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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Density | Pbfree Code | Thickness | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Subcategory | Output Polarity | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Family | Logic IC Type | Data Rate | Frequency (Max) | Number of Outputs | uPs/uCs/Peripheral ICs Type | Direction | Number of Inputs | Output Characteristics | Access Time | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Alternate Memory Width | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Memory IC Type | Output Enable | Bus Directional | Retransmit Capability | FWFT Support | Programmable Flags Support | Propagation Delay (tpd) | Cycle Time |
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| 80HSPS1616CHMGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | CMOS | 2.83mm | Non-RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hsps1616chmgi-datasheets-8542.pdf | 21mm | 21mm | Lead Free | 400 | 12 Weeks | 400 | yes | 2.75mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 400 | INDUSTRIAL | 85°C | -40°C | 1.05V | 0.95V | NOT SPECIFIED | MICROPROCESSOR CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51559L5BB8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51559l5bb8-datasheets-8505.pdf | BGA | 17mm | 17mm | 256 | 256 | EAR99 | not_compliant | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | 256 | COMMERCIAL | 70°C | 1.9V | 1.7V | FIFOs | 1.8V | 0.15mA | Not Qualified | 200MHz | 64KX36 | 36 | 2359296 bit | PARALLEL | 0.1A | 3.6 ns | OTHER FIFO | YES | 5 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
| HD9P6409-9Z96 | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 18mA | 2.65mm | RoHS Compliant | 1996 | https://pdf.utmel.com/r/datasheets/intersil-hd9p64099z96-datasheets-6652.pdf | SOIC | 7.5mm | 5V | Lead Free | 20 | 8 Weeks | 5.5V | 4.5V | EAR99 | Tin | 1 | e3 | DUAL | GULL WING | 260 | 5V | 20 | INDUSTRIAL | MANCHESTER ENCODER/DECODER | 1 | 40 | Network Interfaces | 5V | Not Qualified | R-PDSO-G20 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HD9P6409-9Z | Intersil (Renesas Electronics America) | $49.65 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 18mA | 2.65mm | RoHS Compliant | 1996 | https://pdf.utmel.com/r/datasheets/intersil-hd9p64099z-datasheets-6574.pdf | SOIC | 7.5mm | 5V | Lead Free | 20 | 8 Weeks | 5.5V | 4.5V | EAR99 | No | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 20 | INDUSTRIAL | MANCHESTER ENCODER/DECODER | 1 | 40 | Network Interfaces | 5V | R-PDSO-G20 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MAX4845EYT+C5Y | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 85°C | -40°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/maximintegrated-max4845eytc5y-datasheets-5623.pdf | 6 Weeks | 28V | 1.2V | 6 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 852S41AYLF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-852s41aylf-datasheets-5027.pdf | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 72V51253L7-5BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72v51253l75bb-datasheets-4081.pdf | BGA | 17mm | 17mm | 3.3V | Contains Lead | 7 Weeks | 1.724105g | 3.45V | 3.15V | 256 | 576 kb | 1.76mm | Lead, Tin | 100mA | Dual | 133MHz | Unidirectional | 4 ns | 18b | Synchronous | Unidirectional | No | Yes | Yes | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI578-10GCLY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 2.55mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57810gcly-datasheets-2134.pdf | FCBGA | 27mm | 27mm | Contains Lead | 675 | 5 Weeks | 675 | no | 2.41mm | No | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 675 | COMMERCIAL | TELECOM CIRCUIT | 70°C | Other Telecom ICs | 1.23.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICS83840BHLFT | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 1.2mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-ics83840bhlft-datasheets-2060.pdf | 7mm | 7mm | 64 | yes | 8542.39.00.01 | 10 | e3 | MATTE TIN | YES | BOTTOM | BALL | 260 | 2.5V | 0.5mm | 64 | COMMERCIAL | 70°C | 2.7V | 2.3V | 30 | Other Logic ICs | TRUE | 2.5V | Not Qualified | S-PBGA-B64 | 83840 | MULTIPLEXER | 1 | 10 | 3-STATE | 0.25 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICS83840BHLF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 1.2mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-ics83840bhlf-datasheets-1883.pdf | 7mm | 7mm | 64 | yes | 8542.39.00.01 | 10 | e3 | MATTE TIN | YES | BOTTOM | BALL | 260 | 2.5V | 0.5mm | 64 | COMMERCIAL | 70°C | 2.7V | 2.3V | 30 | Other Logic ICs | TRUE | 2.5V | Not Qualified | S-PBGA-B64 | 83840 | MULTIPLEXER | 1 | 10 | 3-STATE | 0.25 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLS10EREUSON3XTMA1 | Infineon |
