| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | REACH SVHC | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Oscillator Type | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Watchdog Timer | Number of Timers/Counters | On Chip Program ROM Width | CPU Family | Number of GPIO | ROM (words) | Number of UART Channels | RAM (words) | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of Serial I/Os | Number of Timers | Number of A/D Converters | RAM (bytes) | Number of DMA Channels | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STM32F437VGT6 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F4 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 168MHz | 1.6mm | ROHS3 Compliant | /files/stmicroelectronics-stm32f437igt6-datasheets-2934.pdf | 100-LQFP | Lead Free | 100 | 12 Weeks | No SVHC | 100 | CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | ACTIVE (Last Updated: 7 months ago) | 5A992.C | No | YES | QUAD | GULL WING | 3.3V | 0.5mm | STM32F437 | 3.6V | 1.7V | Microcontrollers | 2/3.3V | 125mA | 1MB | Internal | 82 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | ARM | 256K x 8 | 32b | 180 MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | Yes | 14 | 8 | CORTEX-M4F | 1048576 | ARM® Cortex®-M4 | 1.8V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | A/D 16x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1024EFF124-E/TL | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, PIC® 32MZ | Surface Mount | -40°C~125°C | Tube | 3 (168 Hours) | CMOS | 0.9mm | ROHS3 Compliant | 2015 | /files/microchiptechnology-pic32mz0512efe064ipt-datasheets-9385.pdf | 124-VFTLA Dual Rows, Exposed Pad | 9mm | 9mm | 124 | 11 Weeks | 8542.31.00.01 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | BOTTOM | BUTT | 3.3V | 0.5mm | PIC32MZ1024EFF | 3.6V | 2.1V | S-XBCC-B124 | AEC-Q100; TS 16949 | Internal | 97 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 256K x 8 | 180MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | MIPS32® M-Class | 2.1V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG | A/D 48x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| TMS5700432BPZQQ1R | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | /files/texasinstruments-tms5700332bpzqq1-datasheets-9770.pdf | 100-LQFP | 14mm | 1.6mm | 14mm | 100 | 6 Weeks | 100 | ACTIVE (Last Updated: 1 day ago) | yes | 1.4mm | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | QUAD | GULL WING | 1.2V | 0.5mm | 5700432 | External | 45 | POR, PWM, WDT | 32K x 8 | 80MHz | MICROCONTROLLER, RISC | 32 | YES | NO | NO | NO | TMS320 | 1 | 32 | YES | YES | FIXED-POINT | NO | 3 | 20 | 80MHz | ARM® Cortex®-R4 | 1.14V~3.6V | FLASH | 16/32-Bit | 384KB 384K x 8 | CANbus, LINbus, MibSPI, SCI, SPI, UART/USART | A/D 16x12b | 16K x 8 | |||||||||||||||||||||||||||||||||||||||||||
| DF2211UFP24V | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | H8® H8S/2200 | Surface Mount | Surface Mount | -20°C~75°C TA | Tray | 3 (168 Hours) | 24MHz | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/renesas-df2211ufp24v-datasheets-0793.pdf | 64-LQFP | Lead Free | 20 Weeks | 64 | SCI, UART, USB | No | DF2211 | 64kB | External | 37 | DMA, POR, PWM, WDT | 8K x 8 | Yes | 3 | 24 μs | H8S/2000 | 2.7V~3.6V | FLASH | 16-Bit | 64KB 64K x 8 | SCI, SmartCard, USB | A/D 6x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK63FN1M0VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 3.6V | 1.71V | 40 | S-PBGA-B144 | Internal | 95 | DMA, I2S, LVD, POR, PWM, WDT | 256K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 41x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC572L64F2BC6AR | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, SPC572Lx | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/stmicroelectronics-spc572l64f2bc6ar-datasheets-0721.pdf | 80-TQFP Exposed Pad | 10mm | 10mm | 80 | 35 Weeks | ACTIVE (Last Updated: 7 months ago) | compliant | YES | QUAD | GULL WING | NOT SPECIFIED | 5V | 0.4mm | SPC572 | 5.5V | 4.5V | NOT SPECIFIED | Internal | DMA, LVD, POR, WDT | 64K x 8 | 80MHz | MICROCONTROLLER, RISC | 32 | YES | YES | NO | 40MHz | e200z2 | 3.3V 5V | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, Ethernet, LINbus, SPI, UART/USART | 32K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAS176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAS | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | YES | QUAD | GULL WING | 1.8V | 0.4mm | 1.9V | 1.7V | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MSP430F2616TPNR | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MSP430F2xx | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 16MHz | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/texasinstruments-msp430f235trgcr-datasheets-9498.pdf | 80-LQFP | 12mm | 1.6mm | 12mm | Lead Free | 80 | 12 Weeks | 465.697616mg | 80 | I2C, IrDA, LIN, SCI, SPI, UART, USART | ACTIVE (Last Updated: 1 week ago) | yes | 1.4mm | EAR99 | No | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | QUAD | GULL WING | 260 | 0.5mm | 80 | 3.6V | 3.3V | Microcontrollers | 0.595mA | 92kB | Internal | 64 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 4K x 8 | 16b | MICROCONTROLLER, RISC | 16 | YES | YES | YES | YES | Yes | 2 | 48 | 4 | YES | YES | FIXED-POINT | NO | 2 | 8 | 4096 | 3 | MSP430 | 1.8V~3.6V | FLASH | 16-Bit | 92KB 92K x 8 + 256B | I2C, IrDA, LINbus, SCI, SPI, UART/USART | A/D 8x12b; D/A 2x12b | |||||||||||||||||||||||||||||||
| R5F564MFCDBG#21 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RX600 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 120MHz | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r5f564mlcdlj21-datasheets-1517.pdf | 176-LFBGA | 13mm | 13mm | 176 | 20 Weeks | 176 | CAN, EBI/EMI, Ethernet, I2C, LIN, MMC, SCI, SD, SPI, UART, USART, USB | yes | YES | BOTTOM | BALL | 3.3V | 0.8mm | 176 | 3.6V | 2.7V | Microcontrollers | 3/3.3V | 110mA | Not Qualified | 2MB | Internal | 127 | DMA, LVD, POR, PWM, WDT | 552K x 8 | MICROCONTROLLER, RISC | 32 | YES | YES | YES | RX | 2097152 | 524288 | 24 | 32 | RXv2 | 2.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB | A/D 29x12b; D/A 2x12b | 64K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||
| MK61FN1M0VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3V | 1mm | MK61FN1M0 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.32.5/3.3V | 177mA | Not Qualified | S-PBGA-B144 | Internal | 95 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 1048576 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 53x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||
| MCF52230CAF60 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5223x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2001 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf52235cal60-datasheets-8797.pdf | 80-LQFP | 14mm | 14mm | 80 | 10 Weeks | 3A991.A.2 | ALSO OPERATES AT 3V SUPPLY | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | MCF52230 | 3.6V | 3V | 40 | Microcontrollers | 3.3V | Not Qualified | S-PQFP-G80 | Internal | 73 | DMA, LVD, POR, PWM, WDT | 32K x 8 | 60MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 131072 | 60MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | Ethernet, I2C, SPI, UART/USART | A/D 8x12b | ||||||||||||||||||||||||||||||||||||||||||||
| MK61FN1M0VMD15 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | /files/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | MK61FN1M0 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.32.5/3.3V | 210mA | Not Qualified | S-PBGA-B144 | Internal | 95 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 150MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 1048576 | 60MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 53x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||
| R7FA6M2AD3CFB#AA0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RA6M2 | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r7fa6m2ad3cfpaa0-datasheets-8806.pdf | 144-LQFP | 12 Weeks | Internal | 109 | DMA, LVD, POR, PWM, WDT | 384K x 8 | 120MHz | ARM® Cortex®-M4 | 2.7V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, SPI, UART/USART, USB | A/D 22x12b SAR; D/A 2x12b | 32K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2064DAK176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAK | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 8 Weeks | YES | QUAD | GULL WING | 1.8V | 0.4mm | 1.9V | 1.7V | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK65FX1M0VMI18 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mk65fn2m0vmi18-datasheets-3357.pdf | 169-LFBGA | 9mm | 9mm | 169 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.65mm | 3.6V | 1.71V | NOT SPECIFIED | Microcontrollers | 1.8/3.3V | 115.08mA | Not Qualified | S-PBGA-B169 | Internal | 116 | DMA, I2S, LVD, POR, PWM, WDT | 256K x 8 | 180MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 1310720 | 262144 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 2x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||
| MC56F83783VLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F837xx | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc56f83783vlh-datasheets-0802.pdf | 64-LQFP | 10mm | 10mm | 64 | 8 Weeks | YES | QUAD | GULL WING | 3.3V | 0.5mm | 3.6V | 2.7V | Internal | 54 | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | MICROCONTROLLER RISC | 32 | YES | YES | YES | 16MHz | 56800EX | 2.7V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 20x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAS169T-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAS | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAS176T-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAS | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | YES | QUAD | GULL WING | 1.8V | 0.4mm | 1.9V | 1.7V | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAR169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAR | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| R7FA6M3AF3CFC#AA0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RA6M3 | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r7fa6m3af3cfpaa0-datasheets-9755.pdf | 176-LQFP | 24mm | 24mm | 176 | 12 Weeks | yes | YES | QUAD | GULL WING | 3.3V | 0.5mm | 176 | 3.6V | 2.7V | Internal | 124 | DMA, LVD, POR, PWM, WDT | 640K x 8 | 120MHz | MICROCONTROLLER RISC | 32 | YES | YES | YES | 24MHz | 24 | 16 | ARM® Cortex®-M4 | 2.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB | A/D 24x12b SAR; D/A 2x12b | 64K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12XET256MAG | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xep100cal-datasheets-5105.pdf | 144-LQFP | 20mm | 20mm | 144 | 16 Weeks | 3A991.A.2 | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 1.8V | 0.5mm | MC9S12XET256 | 1.98V | 1.72V | 40 | Microcontrollers | 3.3/5V | Not Qualified | S-PQFP-G144 | External | 119 | LVD, POR, PWM, WDT | 16K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | CPU12 | 262144 | 40MHz | 23 | 16 | 1.72V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | A/D 24x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||
| STM32F217IGT7 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F2 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 120MHz | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/stmicroelectronics-stm32f215rgt6-datasheets-1735.pdf | 176-LQFP | 176 | 12 Weeks | No SVHC | 176 | CAN, Ethernet, I2C, IrDA, LIN, SPI, UART, USART, USB | ACTIVE (Last Updated: 7 months ago) | 5A992.C | YES | QUAD | GULL WING | NOT SPECIFIED | 0.5mm | STM32F217 | 176 | NOT SPECIFIED | Microcontrollers | 2/3.3V | 93mA | Not Qualified | 1MB | Internal | 140 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | ARM | 132K x 8 | 32 | CORTEX-M3 | 1048576 | ARM® Cortex®-M3 | 1.8V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, Ethernet, I2C, IrDA, LINbus, Memory Card, SPI, UART/USART, USB OTG | A/D 24x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK60FN1M0VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3V | 1mm | MK60FN1M0 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 177mA | Not Qualified | S-PBGA-B144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 1048576 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 58x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||
| STM32F439NGH6 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F4 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 180MHz | 1.1mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/stmicroelectronics-stm32f437igt6-datasheets-2934.pdf | 216-TFBGA | 13mm | 3.3V | 216 | 12 Weeks | 216 | CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | ACTIVE (Last Updated: 7 months ago) | 5A992.C | No | YES | 690mW | BOTTOM | BALL | 3.3V | 0.8mm | STM32F439 | 3.6V | Microcontrollers | 1MB | Internal | 168 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | ARM | 256K x 8 | 32b | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | Yes | 14 | 8 | CORTEX-M4F | 1048576 | ARM® Cortex®-M4 | 1.8V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | A/D 24x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2064DAS169T-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAS | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAS169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAS | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | /files/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAK169-I/HF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAK | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 7 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAR169T-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAR | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC908GR60ACFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | HCMOS | 1.6mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908gr60acfae-datasheets-0642.pdf | 48-LQFP | 7mm | 7mm | 48 | 3A991.A.2 | ALSO OPERATES AT 3.3V SUPPLY AT 4 MHZ | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.5mm | MC908GR60 | 5.5V | 4.5V | 40 | Not Qualified | S-PQFP-G48 | Internal | 37 | LVD, POR, PWM | 2K x 8 | 8MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 32MHz | 3V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | SCI, SPI | A/D 24x10b | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAR176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAR | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | YES | QUAD | GULL WING | 1.8V | 0.4mm | 1.9V | 1.7V | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b |
Please send RFQ , we will respond immediately.