| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Number of ADC Channels | Oscillator Type | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Watchdog Timer | Number of Timers/Counters | Number of Programmable I/O | On Chip Program ROM Width | CPU Family | ROM (words) | Boundary Scan | Low Power Mode | Format | Number of I2C Channels | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Barrel Shifter | Internal Bus Architecture | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PIC32MZ1064DAS169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAS | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | /files/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAK169-I/HF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAK | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 7 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAR169T-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAR | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC908GR60ACFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | HCMOS | 1.6mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908gr60acfae-datasheets-0642.pdf | 48-LQFP | 7mm | 7mm | 48 | 3A991.A.2 | ALSO OPERATES AT 3.3V SUPPLY AT 4 MHZ | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.5mm | MC908GR60 | 5.5V | 4.5V | 40 | Not Qualified | S-PQFP-G48 | Internal | 37 | LVD, POR, PWM | 2K x 8 | 8MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 32MHz | 3V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | SCI, SPI | A/D 24x10b | |||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAR176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAR | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | YES | QUAD | GULL WING | 1.8V | 0.4mm | 1.9V | 1.7V | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAR176T-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAR | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | YES | QUAD | GULL WING | 1.8V | 0.4mm | 1.9V | 1.7V | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAK169-I/HF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAK | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 7 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1025DAS169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAS | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12C32VFUE16 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | EAR99 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12C32 | 2.75V | 2.35V | 40 | Microcontrollers | 2.53.3/5V | 45mA | Not Qualified | S-PQFP-G80 | Internal | 60 | POR, PWM, WDT | 2K x 8 | 16MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 32768 | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||
| R7FA6M3AH3CFB#AA0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RA6M3 | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r7fa6m3af3cfpaa0-datasheets-9755.pdf | 144-LQFP | 20mm | 20mm | 144 | 12 Weeks | yes | YES | QUAD | GULL WING | 3.3V | 0.5mm | 144 | 3.6V | 2.7V | Internal | 124 | DMA, LVD, POR, PWM, WDT | 640K x 8 | 120MHz | MICROCONTROLLER RISC | 32 | YES | YES | YES | 24MHz | 24 | 16 | ARM® Cortex®-M4 | 2.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB | A/D 22x12b SAR; D/A 2x12b | 64K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MK20FN1M0VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk20fx512vlq12-datasheets-6227.pdf | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | MK20FN1M0 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.32.5/3.3V | 177mA | Not Qualified | S-PBGA-B144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 1048576 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 58x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||
| MK60DX256VMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | MK60DX256 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 77mA | Not Qualified | S-PBGA-B144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4 | 262144 | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 42x16b; D/A 2x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||
| PIC32MZ2025DAL169-I/HF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAL | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 7 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1025DAK176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAK | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 8 Weeks | YES | QUAD | GULL WING | 1.8V | 0.4mm | 1.9V | 1.7V | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ2048EFM100-I/GJX | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ | Surface Mount | -40°C~85°C TA | Tray | 6 (Time on Label) | CMOS | 1.06mm | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz0512efe064ipt-datasheets-9385.pdf | 100-TFBGA | 7mm | 7mm | 100 | 8 Weeks | compliant | YES | BOTTOM | BALL | 3.3V | 0.65mm | 3.6V | 2.1V | S-PBGA-B100 | TS 16949 | Internal | 78 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 512K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | MIPS32® M-Class | 2.1V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG | A/D 40x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MZ1064DAR176T-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAR | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 4 Weeks | YES | QUAD | GULL WING | 1.8V | 0.4mm | 1.9V | 1.7V | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| MK60DX256ZVLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk60fn1m0vlq12-datasheets-1199.pdf | 144-LQFP | 20mm | 20mm | 144 | 15 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MK60DX256 | 3.6V | 1.71V | 40 | Not Qualified | S-PQFP-G144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 32MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 42x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||
| PIC18F6585-E/PT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 18F | Surface Mount | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 25MHz | ROHS3 Compliant | 2004 | /files/microchiptechnology-pic18f6680ipt-datasheets-0830.pdf | 64-TQFP | 10.1mm | 1.05mm | 10.1mm | 5V | Lead Free | 64 | 5 Weeks | 64 | CAN, I2C, SPI, UART, USART | yes | EAR99 | No | e3 | Matte Tin (Sn) | 1W | QUAD | GULL WING | 260 | 5V | PIC18F6585 | 64 | 40 | Microcontrollers | 5V | 48kB | 12 | External | 52 | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 3.25K x 8 | 8b | 40 MHz | MICROCONTROLLER, RISC | 8 | YES | NO | YES | Yes | 5 | 53 | PIC | 1 | 40 μs | PIC | 4.2V~5.5V | FLASH | 8-Bit | 48KB 24K x 16 | CANbus, I2C, SPI, UART/USART | A/D 12x10b | 1K x 8 | |||||||||||||||||||||||||||||||
