Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Logic Function | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | License - User Details | Media Delivery Type | License Length | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
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XCZU2EG-2SFVA625E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 625-BFBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 180 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV506FG256CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU3EG-1SFVA625E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 625-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 180 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S100E-5CP132C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 1.1mm | RoHS Compliant | BGA | 8mm | 8mm | 1.2V | 132 | 132 | no | EAR99 | e0 | TIN LEAD | YES | BOTTOM | BALL | 240 | 1.2V | 132 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | Not Qualified | 9kB | 5 | 72 | 1920 | 240 CLBS, 100000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 2160 | 100000 | 240 | 0.66 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU3CG-L1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7A15T-L2FGG484E | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | 0°C | 2.6mm | RoHS Compliant | FBGA | 23mm | 23mm | 484 | 484 | 3A991.D | ALSO OPERATES AT 1V SUPPLY | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | 250 | 112.5kB | 16640 | 1300 | FIELD PROGRAMMABLE GATE ARRAY | 1.51 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z035-1FBG676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 667MHz | 2.54mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 27mm | 676 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B676 | 130 | DMA | ARM | 256KB | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 275K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX255T-2FFG1923I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.85mm | RoHS Compliant | FCBGA | 45mm | 45mm | 1V | 1923 | yes | 3A001.A.7.B | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | INDUSTRIAL | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 480 | 2.3MB | 2 | 480 | 253440 | 19800 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XAZU3EG-1SFVA625Q | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~125°C TJ | Tray | 4 (72 Hours) | CMOS | 3.43mm | ROHS3 Compliant | /files/xilinxinc-xazu5ev1sfvc784q-datasheets-4797.pdf | 625-BFBGA, FCBGA | 21mm | 21mm | 625 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B625 | 128 | DMA, WDT | 1.8MB | MPU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, I2C, SPI, UART/USART, USB | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC9572-7PCG84C | Xilinx |
Min: 1 Mult: 1 |
3 | 70°C | 0°C | CMOS | RoHS Compliant | PLCC | 29.3116mm | 29.3116mm | 5V | 84 | 84 | yes | EAR99 | YES | No | e3 | Matte Tin (Sn) | YES | QUAD | J BEND | 245 | 5V | 84 | COMMERCIAL | 30 | Programmable Logic Devices | 69 | FLASH | 7 | 7.5 ns | 83.3MHz | 0 DEDICATED INPUTS, 69 I/O | 72 | MACROCELL | 8 | YES | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z045-2FBG676E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | 0°C | 800MHz | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4559.pdf | 676-BBGA, FCBGA | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | No | 733MHz | XC7Z045 | 676-FCBGA (27x27) | 130 | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX380T-1FF1923I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | CMOS | 3.85mm | RoHS Compliant | FCBGA | 45mm | 45mm | 1V | no | No | e0 | TIN LEAD | BOTTOM | BALL | 1V | INDUSTRIAL | Field Programmable Gate Arrays | 720 | 3.4MB | 1 | 250 ps | 720 | 720 | 382464 | 29880 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU4EG-2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5eg2fbvb900e-datasheets-4584.pdf | 900-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7A100T-L1FGG676I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | 2.44mm | RoHS Compliant | BGA | 27mm | 27mm | 676 | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.95V | 1mm | 0.98V | 0.92V | NOT SPECIFIED | 300 | 607.5kB | 101440 | 7925 | FIELD PROGRAMMABLE GATE ARRAY | 1.27 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU6CG-1FFVC900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2V1000-4FG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 2mm | RoHS Compliant | FBGA | 17mm | 17mm | 1.5V | 256 | no | EAR99 | No | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.5V | 1mm | 256 | OTHER | 1.575V | 30 | Field Programmable Gate Arrays | 1.51.5/3.33.3V | S-PBGA-B256 | 90kB | 4 | 172 | 10240 | 172 | 650MHz | 1280 CLBS, 1000000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 11520 | 1000000 | 1280 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5EV-1FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV300-6BG352I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | BGA | 35mm | 35mm | 352 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 1.27mm | 352 | 2.625V | 2.375V | 30 | Field Programmable Gate Arrays | 1.2/3.62.5V | Not Qualified | 260 | 260 | 333MHz | 1536 CLBS, 322970 GATES | FIELD PROGRAMMABLE GATE ARRAY | 6912 | 322970 | 1536 | 0.6 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU4CG-2FBVB900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | 0.825V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7K410T-L2FBG900I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | 2.54mm | RoHS Compliant | FCBGA | 31mm | 31mm | 900 | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.95V | 1mm | 0.97V | 0.93V | NOT SPECIFIED | S-PBGA-B900 | 500 | 3.5MB | 406720 | 31775 | FIELD PROGRAMMABLE GATE ARRAY | 0.61 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5CG-2SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX565T-1FFG1924C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.85mm | RoHS Compliant | FCBGA | 45mm | 45mm | 1V | 1924 | yes | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | OTHER | 30 | Field Programmable Gate Arrays | Not Qualified | 640 | 4MB | 1 | 640 | 566784 | 44280 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-DI-RACH-LTE-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2 Weeks | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCR3064XL-7CPG56C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 | 70°C | 0°C | CMOS | 1.35mm | RoHS Compliant | 6mm | 6mm | 3.3V | 56 | 56 | yes | EAR99 | YES | e1 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 56 | COMMERCIAL | 3.6V | 30 | Programmable Logic Devices | Not Qualified | 48 | EEPROM | 7 | 7.5 ns | 119MHz | 1500 | 64 | MACROCELL | 4 | EE PLD | YES | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-DI-CHDEC-LTE-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2008 | 2 Weeks | No | Decoder | Site | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7VH870T-1FLG1932C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | RoHS Compliant | FCBGA | 1932 | yes | 3A001.A.7.B | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | 1932 | OTHER | 1.03V | 0.97V | NOT SPECIFIED | S-PBGA-B1932 | 300 | 6.2MB | 876160 | 68450 | FIELD PROGRAMMABLE GATE ARRAY | 0.74 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-DI-25GBASE-KR-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | /files/xilinxinc-efdi25gemacproj-datasheets-4574.pdf | 2 Weeks | Site | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6SLX100-L1FGG484C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 2.6mm | RoHS Compliant | FBGA | 23mm | 23mm | 1V | 484 | 484 | yes | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 250 | 1V | 1mm | 484 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 326 | 603kB | 326 | 126576 | 101261 | 7911 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EF-DI-ERNIC-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2 Weeks | Worldwide | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5962-9957301QYC | Xilinx |
Min: 1 Mult: 1 |
download | CMOS | 3.0226mm | Non-RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/xilinx-59629957301qyc-datasheets-4329.pdf | 39.37mm | 39.37mm | 228 | 25 Weeks | 228 | 3A001.A.2.C | 8542.39.00.01 | e4 | GOLD | YES | QUAD | FLAT | 2.5V | 0.635mm | 228 | MILITARY | 125°C | -55°C | 2.625V | 2.375V | Field Programmable Gate Arrays | 1.2/3.62.5V | Qualified | MIL-PRF-38535 Class Q | 162 | 661111 GATES | FIELD PROGRAMMABLE GATE ARRAY | 15552 | 661111 | 3456 | 0.8 ns |
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