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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Evaluation Kit | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Ambient Temperature Range High | JESD-30 Code | Memory Size | Memory Type | RAM Size | Speed Grade | Number of Outputs | Number of Registers | Number of Inputs | Output Characteristics | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Endurance | Data Retention Time-Min | I/O Type | Memory IC Type | Programmable Logic Type | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | License - User Details | Media Delivery Type | License Length | Programmable Type | Combinatorial Delay of a CLB-Max | Number of Terminals |
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| EF-DI-10GEMAC-PROJ | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2015 | Project | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC2V1000-6FG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 2mm | RoHS Compliant | FBGA | 17mm | 17mm | 1.5V | 256 | no | EAR99 | No | 8542.39.00.01 | e0 | YES | BOTTOM | BALL | 225 | 1.5V | 1mm | 256 | OTHER | 1.575V | 30 | Field Programmable Gate Arrays | 1.51.5/3.33.3V | 90kB | 6 | 172 | 10240 | 172 | 820MHz | 1280 CLBS, 1000000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 11520 | 1000000 | 1280 | 0.35 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-TCCDEC-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XQ6VLX130T-L1FFG1156I | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | CMOS | RoHS Compliant | compliant | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 0.9V | 1mm | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B1156 | 600 | 600 | 1098MHz | FIELD PROGRAMMABLE GATE ARRAY | 128000 | 1156 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-10GEMAC-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Site | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-IMG-CHAR-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | RoHS Compliant | 2014 | Site | Electronically Delivered | 1 Year Renewal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-TCCENC-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2015 | Site | Electronically Delivered | 1 Year Renewal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DV-SPVIV-DES-PP-100-XDV | Xilinx |
Min: 1 Mult: 1 |
download | Integrated Development Environment (IDE) | Vivado™ Design Suite | 1 (Unlimited) | Non-RoHS Compliant | 6 Weeks | Yes | Programming | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EMR-DI-XLAUI-RLL | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Redistribution Limited | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EMR-DI-40GEMAC-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Site | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-MODULARVOIP-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Site | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM-DI-XLAUI-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Site | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-SDSOC-FL | Xilinx |
Min: 1 Mult: 1 |
download | License | Not Applicable | ROHS3 Compliant | /files/xilinxinc-efsdsocfl-datasheets-3897.pdf | 2 Weeks | Programming | Floating Node | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-ERNIC-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2 Weeks | Site | Electronically Delivered | 1 Year Renewal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-CFA-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-MIPI-DSI-TX-WW | Xilinx |
Min: 1 Mult: 1 |
download | Not Applicable | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LMS-FPGA-VDM | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-INTERLEAV-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2010 | Module | 2 Weeks | No | Site | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S10XLVOG8I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | 8 | EAR99 | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC17S10XL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 100kb | 3-STATE | 10MHz | 95752X1 | 1 | 95752 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||||||||||||||||||||||||||||||||||||||
| XC17S50AVOG8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 1.2mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 3.3V | 8 | 8 | 1 Mb | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC17S50A | 8 | 3.6V | 3V | 30 | 0.015mA | 500kb | 3-STATE | 559200X1 | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||
| XCF08PVOG48C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 50MHz | ROHS3 Compliant | 1999 | /files/xilinxinc-xcf16pfsg48c-datasheets-1087.pdf | 48-TFSOP (0.724, 18.40mm Width) | 12.1mm | 1.2mm | 18.5mm | 1.8V | Lead Free | 48 | 10 Weeks | Unknown | 48 | Parallel | yes | EAR99 | No | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | 1.65V~2V | DUAL | GULL WING | 260 | 1.8V | 0.5mm | XCF*P | 48 | 2V | 1.65V | 30 | 0.04mA | 85°C | 8Mb | FLASH | 8MX1 | 8388608 bit | SERIAL | 0.001A | 20000 Write/Erase Cycles | In System Programmable | ||||||||||||||||||||||||||||||||||||||||||
| XCF32PFS48C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xcf16pfsg48c-datasheets-1087.pdf | 48-TFBGA, CSPBGA | 9mm | 8mm | 1.8V | Contains Lead | 48 | 13 Weeks | 48 | no | EAR99 | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | not_compliant | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | 1.65V~2V | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | XCF*P | 48 | 2V | 1.65V | NOT SPECIFIED | Flash Memories | 0.04mA | Not Qualified | 32Mb | 32MX1 | 1 | 33554432 bit | SERIAL | 20000 Write/Erase Cycles | 20 | CONFIGURATION MEMORY | In System Programmable | |||||||||||||||||||||||||||||||||||||||||
| XC17128ELPC20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17128EL | 20 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 128kb | 3-STATE | 15MHz | 128KX1 | 1 | 131072 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||
| XC1701PC20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | no | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 4.5V~5.5V | QUAD | J BEND | 225 | 5V | 1.27mm | XC1701 | 20 | 5.5V | 4.5V | 30 | 5V | 0.02mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | 1048576 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||
| XC17S05XLVO8I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | YES | 3V~3.6V | DUAL | GULL WING | 3.3V | 1.27mm | XC17S05XL | 8 | 3.6V | 3V | 3.3V | 0.005mA | Not Qualified | 50kb | 3-STATE | 10MHz | 54544X1 | 1 | 54544 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S15ASO20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 2.65mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 20-SOIC (0.295, 7.50mm Width) | 12.8mm | 7.5mm | 3.3V | Contains Lead | 20 | 20 | 512 kb | no | EAR99 | No | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | DUAL | GULL WING | 225 | 3.3V | 1.27mm | XC17S15A | 20 | 3.6V | 3V | 30 | 0.005mA | 150kb | 3-STATE | 197696X1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||
| XC17S150AVO8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 3.3V | Contains Lead | 8 | 8 | 1 Mb | no | EAR99 | No | 1 | e0 | YES | 3V~3.6V | DUAL | GULL WING | 225 | 3.3V | 1.27mm | XC17S150A | 8 | 3.6V | 3V | 30 | 0.005mA | 1.5Mb | 3-STATE | 1040096X1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||
| XC17S30XLPD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | Not Applicable | CMOS | SYNCHRONOUS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | NO | 3V~3.6V | DUAL | 3.3V | 2.54mm | XC17S30XL | 8 | 3.6V | 3V | 3.3V | 0.005mA | Not Qualified | 300kb | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S30XLVO8I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | YES | 3V~3.6V | DUAL | GULL WING | 3.3V | 1.27mm | XC17S30XL | 8 | 3.6V | 3V | 3.3V | 0.005mA | Not Qualified | 300kb | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17V08PC44I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 4.57mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc17v01vo8c-datasheets-2408.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 3.3V | Contains Lead | 44 | 44 | 8 Mb | no | EAR99 | No | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17V08 | 44 | 3.6V | 3V | 30 | 0.1mA | 3-STATE | 20MHz | 1MX8 | 8 | PARALLEL/SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP |
