Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Number of I/O | Memory Type | Peripherals | RAM Size | Turn On Delay Time | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
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XC2V1500-5FF896C | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 85°C | 0°C | CMOS | 3.4mm | Non-RoHS Compliant | FCBGA | 31mm | 31mm | 1.5V | 896 | no | EAR99 | No | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.5V | 1mm | 896 | OTHER | 30 | Field Programmable Gate Arrays | S-PBGA-B896 | 108kB | 5 | 528 | 15360 | 528 | FIELD PROGRAMMABLE GATE ARRAY | 17280 | 1920 | 0.39 ns | ||||||||||||||||||||||||||||||||||||||||||||||
XCV150-4FGG456I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2.6mm | RoHS Compliant | 23mm | 23mm | 456 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 250 | 2.5V | 1mm | 456 | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B456 | 250MHz | 164674 | FIELD PROGRAMMABLE GATE ARRAY | 864 | 0.8 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z035-2FFG900I4440 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC9572XL-7PC44I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 | 85°C | -40°C | CMOS | Non-RoHS Compliant | PLCC | 16.5862mm | 16.5862mm | 3.3V | 44 | 3.6V | 3V | 44 | no | EAR99 | Lead, Tin | not_compliant | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 44 | INDUSTRIAL | 30 | Programmable Logic Devices | Not Qualified | 34 | FLASH | 7.5 ns | 7 | 7.5 ns | 125MHz | 72 | MACROCELL | 4 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||
XC2VP2-5FF672I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | RoHS Compliant | FCBGA | 27mm | 27mm | 1.5V | 672 | 672 | no | 3A991.D | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.5V | 1mm | 672 | 30 | Field Programmable Gate Arrays | Not Qualified | 204 | 27kB | 5 | 204 | 2816 | 3168 | 352 | FIELD PROGRAMMABLE GATE ARRAY | 352 | 0.36 ns | |||||||||||||||||||||||||||||||||||||||||||||||
XCTUBES-V08 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | SOIC | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6SLX150-L1FG676I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 100°C | -40°C | CMOS | 2.44mm | RoHS Compliant | BGA | 27mm | 27mm | 1V | 676 | 676 | no | 3A991.D | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 676 | INDUSTRIAL | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 498 | 603kB | 498 | 184304 | 147443 | 11519 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||
XC7K410T-1FF676I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | CMOS | Non-RoHS Compliant | FCBGA | 1V | 676 | No | BOTTOM | BALL | Field Programmable Gate Arrays | S-PBGA-B676 | 400 | 3.5MB | 1 | 120 ps | 400 | 508400 | 400 | 406720 | 31775 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2S50E-7PQG208C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 4.1mm | RoHS Compliant | PQFP | 28mm | 28mm | 1.8V | 208 | 208 | yes | EAR99 | MAXIMUM USABLE GATES = 50000 | No | 8542.39.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 245 | 1.8V | 0.5mm | 208 | OTHER | 1.89V | 30 | Field Programmable Gate Arrays | 4kB | 7 | 182 | 400MHz | 384 CLBS, 23000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 23000 | 384 | 0.42 ns | |||||||||||||||||||||||||||||||||||||||||||
XC6VLX195T-2FF784C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 1V | 784 | no | 3A991.D | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 784 | OTHER | 1.05V | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | S-PBGA-B784 | 400 | 1.5MB | 2 | 400 | 400 | 199680 | 15600 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||
XC4VSX25-12FFG668C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 2.85mm | RoHS Compliant | FCBGA | 27mm | 27mm | 1.2V | 668 | 668 | yes | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1.2V | 1mm | 668 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | Not Qualified | 320 | 288kB | 12 | 320 | 23040 | 2560 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||
XC6VCX240T-2FFG784C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.1mm | RoHS Compliant | FCBGA | 1V | 784 | 784 | yes | 3A991.D | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 1mm | 784 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 400 | 1.8MB | 2 | 400 | 301440 | 1098MHz | 241152 | 18840 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||
EFR-DI-TCCENC-LTE-SITE | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV200-5PQ240CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EFR-DI-MIPI-PACK-SITE | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2V80-6CS144C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | BGA | 12mm | 12mm | 1.5V | 144 | 144 | no | EAR99 | No | 8542.39.00.01 | e0 | YES | BOTTOM | BALL | 240 | 1.5V | 0.8mm | 144 | OTHER | 1.575V | 30 | Field Programmable Gate Arrays | 1.51.5/3.33.3V | 18kB | 6 | 92 | 1024 | 820MHz | 128 CLBS, 80000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 1152 | 80000 | 128 | 0.35 ns | ||||||||||||||||||||||||||||||||||||||||||
XC6SLX16-L1FTG256C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 1.55mm | RoHS Compliant | BGA | 17mm | 17mm | 1V | 256 | 256 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 260 | 1V | 1mm | 256 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 186 | 72kB | 186 | 18224 | 14579 | 1139 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||
XC6SLX150-L1FGG676C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 2.44mm | RoHS Compliant | BGA | 27mm | 27mm | 1V | 676 | 676 | yes | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 250 | 1V | 1mm | 676 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 498 | 603kB | 498 | 184304 | 147443 | 11519 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||
XC6VLX365T-L1FFG1156I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 35mm | 35mm | 900mV | 1156 | yes | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 0.9V | 1mm | INDUSTRIAL | 0.93V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | 600 | 1.8MB | 600 | 1098MHz | 364032 | 28440 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | ||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX550T-1FF1760I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1760 | no | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | INDUSTRIAL | 30 | Field Programmable Gate Arrays | Not Qualified | 1200 | 2.8MB | 1 | 549888 | 42960 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VLX85-3FF676C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 27mm | 27mm | 1V | 676 | 676 | e0 | BOTTOM | BALL | 225 | 1V | 1mm | 676 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 440 | 432kB | 3 | 440 | 1412MHz | 82944 | 6480 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||
XCV150-5BG352CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5CG-2FBVB900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | 0.825V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCV150-6BG256CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EV-1FFVF1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV200-4BGG256I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2.55mm | RoHS Compliant | 27mm | 27mm | 256 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 250 | 2.5V | 1.27mm | 256 | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B256 | 250MHz | 236666 | FIELD PROGRAMMABLE GATE ARRAY | 1176 | 0.8 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EG-2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV1000E-6FG680CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | 2002 | https://pdf.utmel.com/r/datasheets/xilinx-xcv1000e6fg680ces-datasheets-5088.pdf | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7CG-1FFVF1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV200-6FG256CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant |
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