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ContactSpecialized Power Management ICs(5989)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | Additional Feature | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Telecom IC Type | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Qualification Status | JESD-30 Code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC32PF4210A4ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | 0°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc32pf4210a2esr2-datasheets-8188.pdf | 56-VFQFN Exposed Pad | 2 Weeks | Audio, Video | 2.8V~4.5V | POWER SUPPLY SUPPORT CIRCUIT | |||||||||||||||||||||||||||||||||
| MC33FS4501CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||
| MC33PF3000A4ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | MOS | 0.9mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc32pf3000a2ep-datasheets-2915.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | EAR99 | ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V | 8542.39.00.01 | 1 | i.MX Processors | YES | 2.8V~5.5V | QUAD | NO LEAD | 260 | 3.6V | 0.5mm | 4.5V | 2.8V | 12 | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | YES | S-XQCC-N48 | |||||||||||
| MC33FS4502NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||
| MC34PF3000A5EP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | MOS | 0.9mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc34pf3000a0ep-datasheets-3905.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | EAR99 | ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V | 8542.39.00.01 | 1 | i.MX Processors | YES | 2.8V~5.5V | QUAD | NO LEAD | 260 | 3.6V | 0.5mm | 4.5V | 2.8V | 12 | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | YES | S-XQCC-N48 | |||||||||||
| MC33FS8410G3ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 2 Weeks | |||||||||||||||||||||||||||||||||||||||||
| MC33FS6510NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||
| MWCT1011CFM | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | 32-VFQFN Exposed Pad | 32 | 13 Weeks | 8542.39.00.01 | 1 | General Purpose | YES | 2.7V~3.6V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | TELECOM CIRCUIT | NOT SPECIFIED | S-XQCC-N32 | |||||||||||||||||||||||
| MC32PF8121F2EPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | /files/nxpusainc-mc32pf8121f1epr2-datasheets-8209.pdf | 56-VFQFN Exposed Pad | 2 Weeks | Industrial, IoT | 2.5V~5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||||||||
| MC34709VKR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 370μA | 1.25mm | ROHS3 Compliant | 2004 | /files/nxpusainc-mc34709vk-datasheets-2843.pdf | 130-LFBGA | 8mm | 8mm | 130 | 16 Weeks | EAR99 | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Processor | YES | 3V~4.5V | BOTTOM | BALL | 260 | 3.6V | 0.5mm | MC34709 | 4.5V | 3V | 15 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | YES | Power Management Circuits | 3/4.5V | Not Qualified | S-PBGA-B130 | ||||||
| MC33FS4500LAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||
| MC13892CJVKR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 1.2mm | ROHS3 Compliant | 2004 | 139-TFBGA | 7mm | 7mm | 139 | 12 Weeks | EAR99 | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | YES | BOTTOM | BALL | 260 | 3.6V | 0.5mm | MC13892 | 3.6V | 1.8V | 1 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | YES | Power Management Circuits | 3.6V | Not Qualified | S-PBGA-B139 | |||||||||
| MC34PF4210A4ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc32pf4210a2esr2-datasheets-8188.pdf | 56-VFQFN Exposed Pad | 12 Weeks | Audio, Video | 2.8V~4.5V | POWER SUPPLY SUPPORT CIRCUIT | |||||||||||||||||||||||||||||||||
| MC33VR5500V2ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||
| MC32PF4210A2ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | 0°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc32pf4210a2esr2-datasheets-8188.pdf | 56-VFQFN Exposed Pad | 12 Weeks | Audio, Video | 2.8V~4.5V | 260 | POWER SUPPLY SUPPORT CIRCUIT | 40 | |||||||||||||||||||||||||||||||
| MC33FS6500CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||
| TDA3681TH/N2S,518 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 110μA | ROHS3 Compliant | 2003 | /files/nxpusainc-tda3681jn2s112-datasheets-3498.pdf | 20-SOIC (0.433, 11.00mm Width) Exposed Pad | 14 Weeks | Ignition Buffer, Regulator | 9.5V~18V | TDA3681 | |||||||||||||||||||||||||||||||
| MC34PF1550A2EP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | 14 Weeks | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | ||||||||||||||||||||||||||||||||
| MC33FS8400G5ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 2 Weeks | |||||||||||||||||||||||||||||||||||||||||
| MC33PF3000A3ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | MOS | 0.9mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc32pf3000a2ep-datasheets-2915.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | EAR99 | ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V | 8542.39.00.01 | 1 | i.MX Processors | YES | 2.8V~5.5V | QUAD | NO LEAD | 260 | 3.6V | 0.5mm | 4.5V | 2.8V | 12 | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | YES | S-XQCC-N48 | |||||||||||
| MC33664ATL1EGR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | /files/nxpusainc-mc33664atl1egr2-datasheets-8229.pdf | 16-SOIC (0.154, 3.90mm Width) | 16 Weeks | Isolated Communications Interface | 4.5V~5.5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||
| MC33PF3000A5ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | MOS | 0.9mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc32pf3000a2ep-datasheets-2915.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | EAR99 | ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V | 8542.39.00.01 | 1 | i.MX Processors | YES | 2.8V~5.5V | QUAD | NO LEAD | 260 | 3.6V | 0.5mm | 4.5V | 2.8V | 12 | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | YES | S-XQCC-N48 | |||||||||||
| MC34PF1550A3EP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | 14 Weeks | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | ||||||||||||||||||||||||||||||||
| MC33FS4500CAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||
| MC33FS6500NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 | ||||||||||||||||||||||||||||||
| MC32PF4210A4ESR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | 0°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc32pf4210a2esr2-datasheets-8188.pdf | 56-VFQFN Exposed Pad | 2 Weeks | Audio, Video | 2.8V~4.5V | POWER SUPPLY SUPPORT CIRCUIT | |||||||||||||||||||||||||||||||||
| MC34PF3000A8EP | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mc32pf3000a2ep-datasheets-2915.pdf | 48-VFQFN Exposed Pad | 16 Weeks | EAR99 | 8542.39.00.01 | i.MX Processors | 2.8V~5.5V | NOT SPECIFIED | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | |||||||||||||||||||||||||||||
| MC34PF1550A1EP | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | 14 Weeks | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | ||||||||||||||||||||||||||||||||
| MC33PF3000A6ES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | MOS | 0.9mm | ROHS3 Compliant | 2011 | /files/nxpusainc-mc32pf3000a2ep-datasheets-2915.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 16 Weeks | EAR99 | ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V | 8542.39.00.01 | 1 | i.MX Processors | YES | 2.8V~5.5V | QUAD | NO LEAD | 260 | 3.6V | 0.5mm | 4.5V | 2.8V | 12 | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | YES | S-XQCC-N48 | |||||||||||
| MC33FS4500NAER2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mc33fs4503cae-datasheets-3033.pdf | 48-LQFP Exposed Pad | 17 Weeks | System Basis Chip | 1V~5V | 260 | INTERFACE CIRCUIT | 40 |
