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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Max Junction Temperature (Tj) | Ambient Temperature Range High | JESD-30 Code | Memory Size | Number of I/O | Memory Type | RAM Size | Turn On Delay Time | Speed Grade | Propagation Delay | Number of Outputs | Number of Registers | Output Characteristics | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Endurance | Data Retention Time-Min | Access Time (Max) | I/O Type | Memory IC Type | Number of Gates | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Number of Logic Cells | Number of CLBs | License - User Details | Media Delivery Type | License Length | Programmable Type | Total RAM Bits | Number of LABs/CLBs | Combinatorial Delay of a CLB-Max |
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| EF-DI-DVBS2-FEC-ENC-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2011 | Site | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LMS-ALL-1_USER | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-SPDIF-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2 Weeks | Site | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-CHROM-RESAMP-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-MIPI-CSI2-TX-WW | Xilinx |
Min: 1 Mult: 1 |
download | Not Applicable | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LMS-EMBD-ZUPSA | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC1701LPDG8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | 8 | yes | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC1701L | 8 | 3.6V | 3V | 30 | 3.3V | 0.01mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC1701LPCG20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 20 | 20 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 8542.32.00.61 | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | QUAD | J BEND | 245 | 3.3V | 1.27mm | XC1701L | 20 | 3.6V | 3V | 30 | 3.3V | 0.01mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | 1048576 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||
| XCF16PVOG48C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 50MHz | ROHS3 Compliant | 1999 | /files/xilinxinc-xcf16pfsg48c-datasheets-1087.pdf | 48-TFSOP (0.724, 18.40mm Width) | 18.45mm | 1.2mm | 12mm | 1.8V | Lead Free | 48 | 10 Weeks | Unknown | 48 | Parallel | yes | EAR99 | No | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | YES | 1.65V~2V | DUAL | GULL WING | 260 | 1.8V | 0.5mm | XCF*P | 48 | 2V | 1.65V | 30 | 0.04mA | 125°C | 85°C | 16Mb | FLASH | 16MX1 | 1 | 16777216 bit | SERIAL | 20000 Write/Erase Cycles | 20 | In System Programmable | |||||||||||||||||||||||||||||||||||||||||||
| XC18V512PCG20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 4.572mm | ROHS3 Compliant | 1999 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 3.3V | 20 | 10 Weeks | 20 | 512 kb | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | QUAD | J BEND | 245 | 3.3V | 1.27mm | XC18V512 | 20 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 33MHz | 64KX8 | 8 | PARALLEL/SERIAL | 0.01A | 20 | 15 ns | CONFIGURATION MEMORY | In System Programmable | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC18V04PC44C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 3.3V | Contains Lead | 44 | 10 Weeks | 44 | 4 Mb | no | EAR99 | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC18V04 | 44 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 20MHz | 512KX8 | 8 | PARALLEL/SERIAL | 0.01A | 20000 Write/Erase Cycles | 20 | 20 ns | CONFIGURATION MEMORY | In System Programmable | ||||||||||||||||||||||||||||||||||||||||||||||
| XC1701PC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 5V | Contains Lead | 20 | 20 | 1 Mb | no | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | No | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 4.75V~5.25V | QUAD | J BEND | 225 | 5V | 1.27mm | XC1701 | 20 | 30 | 5V | 0.02mA | 3-STATE | 15MHz | 1MX1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC17256ELPC20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17256EL | 20 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 256Kb | 3-STATE | 15MHz | 256KX1 | 1 | 262144 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||
| XC1765EPC20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 4.5V~5.5V | QUAD | J BEND | 225 | 5V | 1.27mm | XC1765E | 20 | 5.5V | 4.5V | 30 | 5V | 0.01mA | Not Qualified | 65kb | 3-STATE | 10MHz | 64KX1 | 1 | 65536 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||
| XC17S10PD8I | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | SYNCHRONOUS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | EAR99 | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | NO | 4.5V~5.5V | DUAL | 5V | 2.54mm | XC17S10 | 8 | 5.5V | 4.5V | 5V | 0.01mA | Not Qualified | R-PDIP-T8 | 100kb | 3-STATE | 10MHz | 95008X1 | 1 | 95008 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S200APD8I | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | no | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17S200A | 8 | 3.6V | 3V | 30 | 0.015mA | 2Mb | 3-STATE | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S30AVO8I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 3.3V | Contains Lead | 8 | 8 | 512 kb | no | EAR99 | No | 1 | e0 | YES | 3V~3.6V | DUAL | GULL WING | 225 | 3.3V | 1.27mm | XC17S30 | 8 | 3.6V | 3V | 30 | 0.005mA | 300kb | 3-STATE | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S40XLPD8I | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | SYNCHRONOUS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | NO | 3V~3.6V | DUAL | 3.3V | 2.54mm | XC17S40XL | 8 | 3.6V | 3V | 3.3V | 0.005mA | Not Qualified | 400kb | 3-STATE | 10MHz | 330696X1 | 1 | 330696 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17V02PC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc17v01vo8c-datasheets-2408.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 3.3V | Contains Lead | 20 | 20 | 2 Mb | no | EAR99 | No | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17V02 | 20 | 3.6V | 3V | 30 | 0.015mA | 3-STATE | 15MHz | 2MX1 | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S100ASO20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 2.65mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 20-SOIC (0.295, 7.50mm Width) | 12.8mm | 7.5mm | 3.3V | Contains Lead | 20 | 20 | 1 Mb | no | EAR99 | No | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | DUAL | GULL WING | 225 | 3.3V | 1.27mm | XC17S100A | 20 | 3.6V | 3V | 30 | 0.015mA | 3-STATE | 781216X1 | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||
| XC18V512SO20I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 2.65mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc18v04vq44i-datasheets-2494.pdf | 20-SOIC (0.295, 7.50mm Width) | 12.8mm | 7.5mm | 3.3V | Contains Lead | 20 | 20 | 512 kb | no | 3A991.B.1.A | No | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | DUAL | GULL WING | 225 | 3.3V | 1.27mm | XC18V512 | 20 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 33MHz | 64KX8 | 8 | PARALLEL/SERIAL | 0.01A | 10000 Write/Erase Cycles | 10 | 15 ns | CONFIGURATION MEMORY | In System Programmable | ||||||||||||||||||||||||||||||||||||||||||||||
| XC1765ELVOG8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9276mm | 3.937mm | Lead Free | 8 | 8 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC1765EL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 65kb | 3-STATE | 2.5MHz | 64KX1 | 1 | 65536 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||
| XC7K410T-1FBG676C | Xilinx |
Min: 1 Mult: 1 |
download | Kintex®-7 | Surface Mount | 0°C~85°C TJ | Tray | 4 (72 Hours) | CMOS | 2.54mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7k325t1ffg900i-datasheets-5484.pdf | 676-BBGA, FCBGA | 27mm | 27mm | 676 | 12 Weeks | 676 | yes | 3A991.D | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | 0.97V~1.03V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | XC7K410T | 676 | NOT SPECIFIED | Field Programmable Gate Arrays | 11.83.3V | Not Qualified | 400 | 3.5MB | -1 | 400 | 508400 | 1098MHz | 406720 | FIELD PROGRAMMABLE GATE ARRAY | 29306880 | 31775 | 0.74 ns | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC2S15-5TQ144C | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-II | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2008 | /files/xilinxinc-xc2s155tq144c-datasheets-8899.pdf | 144-LQFP | 20mm | 1.4mm | 20mm | 2.5V | Contains Lead | 144 | 10 Weeks | 144 | no | EAR99 | e0 | 2.375V~2.625V | QUAD | GULL WING | 225 | 2.5V | XC2S15 | 144 | 30 | Field Programmable Gate Arrays | Not Qualified | 86 | 2kB | 5 | 86 | 263MHz | 15000 | 432 | FIELD PROGRAMMABLE GATE ARRAY | 432 | 96 | 16384 | 96 | 0.7 ns | |||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX4-2CPG196C | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-6 LX | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.1mm | ROHS3 Compliant | 2008 | /files/xilinxinc-xc6slx452csg484c-datasheets-5636.pdf | 196-TFBGA, CSBGA | 8mm | 8mm | 1.2V | 196 | 10 Weeks | 196 | yes | EAR99 | e8 | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.5mm | XC6SLX4 | 196 | 30 | Field Programmable Gate Arrays | Not Qualified | 106 | 27kB | 2 | 100 | 4800 | 667MHz | 3840 | FIELD PROGRAMMABLE GATE ARRAY | 300 | 221184 | 300 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7A35T-2FTG256C | Xilinx |
Min: 1 Mult: 1 |
download | Artix-7 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.55mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7s251csga324c-datasheets-5458.pdf | 256-LBGA | 17mm | 17mm | 256 | 10 Weeks | 256 | yes | EAR99 | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 256 | NOT SPECIFIED | Field Programmable Gate Arrays | 1V | Not Qualified | 170 | 225kB | 850 ps | 2 | 850 ps | 170 | 33208 | FIELD PROGRAMMABLE GATE ARRAY | 1843200 | 2600 | 1.05 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3S200A-5FGG320C | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-3A | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | ROHS3 Compliant | 1999 | /files/xilinxinc-xc3s700a4fgg484c-datasheets-5684.pdf | 320-BGA | 19mm | 19mm | 1.2V | 320 | 10 Weeks | 320 | yes | 3A991.D | e1 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | XC3S200A | 320 | 30 | Field Programmable Gate Arrays | Not Qualified | 248 | 36kB | 5 | 192 | 770MHz | 200000 | 4032 | FIELD PROGRAMMABLE GATE ARRAY | 448 | 294912 | 448 | 0.62 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC2S100-5TQ144I | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-II | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | Non-RoHS Compliant | 2002 | /files/xilinxinc-xc2s155tq144c-datasheets-8899.pdf | 144-LQFP | 20mm | 20mm | 2.5V | Contains Lead | 144 | 10 Weeks | 144 | no | EAR99 | e0 | 2.375V~2.625V | QUAD | GULL WING | 225 | 2.5V | XC2S100 | 144 | 30 | Field Programmable Gate Arrays | Not Qualified | 92 | 5kB | 5 | 92 | 263MHz | 100000 | 2700 | FIELD PROGRAMMABLE GATE ARRAY | 600 | 40960 | 600 | 0.7 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX4-2TQG144C | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-6 LX | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2008 | /files/xilinxinc-xc6slx452csg484c-datasheets-5636.pdf | 144-LQFP | 1.2V | 144 | 10 Weeks | No SVHC | 144 | yes | EAR99 | Tin | e3 | 1.14V~1.26V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | XC6SLX4 | 144 | 30 | Field Programmable Gate Arrays | Not Qualified | 102 | 27kB | 2 | 100 | 4800 | 667MHz | 3840 | 600 | FIELD PROGRAMMABLE GATE ARRAY | 300 | 221184 | 300 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX9-2CSG225I | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-6 LX | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | 2008 | /files/xilinxinc-xc6slx452csg484c-datasheets-5636.pdf | 225-LFBGA, CSPBGA | 13mm | 13mm | 1.2V | 225 | 10 Weeks | 225 | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | XC6SLX9 | 225 | 30 | Field Programmable Gate Arrays | Not Qualified | 160 | 72kB | 2 | 160 | 11440 | 667MHz | 9152 | FIELD PROGRAMMABLE GATE ARRAY | 715 | 589824 | 715 |