Min: 1 Mult: 1 |
0 | 0x0x0 | RoHS Compliant | 2017 | https://pdf.utmel.com/r/datasheets/infineon-sls10ereuson3xtma1-datasheets-1045.pdf | 26 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI568A-10GCLY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 2.66mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi568a10gcly-datasheets-0713.pdf | FCBGA | 27mm | 27mm | Contains Lead | 675 | 8 Weeks | 675 | no | 2.41mm | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 675 | COMMERCIAL | TELECOM CIRCUIT | 70°C | NOT SPECIFIED | Not Qualified | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ISL59450IQZ | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3.4mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/intersil-isl59450iqz-datasheets-0346.pdf | 20mm | 14mm | 128 | 8542.39.00.01 | 3 | YES | QUAD | GULL WING | NOT SPECIFIED | 5V | 0.5mm | 128 | INDUSTRIAL | 85°C | -40°C | 5.5V | 4.5V | 4 | VIDEO MULTIPLEXER | NOT SPECIFIED | Multiplexer or Switches | 3.3/5V | Not Qualified | R-PQFP-G128 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80KSW0005BRI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 4 (72 Hours) | 3.32mm | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80ksw0005bri-datasheets-9548.pdf | FCBGA | 27mm | 27mm | Contains Lead | 676 | 8 Weeks | 676 | no | 3.4mm | EAR99 | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1.2V | 1mm | 676 | INDUSTRIAL | TELECOM CIRCUIT | 85°C | -40°C | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI568A-10GIL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 2.66mm | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi568a10gil-datasheets-9018.pdf | FCBGA | 27mm | 27mm | Contains Lead | 675 | 8 Weeks | 675 | no | 2.41mm | EAR99 | not_compliant | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.2V | 675 | INDUSTRIAL | TELECOM CIRCUIT | 85°C | -40°C | NOT SPECIFIED | Not Qualified | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1432CHMI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 4 (72 Hours) | 2.83mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1432chmi-datasheets-7902.pdf | FCBGA | 25mm | 25mm | Contains Lead | 576 | 19 Weeks | 576 | no | 2.6mm | EAR99 | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1mm | 576 | TELECOM CIRCUIT | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HCPS1432CHM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hcps1432chm-datasheets-7716.pdf | FCBGA | 25mm | 2.6mm | 25mm | Contains Lead | 576 | 19 Weeks | 576 | no | 2.6mm | EAR99 | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | 576 | COMMERCIAL | TELECOM CIRCUIT | 70°C | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HT0832PZCHLG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-89ht0832pzchlg-datasheets-7589.pdf | FCBGA | 13mm | 20mm | Lead Free | 10 Weeks | 345 | yes | 2.84mm | Copper, Silver, Tin | 345 | 8 Gbps | BUS CONTROLLER, PCI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI568A-10GILY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 2.66mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi568a10gily-datasheets-7378.pdf | FCBGA | 27mm | 27mm | Contains Lead | 675 | 8 Weeks | 675 | no | 2.41mm | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 675 | INDUSTRIAL | TELECOM CIRCUIT | 85°C | -40°C | NOT SPECIFIED | Not Qualified | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80HSPS1616CHMG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | CMOS | 2.83mm | Non-RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80hsps1616chmg-datasheets-7230.pdf | 21mm | 21mm | Lead Free | 400 | 12 Weeks | 400 | yes | 2.75mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 400 | COMMERCIAL | 70°C | 1.05V | 0.95V | NOT SPECIFIED | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51559L5BB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | ASYNCHRONOUS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51559l5bb-datasheets-7167.pdf | BGA | 256 | 256 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | COMMERCIAL | 70°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 200MHz | 64KX36 | 36 | 2359296 bit | 0.1A | 3.6 ns | OTHER FIFO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80KSW0005BR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 4 (72 Hours) | 3.32mm | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80ksw0005br-datasheets-3233.pdf | FCBGA | 27mm | 27mm | Contains Lead | 676 | 676 | no | 3.4mm | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1.2V | 1mm | 676 | COMMERCIAL | TELECOM CIRCUIT | 70°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72V51253L7-5BBI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | CMOS | SYNCHRONOUS | 3.5mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72v51253l75bbi-datasheets-1336.pdf | BGA | 17mm | 17mm | 256 | 256 | no | EAR99 | ALTERNATIVE MEMORY WIDTH:9-BIT | not_compliant | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | 85°C | -40°C | 3.45V | 3.15V | 20 | FIFOs | 3.3V | 0.1mA | Not Qualified | 133MHz | 128KX18 | 18 | 2359296 bit | PARALLEL | 9 | 0.01A | 4 ns | OTHER FIFO | YES | 7.5 ns | |||||||||||||||||||||||||||||||||||||||||||||
| 8T49N241-999NLGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-8t49n241999nlgi8-datasheets-9780.pdf | 6mm | 6mm | Lead Free | 18 Weeks | 40 | yes | 900μm | e3 | Tin (Sn) | 260 | 40 | NOT SPECIFIED | CLOCK GENERATOR, OTHER | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80KSW0003AR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 4 (72 Hours) | 3.42mm | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80ksw0003ar-datasheets-9436.pdf | FCBGA | 19mm | 19mm | Contains Lead | 324 | 19 Weeks | 324 | no | 3.27mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 1mm | 324 | COMMERCIAL | TELECOM CIRCUIT | 70°C | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI576-10GCLY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 2.55mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi57610gcly-datasheets-8048.pdf | FCBGA | 21mm | 21mm | Contains Lead | 399 | 399 | no | 2.3mm | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 399 | COMMERCIAL | TELECOM CIRCUIT | 70°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TSI568A-10GCL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 2.66mm | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-tsi568a10gcl-datasheets-7961.pdf | FCBGA | 27mm | 27mm | Contains Lead | 675 | 8 Weeks | 675 | no | 2.41mm | not_compliant | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.2V | 675 | COMMERCIAL | TELECOM CIRCUIT | 70°C | NOT SPECIFIED | Not Qualified | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 80KSW0002ARI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 4 (72 Hours) | 3.42mm | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-80ksw0002ari-datasheets-5952.pdf | FCBGA | 19mm | 19mm | Contains Lead | 324 | 19 Weeks | 324 | no | 3.27mm | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 1mm | 324 | INDUSTRIAL | TELECOM CIRCUIT | 85°C | -40°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 72T6360L7-5BBI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-72t6360l75bbi-datasheets-5615.pdf | BGA | 19mm | 19mm | 2.5V | Contains Lead | 2.625V | 2.375V | 324 | no | 1.76mm | EAR99 | not_compliant | 8542.32.00.71 | e0 | Tin/Lead (Sn63Pb37) | 324 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT72P51549L6BBI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ASYNCHRONOUS | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt72p51549l6bbi8-datasheets-5404.pdf | BGA | 256 | 256 | not_compliant | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 1.8V | 1mm | INDUSTRIAL | 85°C | -40°C | FIFOs | 1.8V | 0.15mA | Not Qualified | 166MHz | 32KX36 | 36 | 1179648 bit | 0.1A | 3.7 ns | OTHER FIFO |
