Products
Manufacturer
RFQ
NEWS
ContactMicrosemi(18086)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Reference Standard | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Number of Elements | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Number of I/O | Peripherals | Core Architecture | RAM Size | Turn On Delay Time | Speed Grade | Rise Time | Fall Time (Typ) | Turn-Off Delay Time | Continuous Drain Current (ID) | Gate to Source Voltage (Vgs) | Transistor Element Material | Configuration | Case Connection | Transistor Application | Drain to Source Voltage (Vdss) | Architecture | DS Breakdown Voltage-Min | Number of Outputs | Speed | Power Dissipation-Max | Number of Registers | Number of Inputs | Number of Gates | Core Processor | Connectivity | Number of Logic Elements/Cells | FET Type | Input Capacitance (Ciss) (Max) @ Vds | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Number of CLBs | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Current - Continuous Drain (Id) @ 25°C | Gate Charge (Qg) (Max) @ Vgs | Drive Voltage (Max Rds On,Min Rds On) | Vgs (Max) | Module/Board Type | Total RAM Bits |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| APT50N60JCCU2 | Microsemi |
Min: 1 Mult: 1 |
download | Chassis Mount, Screw | Chassis Mount | -40°C~150°C TJ | Bulk | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | RoHS Compliant | 1997 | /files/microsemicorporation-apt50n60jccu2-datasheets-1058.pdf | SOT-227-4, miniBLOC | 4 | 36 Weeks | 4 | IN PRODUCTION (Last Updated: 1 month ago) | yes | EAR99 | No | UPPER | UNSPECIFIED | 4 | 290W | 1 | FET General Purpose Power | 30 ns | 20ns | 20 ns | 100 ns | 50A | 20V | SILICON | SINGLE WITH BUILT-IN DIODE | ISOLATED | SWITCHING | 600V | 600V | 290W Tc | N-Channel | 6800pF @ 25V | 45m Ω @ 22.5A, 10V | 3.9V @ 3mA | 50A Tc | 150nC @ 10V | 10V | ±20V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050T-FG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 166MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 7 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050T | 484-FPBGA (23x23) | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JAN2N6901 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/570 | Through Hole | Through Hole | -55°C~150°C TJ | Bulk | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | Non-RoHS Compliant | 1997 | /files/microsemicorporation-jantx2n6901-datasheets-1817.pdf | TO-205AF Metal Can | 3 | 3 | EAR99 | No | 8541.21.00.95 | MIL-19500/570B | BOTTOM | WIRE | 2 | 1 | Qualified | 25 ns | 80ns | 80 ns | 45 ns | 1.69A | 10V | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 100V | 100V | 8.33W Tc | N-Channel | 1.4 Ω @ 1.07A, 5V | 2V @ 1mA | 1.69A Tc | 5nC @ 5V | 5V | ±10V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060T-FGG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SK-AX1-CQ352-KITBTM | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2003 | /files/microsemicorporation-lg1272daisychain-datasheets-8022.pdf | Metal | 20 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060T-1VFG400 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.51mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 400-LFBGA | 17mm | 17mm | 400 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B400 | 207 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 207 | 166MHz | 207 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMPA-144TQ-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S010T-1FGG484M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 3 days ago) | 3A001.A.2.C | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 233 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 233 | 166MHz | 233 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM256FG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | No | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060-1FG676I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 676-FBGA (27x27) | 387 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 60K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMPA-100TQ-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | TQFP | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050TS-FG896 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 896-BGA | 31mm | 31mm | 896 | 4 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B896 | 377 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 377 | 166MHz | 377 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMSF-288CS-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050T-FG896I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B896 | 377 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 377 | 166MHz | 377 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMPA-896FG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | No | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-1FCS325 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.16mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 13.5mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | R-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-108QN-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050T-1FG896I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 896-BGA | 1.2V | 8 Weeks | 1.26V | 1.14V | 896 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050T | 896-FBGA (31x31) | 377 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM2S-325FCSR-MSSOC | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-1FGG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 23mm | 23mm | 1.2V | 484 | 10 Weeks | 484 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | M2S090T | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 267 | DDR, PCIe, SERDES | ARM | 64KB | 1 | MCU, FPGA | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P250-FG256I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 231MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3p600pqg208i-datasheets-5753.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 256 | 8 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 1 month ago) | 3A001.A.7.B | No | 8542.39.00.01 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | A3P250 | 30 | 157 | 4.5kB | 6144 | 250000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050T-1FGG484M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | /files/microsemicorporation-m2s005s1vfg400t2-datasheets-2817.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 3A001.A.2.C | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL030V2-UCG81I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 4μA | RoHS Compliant | 2016 | /files/microsemicorporation-agl600v5fgg256i-datasheets-6582.pdf | 81-WFBGA, CSBGA | 4mm | 660μm | 4mm | 1.5V | 81 | 22 Weeks | 81 | IN PRODUCTION (Last Updated: 3 weeks ago) | 250MHz | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | AGL030 | NOT SPECIFIED | Not Qualified | 66 | 30000 | 768 | FIELD PROGRAMMABLE GATE ARRAY | 768 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-FCS536 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0686.pdf | 536-LFBGA, CSPBGA | 536 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGLN010V5-QNG48I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3μA | RoHS Compliant | 2013 | /files/microsemicorporation-agln010v5ucg36i-datasheets-4103.pdf | 48-VFQFN Exposed Pad | 6mm | 880μm | 6mm | 1.5V | Lead Free | 48 | 22 Weeks | 48 | IN PRODUCTION (Last Updated: 1 month ago) | 250MHz | 8542.39.00.01 | 1.425V~1.575V | QUAD | NO LEAD | NOT SPECIFIED | 1.5V | 0.4mm | AGLN010 | NOT SPECIFIED | Not Qualified | 34 | 10000 | 260 | FIELD PROGRAMMABLE GATE ARRAY | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-FCSG536I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA150-TQG100 | Microsemi |
Min: 1 Mult: 1 |
download | ProASICPLUS | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 180MHz | 5mA | RoHS Compliant | 2007 | /files/microsemicorporation-apa150pqg208-datasheets-1175.pdf | 100-LQFP | 14mm | 1.4mm | 14mm | 2.5V | Lead Free | 100 | 12 Weeks | 657.000198mg | 100 | IN PRODUCTION (Last Updated: 1 month ago) | No | 8542.39.00.01 | e3 | Matte Tin (Sn) | 2.3V~2.7V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | APA150 | 40 | Field Programmable Gate Arrays | 2.52.5/3.3V | 4.5kB | 66 | 4.5kB | 66 | 6144 | 150000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-1FCG1152 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.9mm | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 12 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S150 | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 574 | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P125-FG144T | Microsemi |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, ProASIC3 | Surface Mount | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3p060vqg100t-datasheets-8475.pdf | 144-LBGA | 13mm | 1.05mm | 13mm | 1.5V | 144 | 18 Weeks | 400.011771mg | 144 | IN PRODUCTION (Last Updated: 1 month ago) | No | 231MHz | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 235 | 1.5V | 1mm | A3P125 | 20 | Field Programmable Gate Arrays | 1.5/3.3V | 97 | 4.5kB | 97 | 3072 | 125000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090-FGG676I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 425 | 166MHz | 425 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB |
