Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Screening Level | Number of I/O | Memory Type | Peripherals | RAM Size | Turn On Delay Time | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
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XCV100-5CS144CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC95108-7PCG84I | Xilinx |
Min: 1 Mult: 1 |
3 | 85°C | -40°C | CMOS | RoHS Compliant | PLCC | 29.3116mm | 29.3116mm | 5V | 84 | 84 | yes | EAR99 | No | e3 | Matte Tin (Sn) | YES | QUAD | J BEND | 245 | 5V | 84 | INDUSTRIAL | 30 | Programmable Logic Devices | 69 | FLASH | 7 | 7.5 ns | 83.3MHz | 0 DEDICATED INPUTS, 69 I/O | 108 | MACROCELL | 8 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX250T-1FFG1154I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vhx250t1ffg1154i-datasheets-3197.pdf | FCBGA | 35mm | 35mm | 1V | 6 Weeks | 1154 | yes | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | INDUSTRIAL | 30 | Field Programmable Gate Arrays | Not Qualified | 320 | 2.2MB | 1 | 320 | 251904 | 19680 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | |||||||||||||||||||||||||||||||||||||||||||||||
XCR3384XL-12FGG324I | Xilinx |
Min: 1 Mult: 1 |
3 | 85°C | -40°C | CMOS | 2.5mm | RoHS Compliant | FBGA | 23mm | 23mm | 3.3V | 324 | yes | 3A991.D | YES | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 250 | 3.3V | 1mm | 324 | INDUSTRIAL | 3.6V | 30 | Programmable Logic Devices | 220 | EEPROM | 12 | 12 ns | 83MHz | 0 DEDICATED INPUTS, 220 I/O | 384 | MACROCELL | 24 | EE PLD | YES | YES | |||||||||||||||||||||||||||||||||||||||||
XA3S700A-4FGG484I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 100°C | -40°C | CMOS | 2.6mm | RoHS Compliant | FBGA | 23mm | 23mm | 1.2V | 484 | 484 | 3A991.D | e1 | BOTTOM | BALL | 250 | 1.2V | 1mm | 484 | INDUSTRIAL | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.33.3V | Not Qualified | AEC-Q100 | 372 | 45kB | 4 | 288 | 667MHz | 700000 | 13248 | 1472 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||
XC95216-10PQG160I | Xilinx |
Min: 1 Mult: 1 |
3 | 85°C | -40°C | CMOS | 3.7mm | RoHS Compliant | PQFP | 5V | 160 | 160 | yes | EAR99 | 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | No | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 245 | 5V | 0.65mm | 160 | INDUSTRIAL | 30 | Programmable Logic Devices | 133 | FLASH | 10 ns | 10 | 10 ns | 66.7MHz | 0 DEDICATED INPUTS, 133 I/O | 216 | MACROCELL | 8 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||
XCV400E8BG560I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | BGA | 42.5mm | 42.5mm | 560 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1.27mm | 560 | 1.89V | 1.71V | 30 | Field Programmable Gate Arrays | 1.2/3.61.8V | Not Qualified | 404 | 404 | 416MHz | 2400 CLBS, 129600 GATES | FIELD PROGRAMMABLE GATE ARRAY | 10800 | 129600 | 2400 | 0.4 ns | |||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX550T-L1FFG1759C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | 3.5mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vlx550tl1ffg1759c-datasheets-4406.pdf | FCBGA | 42.5mm | 42.5mm | 900mV | 6 Weeks | 1759 | yes | 3A001.A.7.A | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 0.9V | 1mm | OTHER | 0.93V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | 840 | 2.8MB | 840 | 1098MHz | 549888 | 42960 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | ||||||||||||||||||||||||||||||||||||||||||
XCZU5EG-2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XA3S400-4FTG256I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 100°C | -40°C | 1.55mm | RoHS Compliant | 17mm | 17mm | 1.2V | 256 | 256 | yes | EAR99 | e1 | BOTTOM | BALL | 260 | 1.2V | 1mm | 256 | INDUSTRIAL | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | AEC-Q100 | 173 | 36kB | 4 | 264 | 125MHz | 400000 | 8064 | 896 | FIELD PROGRAMMABLE GATE ARRAY | 896 | |||||||||||||||||||||||||||||||||||||||||||||
XCZU6EG-L1FFVC900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX380T-2FF1155C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 35mm | 35mm | 1V | 1155 | no | 3A991.D | No | e0 | TIN LEAD | BOTTOM | BALL | 1V | 1mm | 1156 | OTHER | 1.05V | Field Programmable Gate Arrays | S-PBGA-B1155 | 440 | 3.4MB | 2 | 220 ps | 440 | 440 | 382464 | 29880 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EV-L1FBVB900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||
XQ4VLX40-10FF668M | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | CMOS | 2.85mm | Non-RoHS Compliant | 27mm | 27mm | 668 | no | 3A001.A.2.C | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.2V | 1mm | 668 | MILITARY | 125°C | -55°C | 1.26V | 1.14V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | S-PBGA-B668 | 448 | 448 | 1028MHz | 4608 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 41472 | 4608 | |||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-1FFVC1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2S50E-6TQ144Q | Xilinx |
Min: 1 Mult: 1 |
download | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/xilinx-xc2s50e6tq144q-datasheets-5601.pdf | 144 | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 0.5mm | Field Programmable Gate Arrays | 1.2/3.61.8V | Not Qualified | S-PQFP-G144 | 98 | 102 | 357MHz | 50000 | 384 | FIELD PROGRAMMABLE GATE ARRAY | 1728 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z100-2FF900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | Non-RoHS Compliant | 2016 | /files/xilinxinc-xc7z0452ff900i-datasheets-4853.pdf | 900-BBGA, FCBGA | 10 Weeks | 212 | DMA | 256KB | MCU, FPGA | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 444K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC95108TM | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9EG-L1FFVB1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Bulk | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 328 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCR3512XL-10FGG324C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 3 | 70°C | 0°C | CMOS | 2.5mm | RoHS Compliant | 1996 | /files/xilinx-xcr3512xl10fgg324c-datasheets-6130.pdf | FBGA | 23mm | 23mm | 3.3V | 324 | 6 Weeks | 324 | yes | 3A991.D | YES | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 250 | 3.3V | 1mm | 324 | COMMERCIAL | 3.6V | 30 | Programmable Logic Devices | Not Qualified | 260 | EEPROM | 10 | 10 ns | 97MHz | 12000 | 512 | MACROCELL | 32 | EE PLD | YES | YES | ||||||||||||||||||||||||||||||||||||
XCZU6EG-L1FFVB1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 328 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
XC7A100T-2FGG484I0880 | Xilinx | $42.04 |
Min: 1 Mult: 1 |
Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/xilinx-xc7a100t2fgg484i0880-datasheets-6532.pdf | 7 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-1FFVB1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 644 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV300E-7FG256CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-1FFVC1760I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VTX240T-1FFG1759I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1759 | No | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | Field Programmable Gate Arrays | 680 | 1.4MB | 1 | 680 | 239616 | 18720 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-1FFVB1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 644 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC9536-15VQ44Q | Xilinx |
Min: 1 Mult: 1 |
3 | 125°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 1998 | /files/xilinx-xc953615vq44q-datasheets-7561.pdf | 10mm | 10mm | 5V | 44 | 44 | EAR99 | YES | No | e0 | TIN LEAD | YES | QUAD | GULL WING | 225 | 5V | 44 | AUTOMOTIVE | 30 | Programmable Logic Devices | 34 | FLASH | 15 | 5 ns | 100MHz | 34 I/O | 36 | MACROCELL | 8 | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-L2FFVC1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 360 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
XC2V3000-4BFG957C | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 85°C | 0°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 1.5V | 957 | yes | 3A991.D | No | e1 | YES | BOTTOM | BALL | 245 | 1.5V | 1.27mm | 957 | OTHER | 1.575V | 30 | S-PBGA-B957 | 216kB | 4 | 28672 | 650MHz | FIELD PROGRAMMABLE GATE ARRAY | 3000000 |
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