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ContactApplication Specific Microcontrollers(1956)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Number of Pins | Interface | Number of Ports | ECCN Code | Radiation Hardening | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Subcategory | JESD-30 Code | Supplier Device Package | Data Rate | Number of I/O | Memory Type | Core Architecture | RAM Size | uPs/uCs/Peripheral ICs Type | Bus Compatibility | Data Transfer Rate-Max | Core Processor | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A7004CGHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||
| WIN867M6NHEI-300A1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 18 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MM912H634DM1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP Exposed Pad | 16 Weeks | LIN, SCI | e3 | Matte Tin (Sn) | Automotive | 2.25V~5.5V | 260 | MM912H634 | ANALOG CIRCUIT | 40 | 9 | 6K x 8 | S12 | FLASH (64kB) | HCS12 | ||||||||||||||||||||||||||||||||||||
| PM5990B-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 1932 | 3 Weeks | 1 | Network Processor | YES | BOTTOM | BALL | TELECOM CIRCUIT | S-PBGA-B1932 | |||||||||||||||||||||||||||||||||||||||||||||||
| PM5441A-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | Network Processor | OTN | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGUK/T0B0407, | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~90°C TA | Tape & Reel (TR) | 2011 | 12-UFBGA, WLCSP | 16 Weeks | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||
| A7004CMHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||
| A7102CGHN1/T0B041J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | |||||||||||||||||||||||||||||||||||||||||||||||
| A7102CGUK/T0B0494Z | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | Tape & Reel (TR) | 2011 | 12-UFBGA, WLCSP | 16 Weeks | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||
| PM5981B-FEI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 1932 | 5 Weeks | 1 | YES | BOTTOM | BALL | TELECOM CIRCUIT | S-PBGA-B1932 | ||||||||||||||||||||||||||||||||||||||||||||||||
| WP3161W6NFEI-320B1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | 896-FCBGA (31x31) | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||
| WP3160W6NFEI-320B1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | 896-BGA, FCBGA | 7 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
| WP3232M6NFEI-320B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| A7002CGHN1/T1AG502 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||||
| WP33C2D4NFEI-450B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 6 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| WP33C2A1EFEI-450B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 6 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| WP34C2R4EFEI-400B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| WP32C2M6NHEI-400B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| WP3160W3NFEI-320B1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microchiptechnology-wp3160w3nfei320b1-datasheets-3685.pdf | 896-BGA, FCBGA | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
| A7002CIHN1/T1AGBEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C | 2011 | 32-VFQFN Exposed Pad | 14 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||
| WIN847W6NHEI-250A1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 18 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP32C2W3EFEI-320B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 8 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| A7102CGTK2/T0B042J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | Tape & Reel (TR) | 2011 | 8-VDFN Exposed Pad | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | |||||||||||||||||||||||||||||||||||||||||||||||
| A7005CGHN1/T1AGBFJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | 26 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||||||
| WP34C2R6NFEI450B2R | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | 1997 | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 6 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||
| A7101CGHN1/T0B0406 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~90°C TA | Tape & Reel (TR) | 2011 | 32-VFQFN Exposed Pad | 20 Weeks | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||||||
| CYUSB3031-BZXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB FX3S™ | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | /files/cypresssemiconductorcorp-cyusb3033bzxc-datasheets-3571.pdf | 121-TFBGA | 10mm | 10mm | 3.6V | Lead Free | 121 | 9 Weeks | 227.901816mg | 121 | GPIF, I2C, I2S, MMC/SD/SDIO, SPI, UART | 2 | 3A991.A.3 | No | e1 | TIN SILVER COPPER | USB Host/Peripheral Controller | YES | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 121 | 40 | Bus Controllers | 5 Gbps | 60 | 256K x 8 | BUS CONTROLLER, UNIVERSAL SERIAL BUS | I2C | 185 MBps | ARM9® | External Program Memory | CYUSB | ||||||||||||||
| WP3161R4NFEI-320B1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | 1997 | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| WP32C2W6NFEI-400B2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | 6 Weeks | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| KSZ8692PB | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | KSZx692 | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2008 | /files/microchiptechnology-ksz8692pb-datasheets-3605.pdf | 400-BGA | 27mm | 1.83mm | 27mm | Lead Free | 400 | 8 Weeks | 400 | EBI/EMI, Ethernet, I2C, I2S,PCI, SPI, UART/USART, USB | No | 8542.39.00.01 | 1 | e1 | TIN SILVER COPPER | Networking and Communications | 1.235V~1.365V | BOTTOM | BALL | 250 | 1.3V | KSZ8692 | SUPPORT CIRCUIT | 40 | 20 | External Program Memory | ARM | ARM9® | External Program Memory | KSZ |
