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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Max Junction Temperature (Tj) | Ambient Temperature Range High | JESD-30 Code | Memory Size | Memory Type | Number of Outputs | Number of Inputs | Output Characteristics | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Endurance | Data Retention Time-Min | Access Time (Max) | I/O Type | Memory IC Type | Programmable Logic Type | Number of Logic Cells | License - User Details | Media Delivery Type | License Length | Programmable Type | Number of Terminals |
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| EF-DI-TCCDEC-LTE-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XQ6VLX240T-L1FFG1156I | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | CMOS | RoHS Compliant | compliant | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 0.9V | 1mm | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B1156 | 600 | 600 | 1098MHz | FIELD PROGRAMMABLE GATE ARRAY | 241000 | 1156 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-CFA-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Site | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-RIO-LOG-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Site | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-AXI-BFM | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Electronically Delivered | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-FLASH-LDPC-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | /files/xilinxinc-efdi25gemacproj-datasheets-4573.pdf | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-10GBASE-KR-RLL | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Redistribution Limited | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM-DI-40GEMAC-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-XP4KVIDEO-ENH-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Site | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-DVBS2-FEC-ENC-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2011 | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LMS-ALL-1_USER | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-SPDIF-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2 Weeks | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-CHROM-RESAMP-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-MIPI-CSI2-TX-WW | Xilinx |
Min: 1 Mult: 1 |
download | Not Applicable | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LMS-EMBD-ZUPSA | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC1701LPDG8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | 8 | yes | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC1701L | 8 | 3.6V | 3V | 30 | 3.3V | 0.01mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||
| XC1701LPCG20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 20 | 20 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 8542.32.00.61 | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | QUAD | J BEND | 245 | 3.3V | 1.27mm | XC1701L | 20 | 3.6V | 3V | 30 | 3.3V | 0.01mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | 1048576 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||
| XCF16PVOG48C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 50MHz | ROHS3 Compliant | 1999 | /files/xilinxinc-xcf16pfsg48c-datasheets-1087.pdf | 48-TFSOP (0.724, 18.40mm Width) | 18.45mm | 1.2mm | 12mm | 1.8V | Lead Free | 48 | 10 Weeks | Unknown | 48 | Parallel | yes | EAR99 | No | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | YES | 1.65V~2V | DUAL | GULL WING | 260 | 1.8V | 0.5mm | XCF*P | 48 | 2V | 1.65V | 30 | 0.04mA | 125°C | 85°C | 16Mb | FLASH | 16MX1 | 1 | 16777216 bit | SERIAL | 20000 Write/Erase Cycles | 20 | In System Programmable | ||||||||||||||||||||||||||||||
| XC18V512PCG20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 4.572mm | ROHS3 Compliant | 1999 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 3.3V | 20 | 10 Weeks | 20 | 512 kb | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | QUAD | J BEND | 245 | 3.3V | 1.27mm | XC18V512 | 20 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 33MHz | 64KX8 | 8 | PARALLEL/SERIAL | 0.01A | 20 | 15 ns | CONFIGURATION MEMORY | In System Programmable | |||||||||||||||||||||||||||||||||||
| XC18V04PC44C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 3.3V | Contains Lead | 44 | 10 Weeks | 44 | 4 Mb | no | EAR99 | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC18V04 | 44 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 20MHz | 512KX8 | 8 | PARALLEL/SERIAL | 0.01A | 20000 Write/Erase Cycles | 20 | 20 ns | CONFIGURATION MEMORY | In System Programmable | |||||||||||||||||||||||||||||||||
| XC1701PC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 5V | Contains Lead | 20 | 20 | 1 Mb | no | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | No | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 4.75V~5.25V | QUAD | J BEND | 225 | 5V | 1.27mm | XC1701 | 20 | 30 | 5V | 0.02mA | 3-STATE | 15MHz | 1MX1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||
| XC17256ELPC20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17256EL | 20 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 256Kb | 3-STATE | 15MHz | 256KX1 | 1 | 262144 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||
| XC1765EPC20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 4.5V~5.5V | QUAD | J BEND | 225 | 5V | 1.27mm | XC1765E | 20 | 5.5V | 4.5V | 30 | 5V | 0.01mA | Not Qualified | 65kb | 3-STATE | 10MHz | 64KX1 | 1 | 65536 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||
| XC17S10PD8I | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | SYNCHRONOUS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | EAR99 | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | NO | 4.5V~5.5V | DUAL | 5V | 2.54mm | XC17S10 | 8 | 5.5V | 4.5V | 5V | 0.01mA | Not Qualified | R-PDIP-T8 | 100kb | 3-STATE | 10MHz | 95008X1 | 1 | 95008 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||||||||||||||
| XC17S200APD8I | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | no | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17S200A | 8 | 3.6V | 3V | 30 | 0.015mA | 2Mb | 3-STATE | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||
| XC17S30AVO8I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 3.3V | Contains Lead | 8 | 8 | 512 kb | no | EAR99 | No | 1 | e0 | YES | 3V~3.6V | DUAL | GULL WING | 225 | 3.3V | 1.27mm | XC17S30 | 8 | 3.6V | 3V | 30 | 0.005mA | 300kb | 3-STATE | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||
| XC17S40XLPD8I | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | SYNCHRONOUS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | NO | 3V~3.6V | DUAL | 3.3V | 2.54mm | XC17S40XL | 8 | 3.6V | 3V | 3.3V | 0.005mA | Not Qualified | 400kb | 3-STATE | 10MHz | 330696X1 | 1 | 330696 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||||||||||||||||||||||||||||||
| XC17V02PC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc17v01vo8c-datasheets-2408.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 3.3V | Contains Lead | 20 | 20 | 2 Mb | no | EAR99 | No | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17V02 | 20 | 3.6V | 3V | 30 | 0.015mA | 3-STATE | 15MHz | 2MX1 | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||
| XC17S100ASO20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 2.65mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 20-SOIC (0.295, 7.50mm Width) | 12.8mm | 7.5mm | 3.3V | Contains Lead | 20 | 20 | 1 Mb | no | EAR99 | No | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | DUAL | GULL WING | 225 | 3.3V | 1.27mm | XC17S100A | 20 | 3.6V | 3V | 30 | 0.015mA | 3-STATE | 781216X1 | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||
| XC18V512SO20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 2.65mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc18v04vq44i-datasheets-2494.pdf | 20-SOIC (0.295, 7.50mm Width) | 12.8mm | 7.5mm | 3.3V | Contains Lead | 20 | 20 | 512 kb | no | 3A991.B.1.A | No | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | DUAL | GULL WING | 225 | 3.3V | 1.27mm | XC18V512 | 20 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 33MHz | 64KX8 | 8 | PARALLEL/SERIAL | 0.01A | 10000 Write/Erase Cycles | 10 | 15 ns | CONFIGURATION MEMORY | In System Programmable |
