Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | Additional Feature | HTS Code | Number of Functions | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Telecom IC Type | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code |
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MC13892DJVL | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 1.6mm | ROHS3 Compliant | 2004 | 186-LFBGA | 12mm | 12mm | 186 | 12 Weeks | EAR99 | 8542.39.00.01 | 1 | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | YES | BOTTOM | BALL | 260 | 3.6V | 0.8mm | MC13892 | 3.6V | 1.8V | 1 | POWER SUPPLY MANAGEMENT CIRCUIT | NOT SPECIFIED | YES | Power Management Circuits | 3.6V | 1.5mA | Not Qualified | S-PBGA-B186 | ||||||||
MC33FS8510A3ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 2 Weeks | |||||||||||||||||||||||||||||||||||||||
MC33FS6512LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MWCT1213VLH | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||
MC33FS8530A0ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||
MC33FS6513NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC33FS8530A4ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 2 Weeks | |||||||||||||||||||||||||||||||||||||||
MC34PF8100A0EPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||||||
MC33FS6522CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC35FS4501NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | |||||||||||||||||||||||||||||||
MC34PF8100EREPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||||||
MC33FS8430G4ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||
MC35FS6511NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC35FS6510CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 15 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC33FS4500LAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC34PF4210A2ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | 0.9mm | ROHS3 Compliant | /files/nxpusainc-mc32pf4210a2esr2-datasheets-8188.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | 12 Weeks | 1 | Audio, Video | YES | 2.8V~4.5V | QUAD | NO LEAD | 260 | 3.6V | 0.5mm | 4.5V | 2.8V | 14 | POWER SUPPLY SUPPORT CIRCUIT | 40 | YES | S-XQCC-N56 | ||||||||||||||
MC33FS8410G6ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||
MWCT1R24ZVHT | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | /files/nxpusainc-mwct1r24zvht-datasheets-8459.pdf | 2 Weeks | TELECOM CIRCUIT | |||||||||||||||||||||||||||||||||||||
MC35FS4501CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | |||||||||||||||||||||||||||||||
MC33FS8410G6ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||
MC33FS6502LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC35FS6502NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~150°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc35fs6513cae-datasheets-3127.pdf | 48-LQFP Exposed Pad | 16 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC32PF3001A4EP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 0.9mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc34pf3001a7ep-datasheets-4424.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | EAR99 | OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V | 8542.39.00.01 | 1 | Processor | YES | 2.8V~5.5V | QUAD | NO LEAD | NOT SPECIFIED | 3.6V | 0.5mm | 4.5V | 2.8V | 10 | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | YES | S-XQCC-N48 | ||||||||||
MC34PF8100EPEPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||
MC33FS4501NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC34PF8100CFEPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc34pf8100epepr2-datasheets-8462.pdf | 56-VFQFN Exposed Pad | 2 Weeks | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | |||||||||||||||||||||||||||||||
MC33FS4502NAE | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC33FS8410G3ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | 2 Weeks | |||||||||||||||||||||||||||||||||||||||
MC33FS6503CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||
MC33FS6503NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 |
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