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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Impedance | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Tolerance | JESD-609 Code | Feature | Terminal Finish | Polarity | Reference Standard | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Number of Elements | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Memory Size | Number of I/O | Peripherals | Core Architecture | RAM Size | Voltage - Input | Speed Grade | Max Reverse Leakage Current | Zener Voltage | Case Connection | Test Current | Architecture | Number of Outputs | Speed | Diode Element Material | Reference Voltage | Voltage Tol-Max | Diode Type | Voltage Tolerance | Number of Registers | Number of Inputs | Number of Gates | Current - Output / Channel | Utilized IC / Part | Voltage - Output | Impedance-Max | Voltage Temp Coeff-Max | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Supplied Contents | Current - Reverse Leakage @ Vr | Voltage - Forward (Vf) (Max) @ If | Module/Board Type | Total RAM Bits | Outputs and Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S090T-1FCS325I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.16mm | Non-RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 13.5mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | R-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM624LG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025T-1FGG484M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-896LG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | Hardware | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050TS-1VFG400I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | RoHS Compliant | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 400-LFBGA | 8 Weeks | 400 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050TS | 400-VFBGA (17x17) | 207 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P600-FG256I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 231MHz | Non-RoHS Compliant | /files/microsemicorporation-a3p600pqg208i-datasheets-5753.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | Contains Lead | 256 | 12 Weeks | 400.011771mg | 256 | 3A001.A.7.A | Lead, Silver, Tin | No | 8542.39.00.01 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | A3P600 | 30 | 177 | 13.5kB | 13824 | 600000 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090TS-FG676I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 425 | 166MHz | 425 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL090-FGG484I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2000 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 484 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | 267 | 267 | 86184 | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090TS-1FGG484T2 | Microsemi |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, SmartFusion®2 | -40°C~125°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | 2016 | /files/microsemicorporation-m2s005s1fgg484t2-datasheets-3043.pdf | 484-BGA | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | yes | NOT SPECIFIED | NOT SPECIFIED | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA150-TQG100I | Microsemi |
Min: 1 Mult: 1 |
download | ProASICPLUS | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 180MHz | RoHS Compliant | 2007 | /files/microsemicorporation-apa150pqg208-datasheets-1175.pdf | 100-LQFP | 14mm | 1.4mm | 14mm | 2.5V | 100 | 10 Weeks | 657.000198mg | 100 | IN PRODUCTION (Last Updated: 3 weeks ago) | Tin | No | 8542.39.00.01 | e3 | 2.3V~2.7V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | APA150 | 40 | Field Programmable Gate Arrays | 2.52.5/3.3V | 66 | 4.5kB | 66 | 6144 | 150000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-1FGG676I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005vfg256i-datasheets-1224.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S090T | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 425 | 425 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGLN250V2-CSG81I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 34μA | RoHS Compliant | 2015 | /files/microsemicorporation-agln010v5ucg36i-datasheets-4103.pdf | 81-WFBGA, CSBGA | 5mm | 660μm | 5mm | 1.5V | Lead Free | 81 | 10 Weeks | 81 | IN PRODUCTION (Last Updated: 1 month ago) | 3A001.A.7.A | No | 250MHz | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 1.2V | AGLN250 | 4.5kB | 60 | 4.5kB | 250000 | 6144 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-1FCV484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BFBGA | 1.2V | 10 Weeks | 484 | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-FBGA (19x19) | 273 | DDR, PCIe, SERDES | 64KB | 1 | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 150K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL010-1VFG400I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 1.51mm | RoHS Compliant | /files/microsemicorporation-m2gl005s1vf400i-datasheets-6764.pdf | 400-LFBGA | 17mm | 17mm | 400 | 12 Weeks | 400 | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | M2GL010 | 30 | Field Programmable Gate Arrays | 1.2V | Not Qualified | 195 | 114kB | 195 | 12084 | FIELD PROGRAMMABLE GATE ARRAY | 933888 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-1FCSG536I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL005-VF400 | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 1.51mm | Non-RoHS Compliant | 2013 | /files/microsemicorporation-m2gl005s1vf400i-datasheets-6764.pdf | 400-LFBGA | 17mm | 17mm | 1.2V | 400 | 11 Weeks | 400 | IN PRODUCTION (Last Updated: 3 weeks ago) | 400MHz | not_compliant | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | M2GL005 | 20 | Field Programmable Gate Arrays | Not Qualified | 667 Mbps | 128kB | 169 | 87.9kB | 171 | 6060 | 11 | FIELD PROGRAMMABLE GATE ARRAY | 719872 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150TS-FCS536I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL025T-FG484I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2013 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | Lead Free | 484 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | 267 | 267 | 27696 | FIELD PROGRAMMABLE GATE ARRAY | 1130496 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-FCS536I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LX1990-03 EVAL KIT | Microsemi |
Min: 1 Mult: 1 |
download | Bulk | 1 (Unlimited) | Programmable Output Current | 2.7V~5.5V | 30mA | LX1990 | 10V | Board(s) | 2, Non-Isolated | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090-1FG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005vfg256i-datasheets-1224.pdf | 484-BGA | 23mm | 23mm | Contains Lead | 484 | 8 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S090 | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 267 | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M1AGL1000V5-FGG484 | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | 70°C | 0°C | 127μA | RoHS Compliant | 2015 | /files/microsemicorporation-agl600v5fgg256i-datasheets-6582.pdf | 484-BGA | Lead Free | 12 Weeks | 484 | IN PRODUCTION (Last Updated: 3 weeks ago) | 250MHz | 1.425V~1.575V | M1AGL1000 | 484-FPBGA (23x23) | 300 | 18kB | 1000000 | 24576 | 147456 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| UXD20PE | Microsemi |
Min: 1 Mult: 1 |
download | Prescaler | 3 (168 Hours) | 0Hz~20GHz | Non-RoHS Compliant | /files/microsemicorporation-uxd20pe-datasheets-2179.pdf | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL090-FG676I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | 425 | 425 | 86184 | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1N829UR-1 | Microsemi |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -55°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-1n829ur1-datasheets-3493.pdf | DO-213AA (Glass) | 2 | 20 Weeks | 2 | IN PRODUCTION (Last Updated: 3 weeks ago) | no | 15Ohm | EAR99 | METALLURGICALLY BONDED | Lead, Tin | 8541.10.00.50 | ±5% | e0 | TIN LEAD | 500mW | END | WRAP AROUND | NOT SPECIFIED | 2 | Single | NOT SPECIFIED | 500mW | 1 | Voltage Reference Diodes | Not Qualified | 6.2V | ISOLATED | 7.5mA | SILICON | 6.2V | 4.84% | ZENER DIODE | 5% | 15Ohm | 0.031mV/°C | 2μA @ 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA450-PQG208 | Microsemi |
Min: 1 Mult: 1 |
download | ProASICPLUS | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 180MHz | 5mA | RoHS Compliant | 2009 | /files/microsemicorporation-apa150pqg208-datasheets-1175.pdf | 208-BFQFP | 28mm | 3.4mm | 28mm | 2.5V | Lead Free | 208 | 14 Weeks | 208 | No | 8542.39.00.01 | e3 | Matte Tin (Sn) | 2.3V~2.7V | QUAD | GULL WING | 245 | 2.5V | 0.5mm | APA450 | 40 | Field Programmable Gate Arrays | 2.52.5/3.3V | 13.5kB | 158 | 13.5kB | 158 | 12288 | 450000 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX1N4626-1 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/435 | Through Hole | Through Hole | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-jantx1n46261-datasheets-4374.pdf | DO-204AH, DO-35, Axial | Contains Lead | 2 | 14 Weeks | 2 | IN PRODUCTION (Last Updated: 4 weeks ago) | no | 1.4kOhm | EAR99 | METALLURGICALLY BONDED | No | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500/435 | 500mW | WIRE | 1N4626 | 2 | Single | 480mW | 1 | Qualified | 10μA | 5.6V | ISOLATED | 250μA | SILICON | 5.6V | 5% | ZENER DIODE | 5% | 1.4kOhm | 10μA @ 4V | 1.1V @ 200mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL1000V2-FG256I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2013 | /files/microsemicorporation-agl600v5fgg256i-datasheets-6582.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 256 | 20 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 3 weeks ago) | 892.86MHz | 8542.39.00.01 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | AGL1000 | 30 | Not Qualified | 177 | 18kB | 1000000 | 24576 | FIELD PROGRAMMABLE GATE ARRAY | 147456 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX1N5530B-1 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/437 | Through Hole | Through Hole | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | /files/microsemicorporation-jantx1n5530b1-datasheets-4511.pdf | DO-204AH, DO-35, Axial | Contains Lead | 2 | 14 Weeks | 2 | IN PRODUCTION (Last Updated: 1 month ago) | no | 60Ohm | EAR99 | METALLURGICALLY BONDED | No | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500 | 500mW | WIRE | 1N5530 | 2 | Single | 417mW | 1 | Qualified | 50nA | 10V | ISOLATED | 1mA | SILICON | 10V | 5% | ZENER DIODE | 5% | 60Ohm | 8μA @ 9.1V | 1.1V @ 200mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA300-BG456M | Microsemi |
Min: 1 Mult: 1 |
download | ProASICPLUS | Surface Mount | Surface Mount | -55°C~125°C TC | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | /files/microsemicorporation-apa300cq208m-datasheets-8399.pdf | 456-BBGA | 35mm | 1.73mm | 35mm | 2.5V | 456 | 11 Weeks | 456 | IN PRODUCTION (Last Updated: 1 month ago) | 3A001.A.2.C | No | 180MHz | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 1.27mm | APA300 | 30 | Field Programmable Gate Arrays | 2.52.5/3.3V | 290 | 9kB | 290 | 8192 | 300000 | FIELD PROGRAMMABLE GATE ARRAY | 73728 |
