Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Accessory Type | Pbfree Code | Connector Type | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Screening Level | Number of I/O | Peripherals | Core Architecture | RAM Size | Speed Grade | Architecture | Cable Length | Number of Outputs | Wire/Cable Type | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | Combinatorial Delay of a CLB-Max |
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EFR-DI-50GBASE-KR2-PROJ | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EFR-DI-MIPI-DSI-TX-SITE | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | 111 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S1500-4FG676I0974 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX365T-2FF1759I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 1V | 1759 | no | 3A001.A.7.A | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | INDUSTRIAL | 1.05V | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 720 | 1.8MB | 2 | 720 | 364032 | 28440 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV400-6BG560I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | BGA | 42.5mm | 42.5mm | 560 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 1.27mm | 560 | 2.625V | 2.375V | 30 | Field Programmable Gate Arrays | 1.2/3.62.5V | Not Qualified | 404 | 404 | 333MHz | 2400 CLBS, 468252 GATES | FIELD PROGRAMMABLE GATE ARRAY | 10800 | 468252 | 2400 | 0.6 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
XC4VFX40-12FFG672C | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 85°C | 0°C | CMOS | 3mm | RoHS Compliant | FCBGA | 27mm | 27mm | 1.2V | 672 | 672 | yes | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1.2V | 1mm | 672 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 324kB | 12 | 352 | 1181MHz | 4656 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 41904 | 4656 | |||||||||||||||||||||||||||||||||||||||||||||||||
XCV100E-6CS144CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV100E-8PQ240CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV1000-6FG680I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | FBGA | 40mm | 40mm | 680 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 1mm | 680 | 2.625V | 2.375V | 30 | Field Programmable Gate Arrays | 1.2/3.62.5V | Not Qualified | S-PBGA-B680 | 512 | 512 | 333MHz | 6144 CLBS, 1124022 GATES | FIELD PROGRAMMABLE GATE ARRAY | 27648 | 1124022 | 6144 | 0.6 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
HW-RIBBON14 | Xilinx |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 1999 | /files/xilinxinc-hwribbon14-datasheets-6915.pdf | Contains Lead | 11 Weeks | 14 | Cable Assembly | Connector, IDC | 152mm | Ribbon | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX550T-L1FFG1760I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 900mV | 1760 | yes | 3A001.A.7.A | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 0.9V | 1mm | INDUSTRIAL | 0.93V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | 1200 | 2.8MB | 1098MHz | 549888 | 42960 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EV-1FFVC1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX255T-1FF1923C | Xilinx |
Min: 1 Mult: 1 |
download | CMOS | 3.85mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vhx255t1ff1923c-datasheets-4824.pdf | 45mm | 45mm | 1924 | 6 Weeks | no | 3A991.D | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 1924 | OTHER | 85°C | 1.05V | 0.95V | NOT SPECIFIED | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | S-PBGA-B1924 | 480 | 480 | 1098MHz | FIELD PROGRAMMABLE GATE ARRAY | 253440 | 5.08 ns | |||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z100-1FFG900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tube | 4 (72 Hours) | CMOS | 667MHz | 3.35mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 31mm | 31mm | 900 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z100 | 1.05V | 0.95V | 30 | S-PBGA-B900 | 212 | DMA | ARM | 256KB | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 444K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||
XC6VLX75T-2FF784I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | CMOS | RoHS Compliant | FCBGA | 1V | 784 | 784 | no | 3A991.D | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 784 | INDUSTRIAL | 1.05V | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 360 | 702kB | 2 | 360 | 74496 | 5820 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7CG-1FFVF1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XQ4VLX25-10SF363M | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | CMOS | 1.99mm | Non-RoHS Compliant | 17mm | 17mm | 363 | 3A001.A.2.C | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 1.2V | 0.8mm | 363 | MILITARY | 125°C | -55°C | 1.26V | 1.14V | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | S-PBGA-B363 | 240 | 240 | 1028MHz | 2688 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 24192 | 2688 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9CG-L1FFVB1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Bulk | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 328 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VLX760-1FFG1760I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1760 | yes | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1V | INDUSTRIAL | 30 | Field Programmable Gate Arrays | Not Qualified | 1200 | 3.2MB | 1 | 758784 | 59280 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5EV-L2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XA6SLX25-2FGG484I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 100°C | -40°C | RoHS Compliant | FBGA | 1.2V | 484 | 484 | 3A991.D | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1mm | 30 | Field Programmable Gate Arrays | Not Qualified | AEC-Q100 | 266 | 117kB | 2 | 266 | 30064 | 24051 | 1879 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EG-2FFVF1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3020-100PG84M | Xilinx |
Min: 1 Mult: 1 |
125°C | -55°C | CMOS | 4.318mm | Non-RoHS Compliant | 27.94mm | 27.94mm | 5V | 84 | 84 | 3A001.A.2.C | No | 8542.39.00.01 | e3 | MATTE TIN | NO | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 84 | MILITARY | Field Programmable Gate Arrays | 5V | 1.8kB | 100 | 64 | 256 | FIELD PROGRAMMABLE GATE ARRAY | 64 | 64 | 7 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9CG-2FFVC900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S50A-5VQ100C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 1.2mm | RoHS Compliant | TQFP | 14mm | 14mm | 1.2V | 100 | 100 | EAR99 | e0 | QUAD | GULL WING | 225 | 1.2V | 100 | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.33.3V | Not Qualified | 68 | 6.8kB | 5 | 62 | 770MHz | 50000 | 1584 | 176 | FIELD PROGRAMMABLE GATE ARRAY | 176 | 0.62 ns | |||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EV-3FFVC1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VLX30T-1FFG665CS1 | Xilinx |
Min: 1 Mult: 1 |
85°C | 0°C | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/xilinx-xc5vlx30t1ffg665cs1-datasheets-7112.pdf | FCBGA | 1V | No | 162kB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-2FFVC1760I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VLX85-3FF1153C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/xilinx-xc5vlx853ff1153c-datasheets-7461.pdf | FCBGA | 1V | 6 Weeks | 1153 | e0 | BOTTOM | BALL | 225 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 560 | 432kB | 3 | 560 | 1412MHz | 82944 | 6480 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-2FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
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