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ContactSpecialized Power Management ICs(5989)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | Additional Feature | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code | Input Voltage-Nom | Input Voltage (Min) | Input Voltage (Max) | Output Current-Max | Control Technique | Switcher Configuration | Switching Frequency-Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC33PF8200D2ESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||
| MC33FS6503NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC33FS8430G4ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MC35FS6500CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 14 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MCZ33789BAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 64-LQFP Exposed Pad | 14 Weeks | EAR99 | 8542.39.00.01 | e3 | MATTE TIN | Automotive Airbag System | 5.2V~20V | 260 | ANALOG CIRCUIT | 40 | |||||||||||||||||||||||||||||||||||||
| MC33PF8200DHESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||
| MC33FS6520CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC33FS6511CAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MWCT1011VLH | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 64-LQFP | 13 Weeks | 8542.39.00.01 | General Purpose | 2.7V~3.6V | TELECOM CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||
| MC34VR500VAES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 15mA | ROHS3 Compliant | /files/nxpusainc-mc34vr500vaesr2-datasheets-8357.pdf | 56-VFQFN Exposed Pad | 2 Weeks | QorlQ LS1/T1 Communications Processors | 2.8V~4.5V | |||||||||||||||||||||||||||||||||||||||||||
| MC33PF8100EPESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | 1mm | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | 2 Weeks | 1 | High Performance i.MX 8, S32x Processor Based | YES | 2.5V~5.5V | QUAD | NO LEAD | 5V | 0.5mm | 5.5V | 2.5V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | S-PQCC-N56 | |||||||||||||||||||||||||||||
| MC33FS4503NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC33PF8100EQESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | 1mm | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | 2 Weeks | 1 | High Performance i.MX 8, S32x Processor Based | YES | 2.5V~5.5V | QUAD | NO LEAD | 5V | 0.5mm | 5.5V | 2.5V | 12 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | S-PQCC-N56 | |||||||||||||||||||||||||||||
| MC33FS4500NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC33FS6512NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC33PF8100EAESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||
| MC33PF8100ERESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||
| MC33FS6501CAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC34VR500V9ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 15mA | ROHS3 Compliant | /files/nxpusainc-mc34vr500vaesr2-datasheets-8357.pdf | 56-VFQFN Exposed Pad | 16 Weeks | QorlQ LS1/T1 Communications Processors | 2.8V~4.5V | 260 | 40 | |||||||||||||||||||||||||||||||||||||||||
| MC35FS4502CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | |||||||||||||||||||||||||||||||||||||||||||
| MC33FS6500LAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC33FS6523NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC35FS6510NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC34VR500V3ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 250μA | 0.9mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc34vr500v1es-datasheets-3047.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | 16 Weeks | EAR99 | ALSO OPRTS W/T CONTROL TECH PFM; ALSO OPRTS IN ADJ MODE FROM 0.625 TO 1.975V | 8542.39.00.01 | 1 | e3 | Tin (Sn) | QorlQ LS1/T1 Communications Processors | YES | 2.8V~4.5V | QUAD | NO LEAD | 260 | 0.5mm | SWITCHING REGULATOR | 40 | Power Management Circuits | 2.8/4.5V | Not Qualified | S-XQCC-N56 | 3.6V | 2.8V | 4.5V | 13.7A | PULSE WIDTH MODULATION | BUCK | 4000kHz | ||||||||||||||
| MC33VR5500V2ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33FS6514LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| TDA3683J/N2S,112 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | 300μA | ROHS3 Compliant | 2001 | /files/nxpusainc-tda3683jn2s112-datasheets-8600.pdf | 23-SIP Formed Leads | 23 | 14 Weeks | Ignition Buffer, Regulator | NO | 9V~18V | ZIG-ZAG | 14.4V | 1.27mm | TDA3683 | 23 | Power Management Circuits | 14.4V | 0.45mA | Not Qualified | R-PZIP-T23 | |||||||||||||||||||||||||||||
| MC33FS4503NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||||||||||||
| MC33FS8430G1ES | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33FS8430G1ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks |
