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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Screening Level | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | UV Erasable | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC6VLX760-1FFG1760I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1760 | yes | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1V | INDUSTRIAL | 30 | Field Programmable Gate Arrays | Not Qualified | 1200 | 3.2MB | 1 | 758784 | 59280 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5EV-L2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XA6SLX25-2FGG484I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 100°C | -40°C | RoHS Compliant | FBGA | 1.2V | 484 | 484 | 3A991.D | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1mm | 30 | Field Programmable Gate Arrays | Not Qualified | AEC-Q100 | 266 | 117kB | 2 | 266 | 30064 | 24051 | 1879 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-2FFVF1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3020-100PG84M | Xilinx |
Min: 1 Mult: 1 |
125°C | -55°C | CMOS | 4.318mm | Non-RoHS Compliant | 27.94mm | 27.94mm | 5V | 84 | 84 | 3A001.A.2.C | No | 8542.39.00.01 | e3 | MATTE TIN | NO | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 84 | MILITARY | Field Programmable Gate Arrays | 5V | 1.8kB | 100 | 64 | 256 | FIELD PROGRAMMABLE GATE ARRAY | 64 | 64 | 7 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9CG-2FFVC900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3S50A-5VQ100C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 1.2mm | RoHS Compliant | TQFP | 14mm | 14mm | 1.2V | 100 | 100 | EAR99 | e0 | QUAD | GULL WING | 225 | 1.2V | 100 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.33.3V | Not Qualified | 68 | 6.8kB | 5 | 62 | 770MHz | 50000 | 1584 | 176 | FIELD PROGRAMMABLE GATE ARRAY | 176 | 0.62 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EV-3FFVC1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX30T-1FFG665CS1 | Xilinx |
Min: 1 Mult: 1 |
85°C | 0°C | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/xilinx-xc5vlx30t1ffg665cs1-datasheets-7112.pdf | FCBGA | 1V | No | 162kB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-2FFVC1760I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX85-3FF1153C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/xilinx-xc5vlx853ff1153c-datasheets-7461.pdf | FCBGA | 1V | 6 Weeks | 1153 | e0 | BOTTOM | BALL | 225 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 560 | 432kB | 3 | 560 | 1412MHz | 82944 | 6480 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU19EG-2FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX75T-3FG676C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 2.44mm | RoHS Compliant | BGA | 27mm | 27mm | 1.2V | 676 | 676 | no | e0 | BOTTOM | BALL | 225 | 1.2V | 1mm | 676 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | Not Qualified | 348 | 387kB | 3 | 320 | 93296 | 862MHz | 74637 | 5831 | FIELD PROGRAMMABLE GATE ARRAY | 0.21 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-3FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX110T-3FF1738C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1738 | e0 | BOTTOM | BALL | 225 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 680 | 666kB | 3 | 680 | 1412MHz | 110592 | 8640 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU19EG-L2FFVD1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1760 | 308 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3S1600E-4FGG400CS1 | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FBGA | 21mm | 21mm | 1.2V | 400 | yes | 3A991.D | No | e1 | YES | BOTTOM | BALL | 250 | 1.2V | 1mm | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 81kB | 4 | 232 | 29504 | 304 | 572MHz | 3688 CLBS, 1600000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 33192 | 1600000 | 3688 | 0.76 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-2FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC95288-20BGG352C | Xilinx |
Min: 1 Mult: 1 |
download | 3 | CMOS | 1.7mm | Non-RoHS Compliant | 1996 | /files/xilinx-xc9528820bgg352c-datasheets-8556.pdf | 35mm | 35mm | 5V | 352 | yes | EAR99 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 5V | 1.27mm | 352 | COMMERCIAL | 70°C | 30 | Not Qualified | S-PBGA-B352 | 192 | 20 ns | 50MHz | 0 DEDICATED INPUTS, 192 I/O | MACROCELL | 8 | FLASH PLD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z015-1CLG485I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 667MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-LFBGA, CSPBGA | 19mm | 485 | 10 Weeks | 485 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | Other Microprocessor ICs | 11.8V | Not Qualified | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 74K Logic Cells | |||||||||||||||||||||||||||||||||||||||||
| XCV50E-7PQ240CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z010-2CLG225I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 766MHz | 1.5mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 225-LFBGA, CSPBGA | 13mm | 1V | 225 | 10 Weeks | No SVHC | 225 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | XC7Z010 | 1.05V | 30 | 86 | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 28K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||
| XC95108-20PQG160I | Xilinx |
Min: 1 Mult: 1 |
3 | 85°C | -40°C | CMOS | 4.1mm | RoHS Compliant | PQFP | 5V | 160 | 160 | yes | EAR99 | YES | No | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 245 | 5V | 0.65mm | 160 | INDUSTRIAL | 30 | Programmable Logic Devices | 108 | FLASH | 20 | 20 ns | 50MHz | 108 | MACROCELL | 8 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-2SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCR3128XL-10TQ144Q | Xilinx |
Min: 1 Mult: 1 |
download | 3 | 125°C | -40°C | CMOS | 1.6mm | Non-RoHS Compliant | 1996 | /files/xilinx-xcr3128xl10tq144q-datasheets-9650.pdf | TQFP | 20mm | 20mm | 3.3V | 144 | 144 | EAR99 | YES | No | e0 | YES | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 144 | AUTOMOTIVE | 3.6V | 30 | Programmable Logic Devices | 108 | EEPROM | 10 | 95MHz | 128 | MACROCELL | 8 | EE PLD | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-1SBVA484I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 484-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 82 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV2000E6FG680CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9EG-1FFVC900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV300-4BG352CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-1FBG676CES | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 2.54mm | RoHS Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 27mm | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | YES | BOTTOM | BALL | 1V | 1mm | XC7Z045 | 1.05V | 0.95V | S-PBGA-B676 | 130 | DMA | ARM | 256KB | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells |
