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ContactApplication Specific Microcontrollers(1956)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | Thickness | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Supply Current-Max | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Data Rate | Memory Size | Number of I/O | Memory Type | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | On Chip Program ROM Width | CPU Family | ROM (words) | Access Time | Clock Frequency | Core Processor | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MM912I637AM2EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | BICMOS | 0.9mm | ROHS3 Compliant | 2012 | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 26 Weeks | LIN, SCI, SPI | EAR99 | 1 | e3 | Matte Tin (Sn) | Battery Monitor | YES | 2.25V~5.5V | QUAD | NO LEAD | 260 | 0.5mm | MM912I637 | 3.5V | 1 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | YES | Power Management Circuits | 25mA | Not Qualified | 8 | 6K x 8 | S12 | FLASH (96KB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634DV2AP | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | 48-LQFP | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | 2.25V~5.5V | 260 | MM912G634 | ANALOG CIRCUIT | 40 | 9 | 2K x 8 | S12 | FLASH (48kB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MSP430TEXAS2IZQER | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | MSP430 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TUSB3200ACPAH | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TUSB3200 | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 55mA | ROHS3 Compliant | 52-TQFP | 10mm | 1.2mm | 10mm | 5V | Lead Free | 52 | 258.292505mg | 52 | I2C, USB | 1mm | ALSO HAVING SECONDARY DIGITAL SUPPLY 5V(TYP). | Gold | No | e4 | USB Streaming Controller | 3V~3.6V | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 52 | 12 Mbps | 2 | ROM | 8.25K x 8 | MICROPROCESSOR CIRCUIT | 8052 | ROM (4kB) | TUSB | ||||||||||||||||||||||||||||||||||||||||||||||||
| Z9023106PSC | Zilog |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 6MHz | 4.45mm | Non-RoHS Compliant | 2002 | 42-DIP (0.600, 15.24mm) | 36.83mm | Contains Lead | 42 | I2C, 2-Wire Serial | no | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | TV Controller | 4.5V~5.5V | DUAL | NOT SPECIFIED | 5V | 1.778mm | Z90231 | 42 | NOT SPECIFIED | Microcontrollers | 5V | 40mA | Not Qualified | R-PDIP-T42 | 24kB | 27 | EPROM, OTP | 236 x 8 | 8b | MICROCONTROLLER | 8 | YES | NO | YES | NO | OTPROM | Z8 | 24576 | 6 μs | Z8 | OTP (24kB) | Digital Television Controller (DTC) | |||||||||||||||||||||||||||||||||||||
| MM912H634DV1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP Exposed Pad | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | 2.25V~5.5V | 260 | MM912H634 | ANALOG CIRCUIT | 40 | 9 | 6K x 8 | S12 | FLASH (64kB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7001CGHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | 2011 | 32-VFQFN Exposed Pad | 18 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGTK2/T0B040X | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~90°C TA | Tape & Reel (TR) | 2011 | 8-VDFN Exposed Pad | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PM5980B-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 1932 | 3 Weeks | 1 | Network Processor | YES | BOTTOM | BALL | TELECOM CIRCUIT | S-PBGA-B1932 | OTN | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TLE9832-2QX | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~150°C TJ | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/rochesterelectronicsllc-tle98322qx-datasheets-3769.pdf | 48-VFQFN Exposed Pad | LIN, SSI, UART | Automotive | 3V~27V | PG-VQFN-48-31 | 11 | 3.25K x 8 | XC800 | FLASH (36kB) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7001CGHN1/T1AGBWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | 22 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7003CGHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7001CMHN1/T1AGCEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -25°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2011 | /files/nxpusainc-a7001aghn1t1ag315-datasheets-3241.pdf | I2C, 2-Wire Serial | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYUSB2014-BZXIT | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB FX3™ | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 2011 | /files/cypresssemiconductorcorp-cyusb3acc007-datasheets-5507.pdf | 121-TFBGA | 1.2V | 9 Weeks | 227.901816mg | 1.25V | 1.15V | 121 | I2C, I2S, MMC/SD, SPI, UART, USB | SuperSpeed USB Peripheral Controller | 1.15V~1.25V | 121-FBGA (10x10) | 59 | ARM | 512K x 8 | ARM9® | External Program Memory | CYUSB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGTK2/T0B0405 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~90°C TA | Tape & Reel (TR) | 2011 | 8-VDFN Exposed Pad | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CEC1702Q-C2-I/SX | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 0.8mm | ROHS3 Compliant | /files/microchiptechnology-ma990004-datasheets-6606.pdf | 84-WFBGA | 7mm | 7mm | 84 | 5 Weeks | I2C, SPI, UART | Cryptography | YES | 1.71V~3.465V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | CEC1702 | NOT SPECIFIED | S-PBGA-B84 | TS 16949 | 65 | 480KB | 48 MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | FLASH | 8 | 48MHz | ARM® Cortex®-M4F | ||||||||||||||||||||||||||||||||||||||||||||||||||
| A7001CGHN1/T1AGAEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C | 2011 | 32-VFQFN Exposed Pad | 22 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634DC2APR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP | 18 Weeks | LIN, SCI | Automotive | 2.25V~5.5V | MM912G634 | 9 | 2K x 8 | S12 | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634DV1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP Exposed Pad | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | 2.25V~5.5V | 260 | MM912G634 | ANALOG CIRCUIT | 40 | 9 | 2K x 8 | S12 | FLASH (48kB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912F634DV1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | YES | 2.25V~5.5V | QUAD | GULL WING | 260 | 7V | 0.5mm | MM912F634 | 40 | S-PQFP-G48 | 9 | 2K x 8 | MICROPROCESSOR CIRCUIT | S12 | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WIN860M6NHEI-300A1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 18 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7005CGHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | 2011 | 32-VFQFN Exposed Pad | 22 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C63743C-QXC | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | enCoRe™ | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | ROHS3 Compliant | /files/rochesterelectronicsllc-cy7c63743cqxc-datasheets-3739.pdf | 24-SSOP (0.154, 3.90mm Width) | PS/2, USB | USB Microcontroller | 3.5V~5.5V | 24-QSOP | 16 | 256 x 8 | M8B | OTP (8kB) | CY7C637xx | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WIN867W6NHEI-350A1 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 8 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7002CMHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -40°C~90°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2011 | /files/nxpusainc-a7001aghn1t1ag315-datasheets-3241.pdf | 25 Weeks | I2C, 2-Wire Serial | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7001CUHN1/T1AAKEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 26 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912F634DV2AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | YES | 2.25V~5.5V | QUAD | GULL WING | 260 | 7V | 0.5mm | MM912F634 | 40 | S-PQFP-G48 | 9 | 2K x 8 | MICROPROCESSOR CIRCUIT | S12 | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7004CIHN1/T1AGBAJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912F634DV2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | YES | 2.25V~5.5V | QUAD | GULL WING | 260 | 7V | 0.5mm | MM912F634 | 40 | S-PQFP-G48 | 9 | 2K x 8 | MICROPROCESSOR CIRCUIT | S12 | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PM5990B-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 1932 | 3 Weeks | 1 | Network Processor | YES | BOTTOM | BALL | TELECOM CIRCUIT | S-PBGA-B1932 |
