Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Operating Temperature (Max) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Memory Size | Number of I/O | Memory Type | Peripherals | RAM Size | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Number of Gates | Number of Macro Cells | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | Combinatorial Delay of a CLB-Max |
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XC9572-TQ100C | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV300-5PQG240C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 4.1mm | RoHS Compliant | PQFP | 32mm | 32mm | 2.5V | 240 | yes | No | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 245 | 2.5V | 240 | OTHER | 30 | 8kB | 5 | 294MHz | FIELD PROGRAMMABLE GATE ARRAY | 322970 | 0.7 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6SLX75-L1FG484C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 2.6mm | RoHS Compliant | FBGA | 23mm | 23mm | 1V | 484 | 484 | no | 3A991.D | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 484 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 280 | 387kB | 280 | 93296 | 74637 | 5831 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | |||||||||||||||||||||||||||||||||||||||||||
XCV200-4FGG256I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 100°C | -40°C | CMOS | 2mm | RoHS Compliant | FBGA | 17mm | 17mm | 2.5V | 256 | yes | EAR99 | No | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | 2.625V | 30 | S-PBGA-B256 | 7kB | 4 | 250MHz | 1176 CLBS, 236666 GATES | FIELD PROGRAMMABLE GATE ARRAY | 236666 | 1176 | 0.8 ns | |||||||||||||||||||||||||||||||||||||||||||||||
XC7K355T-2FF901C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | CMOS | Non-RoHS Compliant | FCBGA | 1V | 900 | No | BOTTOM | BALL | 1mm | Field Programmable Gate Arrays | 11.83.3V | S-PBGA-B900 | 300 | 3.1MB | 2 | 100 ps | 300 | 445200 | 300 | 1818MHz | 356160 | 27825 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCCACE128-I | Xilinx |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | CMOS | SYNCHRONOUS | 3.3mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xccace128i-datasheets-3529.pdf | 42.8mm | 36mm | 50 | EAR99 | 8542.39.00.01 | 1 | NO | UNSPECIFIED | UNSPECIFIED | 3.3V | 50 | COMMERCIAL | 60°C | 3.6V | 3V | Not Qualified | R-XXMA-X50 | 128MB | CompactFlash® | 33MHz | 8MX16 | 16 | 134217728 bit | SERIAL | |||||||||||||||||||||||||||||||||||||||||||||||||
XC2S50E-7TQ144C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 1.6mm | RoHS Compliant | TQFP | 20mm | 20mm | 1.8V | 144 | 144 | no | EAR99 | MAXIMUM USABLE GATES = 50000 | No | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 1.8V | 0.5mm | 144 | COMMERCIAL EXTENDED | 1.89V | 30 | Field Programmable Gate Arrays | 4kB | 7 | 182 | 400MHz | 384 CLBS, 23000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 23000 | 384 | 0.42 ns | ||||||||||||||||||||||||||||||||||||||||||
XCZU5CG-2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2C64A-7QFG48CR01 | Xilinx |
Min: 1 Mult: 1 |
RoHS Compliant | 64 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU6EG-1FFVC900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC95108-7PQ160CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EG-1FFVF1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX75T-L1FF484I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | CMOS | 3mm | RoHS Compliant | FCBGA | 23mm | 23mm | 900mV | 484 | 484 | no | 3A991.D | 8542.39.00.01 | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 484 | INDUSTRIAL | 0.93V | NOT SPECIFIED | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | 240 | 702kB | 240 | 1098MHz | 74496 | 5820 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | ||||||||||||||||||||||||||||||||||||||||||||
XCZU7CG-2FFVC1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | 0.825V | NOT SPECIFIED | R-PBGA-B1156 | 360 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX760-1FF1760I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1760 | no | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | INDUSTRIAL | 30 | Field Programmable Gate Arrays | Not Qualified | 1200 | 3.2MB | 1 | 758784 | 59280 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU15EG-1FFVC900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX760-L1FFG1760C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.5mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vlx760l1ffg1760c-datasheets-6012.pdf | FCBGA | 42.5mm | 42.5mm | 1V | 13 Weeks | 1760 | yes | 3A001.A.7.A | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 0.9V | 1mm | OTHER | 0.93V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | 1200 | 3.2MB | 1098MHz | 758784 | 59280 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | ||||||||||||||||||||||||||||||||||||||||||
XCZU9EG-L2FFVC900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Bulk | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||
XC2V4000-6BF957C | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 85°C | 0°C | CMOS | 3.5mm | Non-RoHS Compliant | FCBGA | 40mm | 40mm | 1.5V | 957 | no | EAR99 | No | 8542.39.00.01 | e0 | YES | BOTTOM | BALL | 225 | 1.5V | 1.27mm | 957 | OTHER | 1.575V | 30 | Field Programmable Gate Arrays | 1.51.5/3.33.3V | S-PBGA-B957 | 270kB | 6 | 684 | 46080 | 684 | 820MHz | FIELD PROGRAMMABLE GATE ARRAY | 51840 | 4000000 | 0.35 ns | ||||||||||||||||||||||||||||||||||||||||||
XCZU7EG-L2FFVF1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1517 | 464 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VSX315T-L1FF1759C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1759 | no | 3A001.A.7.A | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 0.9V | 1mm | 1759 | OTHER | 0.93V | Field Programmable Gate Arrays | 11.2/2.5V | S-PBGA-B1759 | 720 | 3.1MB | 280 ps | 720 | 720 | 1098MHz | 314880 | 24600 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | |||||||||||||||||||||||||||||||||||||||||||
XCZU17EG-L1FFVB1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1517 | 644 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
EFR-DI-PCIX64-VE-SITE | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-1FFVD1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 308 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCR3256XL10TQ144C0771 | Xilinx |
Min: 1 Mult: 1 |
70°C | 0°C | Non-RoHS Compliant | TQFP | 3.3V | No | EEPROM | 10 | 10 ns | 105MHz | 16 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-1FFVE1924E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1924-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 668 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV150-6BGG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2.55mm | RoHS Compliant | 27mm | 27mm | 256 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 250 | 2.5V | 1.27mm | 256 | OTHER | 85°C | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B256 | 333MHz | 164674 | FIELD PROGRAMMABLE GATE ARRAY | 864 | 0.6 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9EG-L2FFVB1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Bulk | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 328 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
XCV400-4BG352C | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU17EG-2FFVD1760I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 308 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
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