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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | Supplied Contents | License - User Details | Media Delivery Type | License Length | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z020-2CLG400CES | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 766MHz | RoHS Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | XC7Z020 | 400-CSPBGA (17x17) | 130 | DMA | ARM | 256KB | MCU, FPGA | 766MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 85K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XQ4028EX-4HQ240N | Xilinx |
Min: 1 Mult: 1 |
Bulk | 3 (168 Hours) | CMOS | 4.1mm | Non-RoHS Compliant | 32mm | 32mm | Contains Lead | 240 | 240 | 3A001.A.2.C | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 5V | 0.5mm | 240 | MILITARY | 125°C | -55°C | 5.5V | 4.5V | 30 | Field Programmable Gate Arrays | 5V | Not Qualified | MIL-PRF-38535 | 193 | 143MHz | 1024 CLBS, 18000 GATES | 50000 | FIELD PROGRAMMABLE GATE ARRAY | 2432 | 18000 | 1024 | 2.2 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-1SFVA625E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 625-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | NOT SPECIFIED | NOT SPECIFIED | 180 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV200-6FG456I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2.6mm | Non-RoHS Compliant | FBGA | 23mm | 23mm | 456 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 1mm | 456 | 2.625V | 2.375V | 30 | Field Programmable Gate Arrays | 1.2/3.62.5V | Not Qualified | S-PBGA-B456 | 284 | 284 | 333MHz | 1176 CLBS, 236666 GATES | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 236666 | 1176 | 0.6 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-1SFVA625I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 625-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 180 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XQ4013XL3BG256N | Xilinx |
Min: 1 Mult: 1 |
Bulk | 3 (168 Hours) | CMOS | 2.55mm | Non-RoHS Compliant | 27mm | 27mm | Contains Lead | 256 | 3A001.A.2.C | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1.27mm | 256 | MILITARY | 125°C | -55°C | 3.6V | 3V | 30 | Field Programmable Gate Arrays | 3.3V | Not Qualified | S-PBGA-B256 | MIL-PRF-38535 | 192 | 192 | 166MHz | 576 CLBS, 10000 GATES | 30000 | FIELD PROGRAMMABLE GATE ARRAY | 1368 | 10000 | 576 | 1.6 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2FFG676E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.24mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV400-5BGG560C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | RoHS Compliant | 42.5mm | 42.5mm | 560 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 560 | OTHER | 85°C | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B560 | 294MHz | 468252 | FIELD PROGRAMMABLE GATE ARRAY | 2400 | 0.7 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-3FFG676E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 1GHz | 3.24mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -3 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC4VFX40-12FFG672CS1 | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 85°C | 0°C | CMOS | 3mm | RoHS Compliant | FCBGA | 27mm | 27mm | 1.2V | 672 | yes | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1.2V | 1mm | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | S-PBGA-B672 | 324kB | 12 | 352 | 352 | 1181MHz | 4656 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 41904 | 4656 | 0.15 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-2SBVA484I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 484-BFBGA, FCBGA | 11 Weeks | 484-FCBGA (19x19) | 82 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX30T-2FF323C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 19mm | 19mm | 1V | 323 | EAR99 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 323 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 172 | 162kB | 2 | 172 | 172 | 30720 | 2400 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XAZU2EG-1SFVC784Q | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~125°C TJ | Tray | 4 (72 Hours) | CMOS | 3.32mm | ROHS3 Compliant | /files/xilinxinc-xazu5ev1sfvc784q-datasheets-4797.pdf | 784-BFBGA, FCBGA | 23mm | 23mm | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B784 | 128 | DMA, WDT | 1.2MB | MPU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, I2C, SPI, UART/USART, USB | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC95108-10PCG84C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 | 70°C | 0°C | CMOS | RoHS Compliant | PLCC | 29.41mm | 3.68mm | 29.41mm | 5V | 84 | 5.25V | 4.75V | 84 | yes | EAR99 | YES | No | e3 | Matte Tin (Sn) | QUAD | J BEND | 245 | 5V | 1.27mm | 84 | COMMERCIAL | 30 | Programmable Logic Devices | 69 | FLASH | 10 | 10 ns | 66.7MHz | 0 DEDICATED INPUTS, 69 I/O | 108 | MACROCELL | 8 | YES | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-3FBG676E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | 2.54mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4559.pdf | 676-BBGA, FCBGA | 27mm | 27mm | 676 | 10 Weeks | 1.05V | 950mV | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | Copper, Silver, Tin | e1 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | NOT SPECIFIED | S-PBGA-B676 | 130 | DMA | ARM | 256KB | 3 | 110 ps | MCU, FPGA | 343800 | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 275K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC2S100-5PQ208Q | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 4.1mm | Non-RoHS Compliant | PQFP | 28mm | 28mm | 2.5V | 208 | 208 | no | EAR99 | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 208 | AUTOMOTIVE | 125°C | -40°C | 2.625V | 30 | Field Programmable Gate Arrays | Not Qualified | 140 | 263MHz | 600 CLBS, 100000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 2700 | 100000 | 600 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-L2SBG485I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | 2.44mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4559.pdf | 484-FBGA, FCBGA | 19mm | 19mm | 485 | 10 Weeks | 1.05V | 950mV | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B485 | 130 | DMA | ARM | 256KB | 100 ps | MCU, FPGA | 157200 | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX220T1FF1738CS1 | Xilinx |
Min: 1 Mult: 1 |
85°C | 0°C | Non-RoHS Compliant | FCBGA | 1V | No | 954kB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5EG-L1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC4052XLA-09BG432I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 100°C | -40°C | CMOS | 1.7mm | Non-RoHS Compliant | BGA | 40mm | 40mm | 3.3V | 432 | no | CAN ALSO USE 100000 GATES | No | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1.27mm | 432 | 3.6V | 30 | Field Programmable Gate Arrays | 7.6kB | 9 | 352 | 4576 | 352 | 227MHz | FIELD PROGRAMMABLE GATE ARRAY | 33000 | 1.1 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-1FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6VHX380T-2FFG1924C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.85mm | RoHS Compliant | FCBGA | 45mm | 45mm | 1V | 1924 | yes | 3A001.A.7.B | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 640 | 3.4MB | 2 | 640 | 382464 | 29880 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4EV-2FBVB900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5eg2fbvb900e-datasheets-4584.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3S1400A-5FT256C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | 17mm | 17mm | 1.2V | 256 | 256 | EAR99 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 240 | 1.2V | 1mm | 256 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.33.3V | Not Qualified | 161 | 72kB | 5 | 148 | 770MHz | 1.4e+06 | 25344 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | 1400000 | 0.62 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CK-U1-ZCU1285-G-J | Xilinx |
Min: 1 Mult: 1 |
download | Transceiver | Zynq® UltraScale+™ | 1 (Unlimited) | ROHS3 Compliant | /files/xilinxinc-cku1zcu1285gj-datasheets-8900.pdf | Board(s), Cable(s), Accessories - Power Supply Not Included - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3S200AN-4FTG256C4346 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-CLAUSE74-FEC-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | /files/xilinxinc-efdiclause74fecproj-datasheets-4572.pdf | 2 Weeks | Site | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7K325T-2FFV900I | Xilinx |
Min: 1 Mult: 1 |
3.35mm | Non-RoHS Compliant | 31mm | 31mm | 900 | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | INDUSTRIAL | 100°C | -40°C | 1.03V | 0.97V | NOT SPECIFIED | S-PBGA-B900 | 25475 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 25475 | 0.61 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-25GBASE-KR-PROJ | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | /files/xilinxinc-efdi25gemacproj-datasheets-4573.pdf | 2 Weeks | Project | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV100-4FGG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 17mm | 17mm | 256 | yes | EAR99 | 8542.39.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | OTHER | 85°C | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B256 | 250MHz | 108904 | FIELD PROGRAMMABLE GATE ARRAY | 600 | 0.8 ns |