| PIC32MZ2064DAL169-I/HF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DAL | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dar176i2j-datasheets-2790.pdf | 169-LFBGA | 11mm | 11mm | 169 | 7 Weeks | YES | BOTTOM | BALL | 1.8V | 0.8mm | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~1.9V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC908GZ60CFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | HCMOS | 1.6mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908gz60cfue-datasheets-6882.pdf | 48-LQFP | 7mm | 7mm | 48 | 3A991.A.2 | OPERATES AT 3.3V SUPPLY @ 4MHZ | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.5mm | MC908GZ60 | 5.5V | 4.5V | 40 | Not Qualified | S-PQFP-G48 | Internal | 37 | LVD, POR, PWM | 2K x 8 | 8MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 32MHz | 3V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, SCI, SPI | A/D 24x10b | |||||||||||||||||||||||||||||||||||||||||||||
| XLF216-512-TQ128-C20 | XMOS |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XLF | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | 70°C | 0°C | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/xmos-xlf216512tq128c20-datasheets-0421.pdf | 128-TQFP Exposed Pad | 12 Weeks | 128-TQFP (14x14) | 2MB | External | 88 | FLASH | XCore | 512K x 8 | 2000MIPS | XCore | 0.95V~3.6V | FLASH | 32-Bit 16-Core | 2MB 2M x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51JM128EVLK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51JM | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.74mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf51jm128vlh-datasheets-9927.pdf | 80-LQFP | 14mm | 14mm | 80 | 10 Weeks | 5A992 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 5V | 0.65mm | MCF51JM128 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 70mA | Not Qualified | S-PQFP-G80 | External | 66 | LVD, PWM, WDT | 16K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | 131072 | 16MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI, USB OTG | A/D 12x12b | ||||||||||||||||||||||||||||||||||||||||
| MC9S12C32MFUE25 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12C32 | 2.75V | 2.35V | 40 | Microcontrollers | 2.53.3/5V | 45mA | Not Qualified | S-PQFP-G80 | Internal | 60 | POR, PWM, WDT | 2K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 32768 | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||
| MC9S12D32CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12a32cfue-datasheets-5962.pdf | 80-QFP | 14mm | 14mm | 80 | 10 Weeks | 3A991.A.2 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 9S12D32 | 2.75V | 2.35V | 40 | Microcontrollers | 2.55V | 50mA | Not Qualified | S-PQFP-G80 | Internal | 59 | PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 32768 | 16MHz | 16 | 16 | 2.35V~5.25V | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, I2C, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||||||||||||||||||||||||||||||||
| MK53DX256CMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K50 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | /files/nxpusainc-mk53dx256cmd10-datasheets-0315.pdf | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | MK53DX256 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 77mA | Not Qualified | S-PBGA-B144 | Internal | 94 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4 | 262144 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 41x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||
| MK53DN512CLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K50 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | /files/nxpusainc-mk53dx256cmd10-datasheets-0315.pdf | 144-LQFP | 20mm | 20mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MK53DN512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 79mA | Not Qualified | S-PQFP-G144 | Internal | 94 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4 | 524288 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 41x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||
| MC9S12C64CPBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 52-LQFP | 10mm | 10mm | 52 | 10 Weeks | EAR99 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | MC9S12C64 | 2.75V | 40 | Microcontrollers | 2.53.3/5V | 45mA | Not Qualified | S-PQFP-G52 | Internal | 35 | POR, PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 65536 | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||
| MC56F8322VFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xxx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1998 | /files/nxpusainc-mc56f8322mfae-datasheets-4810.pdf | 48-LQFP | 7mm | 7mm | 48 | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.5mm | MC56F8322 | 2.75V | 2.25V | 40 | Not Qualified | S-PQFP-G48 | Internal | 21 | POR, PWM, Temp Sensor, WDT | 6K x 16 | 60MHz | DIGITAL SIGNAL PROCESSOR, OTHER | YES | YES | FIXED POINT | 120MHz | YES | MULTIPLE | 56800E | 2.25V~3.6V | FLASH | 16-Bit | 32KB 16K x 16 | CANbus, SCI, SPI | A/D 6x12b | ||||||||||||||||||||||||||||||||||||||||||||
| LPC43S37JET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC43xx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc43s37jet100e-datasheets-0357.pdf | 100-TFBGA | 12 Weeks | NOT SPECIFIED | 100 | NOT SPECIFIED | Internal | 49 | Brown-out Detect/Reset, DMA, I2S, POR, WDT | 136K x 8 | 204MHz | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | 2.2V~3.6V | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | A/D 4x10b; D/A 1x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12C32MFAE16 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2005 | /files/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 48-LQFP | 7mm | 7mm | 48 | 10 Weeks | EAR99 | ALSO REQUIRES 5V SUPPLY | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.5mm | MC9S12C32 | 2.75V | 2.35V | 40 | Microcontrollers | 2.53.3/5V | 45mA | Not Qualified | S-PQFP-G48 | Internal | 31 | POR, PWM, WDT | 2K x 8 | 16MHz | MICROCONTROLLER | 16 | YES | NO | YES | NO | CPU12 | 32768 | 50MHz | 16 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | A/D 8x10b |
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