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ContactSpecialized Power Management ICs(5989)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Telecom IC Type | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | JESD-30 Code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC35FS6501NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 15 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC33PF8100CDES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||
| MC34PF8100EPEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||
| MC33PF8100CHES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||
| MC33VR5500V0ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | /files/nxpusainc-mc33vr5500v1esr2-datasheets-8333.pdf | 2 Weeks | |||||||||||||||||||||||||||||||||||
| MC33FS6502NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC35FS6513NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC33PF8100EQES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 1mm | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | 8 Weeks | 1 | High Performance i.MX 8, S32x Processor Based | YES | 2.7V~5.5V | QUAD | NO LEAD | 5V | 0.5mm | 5.5V | 2.7V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | S-PQCC-N56 | ||||||||||||||
| MC33FS6521CAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC33FS8530A4ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | 2 Weeks | ||||||||||||||||||||||||||||||||||||
| MC35FS6513CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 14 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC34PF8100F3EP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||
| MC35FS6503NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC33FS6512LAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC33FS6504LAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC35FS4503CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 14 Weeks | System Basis Chip | 1V~5V | ||||||||||||||||||||||||||||
| MC34PF8100CHEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||
| MC35FS4503NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | ||||||||||||||||||||||||||||
| MC34PF8100CFEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||
| MC35FS6503CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC35FS6512NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC35FS6512CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC34708VMR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 1.61mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc34708vm-datasheets-3057.pdf | 206-LFBGA | 13mm | 13mm | 206 | 16 Weeks | EAR99 | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | General Purpose | YES | 1.8V~4.5V | BOTTOM | BALL | 260 | 3.6V | 0.8mm | MC34708 | 4.5V | 3V | 16 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | YES | S-PBGA-B206 | |||||
| MC33PF8200DMESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc33pf8200dnesr2-datasheets-8638.pdf | 2 Weeks | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||
| MC33PF8100EPES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 1mm | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | 8 Weeks | 1 | High Performance i.MX 8, S32x Processor Based | YES | 2.7V~5.5V | QUAD | NO LEAD | 5V | 0.5mm | 5.5V | 2.7V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | S-PQCC-N56 | ||||||||||||||
| MC33FS6523NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC35FS6510CAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 15 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC34PF8100EREP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8100a0es-datasheets-9400.pdf | 56-VFQFN Exposed Pad | 8 Weeks | High Performance i.MX 8, S32x Processor Based | 2.7V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||
| MC33FS6513NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||
| MC35FS6502NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 |
