Products
Manufacturer
RFQ
NEWS
ContactApplication Specific Microcontrollers(1956)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Interface | ECCN Code | HTS Code | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Number of I/O | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM (words) | Clock Frequency | Core Processor | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ASC8852AETE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-asc8849aete-datasheets-3310.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8852 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||
| PNX9531E/V140,518 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | /files/nxpusainc-pnx9531ev140518-datasheets-3407.pdf | 456-BGA | GPIO, Host Interface, I2C, PCI, USB, XIO | Multimedia | 1.16V~1.24V 3.15V~3.6V | 8 | TriMedia™ | Nexperia | |||||||||||||||||||||||||||||||||||||||||
| PAC5220QS-WP01 | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PAC52xx | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | /files/qorvousinc-pac5220qswp01-datasheets-3410.pdf | 56-WFQFN Exposed Pad | I2C, SPI, SWD, UART | Smart Energy Appliances, Devices, and Equipment | 56-TQFN (8x8) | 28 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32KB) | PAC™ | ||||||||||||||||||||||||||||||||||||||
| EM783-SCE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2003 | /files/nxpusainc-em783mc6e-datasheets-3334.pdf | 32-VQFN Exposed Pad | I2C, IrDA, SPI, UART/USART | Energy Measurement | 2.6V~3.6V | 32-HVQFN (7x7) | 22 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32kB) | |||||||||||||||||||||||||||||||||||||
| PAC5220QS | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PAC52xx | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | RoHS Compliant | /files/qorvousinc-pac5220qs-datasheets-3412.pdf | 56-WFQFN Exposed Pad | 10 Weeks | I2C, SPI, SWD, UART | Smart Energy Appliances, Devices, and Equipment | POWER SUPPLY MANAGEMENT CIRCUIT | 28 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32KB) | PAC™ | ||||||||||||||||||||||||||||||||||||
| ASC8851AETK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | 484-TFBGA | 26 Weeks | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8851 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||
| PAC5223QM | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PAC52xx | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | RoHS Compliant | /files/qorvousinc-pac5223qm-datasheets-3415.pdf | 48-WFQFN Exposed Pad | 10 Weeks | I2C, SPI, SWD, UART | Smart Energy Appliances, Devices, and Equipment | POWER SUPPLY MANAGEMENT CIRCUIT | 25 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32KB) | PAC™ | ||||||||||||||||||||||||||||||||||||
| ASC8850AETE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-asc8849aete-datasheets-3310.pdf | 484-TFBGA | 13 Weeks | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8850 | ARM9® | |||||||||||||||||||||||||||||||||||||||||
| PNX9535E/V1,518 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | /files/nxpusainc-pnx9531ev140518-datasheets-3407.pdf | 456-BGA | GPIO, Host Interface, I2C, PCI, USB, XIO | Multimedia | 1.16V~1.24V 3.15V~3.6V | 8 | TriMedia™ | Nexperia | |||||||||||||||||||||||||||||||||||||||||
| A7005CGHN1/T1AGGEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | 1 (Unlimited) | 2011 | /files/nxpusainc-a7005cghn1t1aggel-datasheets-3374.pdf | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||
| PAC5255QF | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PAC52xx | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | RoHS Compliant | /files/qorvousinc-pac5255qf-datasheets-3426.pdf | 57-WFQFN Exposed Pad | 10 Weeks | I2C, SPI, SWD, UART | Smart Energy Appliances, Devices, and Equipment | 1.8V 3.3V 5V | POWER SUPPLY MANAGEMENT CIRCUIT | 25 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32kB) | PAC™ | |||||||||||||||||||||||||||||||||||
| ASC8850AETK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | 484-TFBGA | 13 Weeks | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8850 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||
| PAC5253QA | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PAC52xx | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | RoHS Compliant | /files/qorvousinc-pac5253qa-datasheets-3429.pdf | 43-WFQFN Exposed Pad | 10 Weeks | I2C, SPI, SWD, UART | Smart Energy Appliances, Devices, and Equipment | 1.8V 3.3V 5V | POWER SUPPLY MANAGEMENT CIRCUIT | 25 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32kB) | PAC™ | |||||||||||||||||||||||||||||||||||
| MM908E626AVPEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~115°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2003 | /files/nxpusainc-mm908e626avpek-datasheets-3282.pdf | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | 18 Weeks | SCI, SPI | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | Automotive Mirror Control | 8V~18V | 260 | MM908E626 | 40 | 13 | 512 x 8 | MICROCONTROLLER | HC08 | FLASH (16kB) | 908E | |||||||||||||||||||||||||||
