GATE ARRAY | 448 | 0.71 ns | |||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-1FFVC1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX30-2FFG324C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 19mm | 19mm | 1V | 324 | 324 | yes | 3A991.D | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 250 | 1V | 1mm | 324 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 220 | 144kB | 2 | 220 | 30720 | 2400 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EV-L2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XQ4VSX55-10FF1148M | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 125°C | -55°C | CMOS | 3.4mm | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/xilinx-xq4vsx5510ff1148m-datasheets-6162.pdf | FCBGA | 35mm | 35mm | 1148 | 25 Weeks | no | 3A001.A.2.C | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.2V | 1mm | 1148 | MILITARY | 1.26V | 1.14V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | S-PBGA-B1148 | 640 | 720kB | 640 | 640 | 1028MHz | 55296 | 6144 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-3FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6VCX130T-1FF484C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3mm | RoHS Compliant | FCBGA | 23mm | 23mm | 1V | 484 | no | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 1V | 484 | OTHER | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | S-PBGA-B484 | 240 | 1.2MB | 1 | 240 | 160000 | 240 | 128000 | 10000 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU15EG-L2FFVC900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV300E-7PQ240CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU15EG-2FFVC900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV600-6BG432I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | BGA | 40mm | 40mm | 432 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 1.27mm | 432 | 2.625V | 2.375V | 30 | Field Programmable Gate Arrays | 1.2/3.62.5V | Not Qualified | 316 | 316 | 333MHz | 3456 CLBS, 661111 GATES | FIELD PROGRAMMABLE GATE ARRAY | 15552 | 661111 | 3456 | 0.6 ns | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-2FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX25-L1FTG256C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 1.55mm | RoHS Compliant | BGA | 17mm | 17mm | 1V | 256 | 256 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 260 | 1V | 1mm | 256 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 186 | 117kB | 186 | 30064 | 24051 | 1879 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||||
| XCZU19EG-L1FFVE1924I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1924-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1924 | 668 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCS30XL5BGG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | BGA | 27mm | 27mm | 3.3V | 256 | EAR99 | MAXIMUM USABLE GATES 30000 | No | e1 | YES | BOTTOM | BALL | 250 | 3.3V | 1.27mm | 256 | OTHER | 3.6V | 30 | Field Programmable Gate Arrays | 5 | 192 | 1536 | 192 | FIELD PROGRAMMABLE GATE ARRAY | 1368 | 10000 | 576 | 1 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-L1FFVE1924I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1924-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1924 | 668 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX155T-3FF1738C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | e0 | TIN LEAD | BOTTOM | BALL | 225 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 680 | 954kB | 3 | 680 | 680 | 1412MHz | 155648 | 12160 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9CG-2FFVB1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 328 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV150-6FG456CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | https://pdf.utmel.com/r/datasheets/xilinx-xcv1506fg456ces-datasheets-8421.pdf | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z010-1CLG400C | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 667MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | XC7Z010 | 1.05V | 130 | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 28K Logic Cells | |||||||||||||||||||||||||||||||||||||||
| XQ17V16-DIE0628 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z020-1CLG400I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 667MHz | 1.6mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | XC7Z020 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 85K Logic Cells | ||||||||||||||||||||||||||||||||||||||
| XCV600-4BG560CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant |
