| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Number of ADC Channels | Oscillator Type | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | Watchdog Timer | Number of Timers/Counters | On Chip Program ROM Width | CPU Family | ROM (words) | Number of UART Channels | Number of PWM Channels | Number of I2C Channels | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Number of Ethernet Channels | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MK21FN1M0AVMC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | 121-LFBGA | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | Internal | 81 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | A/D 40x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| R7FS3A17C2A01CBJ#AC0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Renesas Synergy™ S3 | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r7fs3a17c3a01cfmaa0-datasheets-0483.pdf | 121-LFBGA | 8mm | 8mm | 121 | 12 Weeks | yes | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.65mm | 121 | 5.5V | 2.4V | NOT SPECIFIED | Internal | 104 | DMA, LCD, LVD, POR, PWM, WDT | 192K x 8 | 48MHz | MICROCONTROLLER, RISC | YES | YES | YES | 20MHz | 24 | 16 | ARM® Cortex®-M4 | 1.6V~5.5V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB | A/D 26x14b; D/A 2x8b, 1x12b | 8K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||
| R7FA6M3AF3CFB#AA0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RA6M3 | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r7fa6m3af3cfpaa0-datasheets-9755.pdf | 144-LQFP | 20mm | 20mm | 144 | 12 Weeks | yes | YES | QUAD | GULL WING | 3.3V | 0.5mm | 144 | 3.6V | 2.7V | Internal | 124 | DMA, LVD, POR, PWM, WDT | 640K x 8 | 120MHz | MICROCONTROLLER RISC | 32 | YES | YES | YES | 24MHz | 24 | 16 | ARM® Cortex®-M4 | 2.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB | A/D 22x12b SAR; D/A 2x12b | 64K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||
| STM32F207IGH7 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F2 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 120MHz | ROHS3 Compliant | /files/stmicroelectronics-stm32f207vct6-datasheets-9634.pdf | 201-UFBGA | 10.05mm | 500μm | 10.05mm | 176 | 12 Weeks | No SVHC | 176 | CAN, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB | ACTIVE (Last Updated: 7 months ago) | No | YES | BOTTOM | BALL | 3.3V | STM32F207 | 176 | Microcontrollers | 1MB | 24 | Internal | 140 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | ARM | 132K x 8 | 32b | MICROCONTROLLER, RISC | 32 | YES | YES | 14 | 2 | 6 | 3 | ARM® Cortex®-M3 | 1 | 1.8V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, Ethernet, I2C, IrDA, LINbus, Memory Card, SPI, UART/USART, USB OTG | A/D 24x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||
| MK22FN1M0AVMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 3.6V | 1.71V | 40 | S-PBGA-B144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | A/D 42x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||
| R7FS3A17C2A01CLK#AC0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Renesas Synergy™ S3 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/renesaselectronicsamerica-r7fs3a17c2a01clkac0-datasheets-0120.pdf | 145-TFLGA | 7mm | 7mm | 145 | 12 Weeks | yes | 8542.31.00.01 | YES | BOTTOM | BUTT | NOT SPECIFIED | 3.3V | 0.5mm | 145 | 5.5V | 2.4V | NOT SPECIFIED | Internal | 126 | DMA, LCD, LVD, POR, PWM, WDT | 192K x 8 | 48MHz | MICROCONTROLLER, RISC | YES | YES | YES | 20MHz | 24 | 16 | ARM® Cortex®-M4 | 1.6V~5.5V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB | A/D 28x14b; D/A 1x12b | 8K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||
| MK10FX512VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk10fx512vlq12-datasheets-0933.pdf | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3V | 1mm | MK10FX512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 177mA | Not Qualified | S-PBGA-B144 | Internal | 104 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4 | 524288 | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 66x16b; D/A 2x12b | 16K x 8 | |||||||||||||||||||||||||||||||||
| TC264D40F200WBCKXUMA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | AURIX™ | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/infineontechnologies-tc264d40f200wbckxuma1-datasheets-9621.pdf | 144-LQFP Exposed Pad | 26 Weeks | External | 88 | DMA, WDT | 240K x 8 | 200MHz | TriCore™ | 3.3V 5V | FLASH | 32-Bit Dual-Core | 2.5MB 2.5M x 8 | ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT | A/D 40x12b, 3 x Sigma-Delta | 96K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| STM32F469ZIT6 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F4 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | 180MHz | ROHS3 Compliant | /files/stmicroelectronics-stm32f469nih6-datasheets-4176.pdf | 144-LQFP | 20mm | 20mm | 144 | 12 Weeks | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SDIO, SPI, UART, USART, USB | ACTIVE (Last Updated: 7 months ago) | YES | QUAD | GULL WING | 3.3V | 0.5mm | STM32F469 | 3.6V | 1.7V | 2MB | Internal | 106 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | ARM | 384K x 8 | MICROCONTROLLER, RISC | 32 | YES | YES | YES | 24 | 32 | ARM® Cortex®-M4 | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SAI, SDIO, SPI, UART/USART, USB, USB OTG | A/D 20x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||
| LPC1837JET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC18xx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc1837jbd144e-datasheets-0921.pdf | 100-TFBGA | 9mm | 9mm | 100 | 12 Weeks | YES | BOTTOM | BALL | 3.3V | 0.8mm | LPC1837 | 100 | 3.6V | 2.2V | Microcontrollers | 2.5/3.3V | Not Qualified | S-PBGA-B100 | Internal | 49 | Brown-out Detect/Reset, DMA, I2S, POR, WDT | 136K x 8 | 180MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | CORTEX-M3 | 1048576 | 25MHz | ARM® Cortex®-M3 | 2.2V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | A/D 4x10b; D/A 1x10b | 16K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| ATSAMS70Q21B-CFN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAM S70 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 0.6mm | https://pdf.utmel.com/r/datasheets/microchiptechnology-atsame70n20bant-datasheets-9837.pdf | 144-LFBGA | 6mm | 6mm | 144 | 7 Weeks | compliant | YES | BOTTOM | BALL | 1.2V | 0.4mm | ATSAMS70Q | 1.32V | 1.08V | S-PBGA-B144 | TS 16949 | Internal | 75 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 384K x 8 | 300MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 8 | 20MHz | 24 | 16 | ARM® Cortex®-M7 | 1.62V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB | A/D 10x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||
| LPC2460FBD208,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2400 | Surface Mount | -40°C~85°C TA | Tray | 2 (1 Year) | CMOS | 1.6mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2420fet208551-datasheets-9029.pdf | 208-LQFP | 28mm | 28mm | 208 | 12 Weeks | EAR99 | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | LPC24*0 | 208 | 3.6V | 3V | NOT SPECIFIED | Microcontrollers | 3.3V | Not Qualified | S-PQFP-G208 | Internal | 160 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 96K x 8 | 72MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | MROM | 24MHz | 24 | 32 | ARM7® | 3V~3.6V | ROMless | 16/32-Bit | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | A/D 8x10b; D/A 1x10b | |||||||||||||||||||||||||||||||||||
| MC9S12C32CFUE25 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12C32 | 2.75V | 2.35V | 40 | Microcontrollers | 2.53.3/5V | 45mA | Not Qualified | S-PQFP-G80 | Internal | 60 | POR, PWM, WDT | 2K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 32768 | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||
| TMPM462F15FG(BDBB) | Toshiba Semiconductor and Storage |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TX04 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | RoHS Compliant | 176-LQFP | 14 Weeks | External | 139 | DMA, LVD, WDT | 193K x 8 | 120MHz | ARM® Cortex®-M4F | 2.7V~3.6V | FLASH | 32-Bit | 1.5MB 1.5M x 8 | EBI/EMI, I2C, IrDA, Microwire, SIO, SPI, SSI, SSP, UART/USART | A/D 20x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| STM32F427IGH7 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | STM32F4 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 0.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/stmicroelectronics-stm32f429zgt6-datasheets-2587.pdf | 201-UFBGA | 10mm | 10mm | 176 | 12 Weeks | ACTIVE (Last Updated: 6 months ago) | 3A991.A.2 | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.65mm | STM32F427 | 3.6V | 1.8V | NOT SPECIFIED | Microcontrollers | 2/3.3V | 135mA | Not Qualified | S-PBGA-B176 | Internal | 140 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 256K x 8 | 180MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 8 | CORTEX-M4 | 1048576 | 50MHz | ARM® Cortex®-M4 | 1.8V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | A/D 24x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||
| MCF5211CAE66 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF521x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2001 | /files/nxpusainc-mcf5213caf80-datasheets-1743.pdf | 64-LQFP | 10mm | 10mm | 64 | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MCF5211 | 3.6V | 3V | 40 | Not Qualified | S-PQFP-G64 | External | 33 | DMA, LVD, POR, PWM, WDT | 16K x 8 | 66MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 48MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | A/D 8x12b | |||||||||||||||||||||||||||||||||||||||||
| R4F2113NLG#U0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | H8® H8S/2100 | Surface Mount | -20°C~75°C TA | Tray | 3 (168 Hours) | 20MHz | ROHS3 Compliant | 145-TFLGA | 9mm | 9mm | 145 | 20 Weeks | 145 | I2C, SCI | yes | YES | QUAD | NO LEAD | 3.3V | 0.65mm | 3.6V | 3V | 128kB | Internal | 114 | POR, PWM, WDT | 12K x 8 | MICROCONTROLLER | 16 | YES | YES | YES | H8S/2000 | 3V~3.6V | FLASH | 16-Bit | 128KB 128K x 8 | I2C, LPC, SCI | A/D 12x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC2114FBD64/01,15 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2100 | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | CMOS | 1.6mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2114fbd640115-datasheets-9958.pdf | 64-LQFP | 10mm | 10mm | 64 | 12 Weeks | EAR99 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | e3 | TIN | YES | QUAD | GULL WING | 260 | 1.8V | 0.5mm | LPC2114 | 64 | 1.95V | 1.65V | 40 | Microcontrollers | 1.83.3V | Not Qualified | S-PQFP-G64 | Internal | 46 | POR, PWM, WDT | 16K x 8 | 60MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | 131072 | 50MHz | ARM7® | 1.65V~3.6V | FLASH | 16/32-Bit | 128KB 128K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | A/D 4x10b | |||||||||||||||||||||||||||||||||||
| MK21FX512AVMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 3.6V | 1.71V | 40 | S-PBGA-B144 | Internal | 95 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | YES | YES | YES | YES | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | A/D 42x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||
| F280049PZQ | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, C2000™ C28x Piccolo™ | Surface Mount | -40°C~125°C TA | 3 (168 Hours) | CMOS | ROHS3 Compliant | 100-LQFP | 14mm | 1.6mm | 14mm | 100 | 6 Weeks | 100 | ACTIVE (Last Updated: 5 days ago) | yes | 1.4mm | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | QUAD | GULL WING | 260 | 1.2V | 0.5mm | F280049 | 1.14V | NOT SPECIFIED | Internal | 40 | Brown-out Detect/Reset, POR, PWM, WDT | 50K x 16 | 100MHz | MICROCONTROLLER | 32 | YES | YES | YES | YES | 2 | C28x | 1.14V~1.32V | FLASH | 32-Bit | 256KB 128K x 16 | CANbus, I2C, LINbus, SCI, SPI, UART/USART | A/D 21x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||
| MK51DN512CMC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K50 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.52mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk10dn512vmd10-datasheets-0175.pdf | 121-LFBGA | 8mm | 8mm | 121 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.65mm | MK51DN512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 77mA | Not Qualified | S-PBGA-B121 | Internal | 78 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4 | 524288 | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | A/D 37x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||
| MC9S12GC64CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | EAR99 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12GC64 | 2.75V | 2.35V | 40 | Not Qualified | S-PQFP-G80 | Internal | 60 | POR, PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||
| CY8C6137BZI-F54 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PSoC® 6 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 124-VFBGA | 13 Weeks | NOT SPECIFIED | NOT SPECIFIED | Internal | 104 | Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT | 288K x 8 | 150MHz | ARM® Cortex®-M4 | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | I2C, LINbus, QSPI, SPI, UART/USART, USB | A/D 8x12b SAR; D/A 1x12b | 32K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAL169-I/HF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAL | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 7 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||
| R5F36CAENFB#30 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M16C™ M16C/60/6C | Surface Mount | -20°C~85°C TA | Tray | 3 (168 Hours) | 32MHz | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r5f36caenfb30-datasheets-9898.pdf | 100-LQFP | 6mm | 6mm | 5.5V | Lead Free | 48 | 20 Weeks | 100 | EBI/EMI, I2C, UART, USART, USB | yes | YES | QUAD | NO LEAD | 3V | 0.5mm | R5F36C | 100 | 256kB | Internal | 85 | DMA, LVD, POR, PWM, WDT | 20K x 8 | MICROCONTROLLER | 16 | YES | YES | YES | Yes | 11 | 20 | 8 | M16C/60 | 3V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | EBI/EMI, I2C, SIO, UART/USART, USB | A/D 26x10b; D/A 2x8b | |||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1025DAR169T-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAR | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||
| M30260F8AGP#U9A | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M16C™ M16C/Tiny/26A | Surface Mount | Surface Mount | -20°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 20MHz | 1.7mm | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-m30260f8agpu3a-datasheets-1013.pdf | 48-LQFP | 7mm | Lead Free | 48 | 20 Weeks | 48 | I2C, UART, USART | yes | OPERATES AT 2.7V MINIMUM SUPPLY @ 10 MHZ | No | QUAD | GULL WING | 5V | 0.5mm | M30260 | 48 | 5.5V | 3V | Microcontrollers | 3/5V | 64kB | Internal | 39 | DMA, PWM, Voltage Detect, WDT | 2K x 8 | 16b | MICROCONTROLLER | 16 | YES | YES | YES | NO | Yes | 8 | 69632 | 20 μs | M16C/60 | 2.7V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | I2C, IEBus, SIO, UART/USART | A/D 12x10b | |||||||||||||||||||||||||||||||||||
| MC9S12C32CFUE16 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2005 | /files/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12C32 | 2.75V | 2.35V | 40 | Microcontrollers | 2.53.3/5V | 45mA | Not Qualified | S-PQFP-G80 | Internal | 60 | POR, PWM, WDT | 2K x 8 | 16MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 32768 | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||
| R4F2113NFT#U0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | H8® H8S/2100 | Surface Mount | -20°C~75°C TA | Tray | 1 (Unlimited) | 20MHz | ROHS3 Compliant | 2008 | 144-TQFP | 3V | Lead Free | 20 Weeks | 144 | I2C, SCI | R4F2113 | 128kB | Internal | 114 | POR, PWM, WDT | 12K x 8 | H8S/2000 | 3V~3.6V | FLASH | 16-Bit | 128KB 128K x 8 | I2C, LPC, SCI | A/D 12x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK10DN512VMC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.52mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk10dn512vmc10-datasheets-9798.pdf | 121-LFBGA | 8mm | 8mm | 121 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.65mm | MK10DN512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 77mA | Not Qualified | S-PBGA-B121 | Internal | 90 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4 | 524288 | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 42x16b; D/A 2x12b |
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