| PAC5232AQX | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PAC52xx | Surface Mount | -40°C~105°C | Not Applicable | RoHS Compliant | 51-VFQFN Exposed Pad | 10 Weeks | I2C, SPI, SWD, UART | Motor Control | 1.8V | 29 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32KB) | PAC™ | ||||||||||||||||||||||||||||||||||||||
| ASC8848AETE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-asc8849aete-datasheets-3310.pdf | 484-TFBGA | 13 Weeks | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8848 | ARM9® | |||||||||||||||||||||||||||||||||||||||||
| EM783-SPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-em783mc6e-datasheets-3334.pdf | 32-VQFN Exposed Pad | I2C, IrDA, SPI, UART/USART | Energy Measurement | 2.6V~3.6V | 32-HVQFN (7x7) | 22 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32kB) | |||||||||||||||||||||||||||||||||||||
| A7001CUHN1/T1AGAEL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | 1 (Unlimited) | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||
| MM908E625ACPEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2003 | /files/nxpusainc-mm908e625acpekr2-datasheets-3439.pdf | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | 17.9mm | 7.5mm | 54 | 18 Weeks | SCI, SPI | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | Automotive Mirror Control | YES | 8V~18V | DUAL | GULL WING | 260 | 12V | 0.65mm | 40 | R-PDSO-G54 | 13 | 512 x 8 | 32 MHz | MICROCONTROLLER | YES | NO | YES | NO | 9.8304MHz | HC08 | FLASH (16kB) | 908E | ||||||||||||
| ASC8849AETK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8849 | ARM9® | |||||||||||||||||||||||||||||||||||||||||||
| MM912JP812AMAFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mm912ip812amaf-datasheets-3267.pdf | 100-LQFP Exposed Pad | 14mm | 14mm | 100 | 26 Weeks | CAN, SCI, SPI | 3A991.A.2 | e3 | Matte Tin (Sn) | Engine Control | YES | 4.7V~36V | QUAD | GULL WING | 260 | 0.5mm | MM912JP812 | 40 | S-PQFP-G100 | 8 | 6K x 8 | MICROPROCESSOR CIRCUIT | S12P | FLASH (128kB) | HCS12 | |||||||||||||||||||
| A7001CUHN1/T1AGBEJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | 2011 | 32-VFQFN Exposed Pad | 17 Weeks | I2C | Authentication | 1.62V~5.5V | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||
| A7102CGHN1/T0B04EL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~90°C TA | 1 (Unlimited) | 2011 | 32-VFQFN Exposed Pad | I2C | Authentication | 1.62V~3.6V | MX51 | EEPROM (20kB) | A710x | ||||||||||||||||||||||||||||||||||||||||||
| MM908E626AVPEK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~115°C | Tube | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2003 | /files/nxpusainc-mm908e626avpek-datasheets-3282.pdf | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | 17.9mm | 7.5mm | 54 | 18 Weeks | SCI, SPI | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | Automotive Mirror Control | YES | 8V~18V | DUAL | GULL WING | 260 | 12V | 0.65mm | MM908E626 | 40 | Microcontrollers | 9/16V | Not Qualified | R-PDSO-G54 | 13 | 512 x 8 | 32 MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 16384 | 9.8304MHz | HC08 | FLASH (16kB) | 908E | ||||||
| EM783-MC3E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | /files/nxpusainc-em783mc6e-datasheets-3334.pdf | 32-VQFN Exposed Pad | I2C, IrDA, SPI, UART/USART | Energy Measurement | 2.6V~3.6V | 32-HVQFN (7x7) | 22 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32kB) | |||||||||||||||||||||||||||||||||||||
| ASC8850ET/M2,557 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-asc8848etm2557-datasheets-3271.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8850 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||
| MM912JS812AMAF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | /files/nxpusainc-mm912js812amafr2-datasheets-3330.pdf | 100-LQFP Exposed Pad | 14mm | 14mm | 100 | 18 Weeks | CAN, SCI, SPI | 3A991.A.2 | 8542.39.00.01 | e3 | Matte Tin (Sn) | Engine Control | YES | 4.7V~36V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MM912JS812 | 40 | S-PQFP-G100 | 6 | 8K x 8 | MICROPROCESSOR CIRCUIT | S12XS | FLASH (128kB) | HCS12 | ||||||||||||||||||
| ASC8849ET/M2,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-asc8848etm2557-datasheets-3271.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8849 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||
| ASC8850ET/M2,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-asc8848etm2557-datasheets-3271.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8850 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||
| MM912F634CV2APR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3201.pdf | 48-LQFP | LIN, SCI | Automotive | 2.25V~5.5V | MM912F634 | 9 | 2K x 8 | S12 | FLASH (32KB) | HCS12 |
