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ContactSpecialized Power Management ICs(5989)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Pbfree Code | ECCN Code | Reach Compliance Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code | Input Voltage-Nom | Input Voltage (Min) | Input Voltage (Max) | Control Mode | Control Technique | Switcher Configuration | Switching Frequency-Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC33VR5500V2ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33FS6514LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| TDA3683J/N2S,112 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | 300μA | ROHS3 Compliant | 2001 | /files/nxpusainc-tda3683jn2s112-datasheets-8600.pdf | 23-SIP Formed Leads | 23 | 14 Weeks | Ignition Buffer, Regulator | NO | 9V~18V | ZIG-ZAG | 14.4V | 1.27mm | TDA3683 | 23 | Power Management Circuits | 14.4V | 0.45mA | Not Qualified | R-PZIP-T23 | ||||||||||||||||||||||||||||||
| MC33FS4503NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC33FS8430G1ES | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33FS6502NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC33PF8100CHESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||
| MC35FS4502NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | ||||||||||||||||||||||||||||||||||||||||||||
| MC34FS6407NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | 13mA | ROHS3 Compliant | 2015 | /files/nxpusainc-mc34fs6408nae-datasheets-8518.pdf | 48-LQFP Exposed Pad | 15 Weeks | EAR99 | 8542.39.00.01 | System Basis Chip | 2.7V~36V | NOT SPECIFIED | ETHERNET TRANSCEIVER | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||
| MC33FS6504LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC34PF8100EQEPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||||||||||||
| MC33VR5500V3ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33FS6510LAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC34PF8100CHEPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||
| MC35FS6512NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC33VR5500V1ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc33vr5500v1esr2-datasheets-8333.pdf | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||
| ISL6532BCRZ | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | 5.25mA | 1mm | ROHS3 Compliant | /files/rochesterelectronicsllc-isl6532bcrt-datasheets-3304.pdf | 20-VQFN Exposed Pad | 6mm | 6mm | 20 | yes | unknown | 1 | e3 | MATTE TIN | Memory, DDR/DDR2 Regulator | YES | QUAD | NO LEAD | 260 | 0.8mm | 20 | SWITCHING CONTROLLER | 30 | S-PQCC-N20 | 5V | 4.5V | 5.5V | VOLTAGE-MODE | PULSE WIDTH MODULATION | PUSH-PULL | 280kHz | |||||||||||||||||||||
| MC33PF8100CDESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33FS8530A1ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33FS6522LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC34PF8100F3EPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||
| MC35FS4500NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC33FS4501CAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC33FS6511NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC35FS6501CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 15 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC34FS6408NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | 13mA | ROHS3 Compliant | 2015 | /files/nxpusainc-mc34fs6408nae-datasheets-8518.pdf | 48-LQFP Exposed Pad | 15 Weeks | EAR99 | 8542.39.00.01 | System Basis Chip | 2.7V~36V | NOT SPECIFIED | ETHERNET TRANSCEIVER | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||
| MC33FS6513CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC13892DJVL | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 1.6mm | ROHS3 Compliant | 2004 | 186-LFBGA | 12mm | 12mm | 186 | 12 Weeks | EAR99 | 8542.39.00.01 | 1 | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | YES | BOTTOM | BALL | 260 | 3.6V | 0.8mm | MC13892 | 3.6V | 1.8V | 1 | POWER SUPPLY MANAGEMENT CIRCUIT | NOT SPECIFIED | YES | Power Management Circuits | 3.6V | 1.5mA | Not Qualified | S-PBGA-B186 | |||||||||||||||||||||
| MC33FS8510A3ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33FS6512LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 |
