Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Propagation Delay | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | Combinatorial Delay of a CLB-Max |
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XCVU9P-L2FLVA2577E | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC9536XL-10VQ64C0962 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S1000-4FGG456I0974 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S1000-4FT256C0961 | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | Non-RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/xilinx-xc3s10004ft256c0961-datasheets-3725.pdf | 1.2V | 6 Weeks | 1.26V | 1.14V | 256 | Lead, Tin | 54kB | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV600-4FGG680I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | RoHS Compliant | 40mm | 40mm | 680 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 2.5V | 1mm | 680 | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B680 | 250MHz | 661111 | FIELD PROGRAMMABLE GATE ARRAY | 3456 | 0.8 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XQ5VLX220T-2EF1738I | Xilinx |
Min: 1 Mult: 1 |
CMOS | 3.5mm | Non-RoHS Compliant | 42.5mm | 42.5mm | 1738 | 3A991.D | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 1738 | INDUSTRIAL | 100°C | -40°C | 1.05V | 0.95V | NOT SPECIFIED | Field Programmable Gate Arrays | 12.5V | Not Qualified | S-PBGA-B1738 | 680 | 680 | 1265MHz | FIELD PROGRAMMABLE GATE ARRAY | 221184 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX550T-L1FFG1760C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.5mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vlx550tl1ffg1760c-datasheets-4463.pdf | FCBGA | 42.5mm | 42.5mm | 900mV | 6 Weeks | 1760 | yes | 3A001.A.7.A | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 0.9V | 1mm | OTHER | 0.93V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | 1200 | 2.8MB | 1098MHz | 549888 | 42960 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | |||||||||||||||||||||||||||||||||||||||||||||||
XCZU7CG-1FFVC1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7V585T-L2FF1157E | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | 0°C | CMOS | Non-RoHS Compliant | FCBGA | 1V | 1156 | No | BOTTOM | BALL | 1mm | Field Programmable Gate Arrays | 11.8V | S-PBGA-B1156 | 600 | 3.5MB | 100 ps | 600 | 728400 | 600 | 1818MHz | 582720 | 45525 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z045-3FFG900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 1GHz | 3.35mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 31mm | 1V | 900 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z045 | 1.05V | 30 | S-PBGA-B900 | 130 | ROMless | DMA | ARM | 256KB | 32b | -3 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | |||||||||||||||||||||||||||||||||||||||
XC3S100E-4VQ100CS1 | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc3s100e4vq100cs1-datasheets-4911.pdf | 1.2V | 100 | 100 | no | EAR99 | No | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 1.2V | 0.5mm | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 9kB | 4 | 59 | 1920 | 572MHz | FIELD PROGRAMMABLE GATE ARRAY | 2160 | 240 | 0.76 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7CG-L2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV2004PQ240CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7CG-2FFVC1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV1000E-8FG860CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9CG-1FFVB1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 328 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VCX195T-1FF784I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | CMOS | RoHS Compliant | FCBGA | 29mm | 29mm | 1V | 784 | no | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1V | 784 | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | S-PBGA-B784 | 400 | 1.5MB | 1 | 400 | 249600 | 400 | 199680 | 15600 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9CG-L2FFVC900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Bulk | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2S50E-6TQ144I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 100°C | -40°C | CMOS | Non-RoHS Compliant | TQFP | 20mm | 20mm | 1.8V | 144 | 144 | no | EAR99 | MAXIMUM USABLE GATES = 50000 | No | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 1.8V | 0.5mm | 144 | 1.89V | 30 | Field Programmable Gate Arrays | 4kB | 6 | 182 | 357MHz | 384 CLBS, 23000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 1728 | 23000 | 384 | 0.47 ns | ||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EV-2FFVF1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XA3S50-4VQG100Q | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 125°C | -40°C | 1.2mm | RoHS Compliant | TQFP | 1.2V | 100 | 100 | yes | EAR99 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 100 | AUTOMOTIVE | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | 63 | 9kB | 4 | 124 | 125MHz | 50000 | 1728 | 192 | FIELD PROGRAMMABLE GATE ARRAY | 192 | ||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU15EG-2FFVB1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 328 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV100E-8FG256CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU17EG-2FFVB1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 644 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV50-6CS144I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.2mm | Non-RoHS Compliant | BGA | 12mm | 12mm | 144 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 144 | 2.625V | 2.375V | 30 | Field Programmable Gate Arrays | 1.2/3.62.5V | Not Qualified | 94 | 94 | 333MHz | 384 CLBS, 57906 GATES | FIELD PROGRAMMABLE GATE ARRAY | 1728 | 57906 | 384 | 0.6 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-L2FFVB1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1517 | 644 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV150-5FGG256I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 17mm | 17mm | 256 | yes | EAR99 | 8542.39.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B256 | 294MHz | 164674 | FIELD PROGRAMMABLE GATE ARRAY | 864 | 0.7 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-L1FFVC1760I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1760 | 512 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV400E-8PQ240CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU17EG-L1FFVC1760I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1760 | 512 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
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