Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Size / Dimension | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Frequency | Operating Supply Current | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Factory Lead Time | Weight | REACH SVHC | Number of Pins | Interface | Connector Type | MIL Conformance | DIN Conformance | IEC Conformance | Filter Feature | Mixed Contacts | Option | Contact Gender | Empty Shell | Contact Finish - Mating | Number of Ports | ECCN Code | Additional Feature | Contact Material | Total Number of Contacts | Radiation Hardening | Max Frequency | HTS Code | Evaluation Kit | Terminal Pitch | Subcategory | Data Rate | Max Output Current | Memory Size | Power Consumption | Memory Type | Core Architecture | RAM Size | Insulation Material | Termination Type | Speed | Mounting Style | Shell Material | Reliability | PCB Contact Pattern | Contact Style | Mounting Option 1 | Number of UART Channels | Address Bus Width | Board Mounting Option | Core Processor | Flash Size | Module/Board Type | Co-Processor |
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TE0720-03-1CR | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0720 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | Not Applicable | ROHS3 Compliant | 2015 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 12 Weeks | Samtec LSHM | 256MB | ARM Cortex-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
20-101-0383 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RabbitCore RCM2000 | -40°C~85°C | 1.9 x 2.3 48.3mmx58.4mm | 1 (Unlimited) | 18.432MHz | RoHS Compliant | 2009 | /files/digi-1010399-datasheets-8872.pdf | Module | 5.25V | Lead Free | 4 Weeks | Serial | 2 IDC Headers 2x20 | 98mA | 128KB | Rabbit 2000 | 256KB | MPU Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||
DC-ME-Y401-C | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect ME® | -40°C~80°C | 1.45 x 0.75 36.7mmx19.1mm | 1 (Unlimited) | 75MHz | RoHS Compliant | 2008 | /files/digi-dcwmey413lx-datasheets-7066.pdf | Module | 3.3V | Lead Free | 3 Weeks | Ethernet, GPIO, I2C, SPI | RJ45 | No | 100 Mbps | 825mW | FLASH, NOR, SDRAM | ARM | 8MB | ARM926EJ-S, NS9210 | 2MB | MPU Core | |||||||||||||||||||||||||||||||||||||||||||||||||
20-101-1093 | Digi | $59.58 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RabbitCore RCM4100 | 0°C~70°C | 1.41 x 1.88 36mmx48mm | 1 (Unlimited) | 29.49MHz | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/digi-201011105-datasheets-6675.pdf | Module | 5 Weeks | IDC Header 2x25, 2x5 | No | 256KB | Rabbit 4000 | 512KB | MPU Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
EZ80L925148MODG | Zilog |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | eZ80® Acclaim!® | 0°C~70°C | 1 (Unlimited) | 48MHz | ROHS3 Compliant | 2003 | /files/zilog-ez80l925148modg-datasheets-5594.pdf | Module | Lead Free | 21 Weeks | Header 2x25 | 512KB | eZ80L92 | 8MB | MCU Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XP1001000M-05R | Lantronix, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XPort® | -40°C~85°C | Bulk | 0.57 x 0.72 14.5mmx18.3mm | Not Applicable | 85°C | -40°C | ROHS3 Compliant | 2011 | /files/lantronixinc-xp100200005r-datasheets-2493.pdf | Module | 33.9mm | 13.5mm | 16.25mm | 3.3V | 6 Weeks | Ethernet | RJ45 | 921.6 kbps | 256KB | 25MHz | DSTni-EX | 512KB | MPU Core | XPort AR | |||||||||||||||||||||||||||||||||||||||||||||||
XP1001000-05R | Lantronix, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XPort® | BOARD | -40°C~85°C | 0.57 x 0.72 14.5mmx18.3mm | Not Applicable | 119mA | ROHS3 Compliant | 2005 | /files/lantronixinc-xp100200005r-datasheets-2492.pdf | Module | 3.3V | 6 Weeks | Unknown | Ethernet, Serial | RJ45 | NO | NO | NO | NO | NO | GENERAL PURPOSE | FEMALE | NO | NOT SPECIFIED | 1 | EAR99 | EMI SHIELDED | NOT SPECIFIED | 8 | 8536.69.40.30 | 2.54mm | Telecom and Datacom Connectors | 921.6 kbps | 256KB | POLYETHYLENE | SOLDER | 25MHz | RIGHT ANGLE | METAL | COMMERCIAL | STAGGERED | TELCOM, MODULAR | LOCKING | PEG | DSTni-EX | 512KB | MPU Core | XPort AR | ||||||||||||||||||||||||
20-101-1319 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MiniCore RCM6700 | -40°C~85°C | 1.2 x 2 30mmx51mm | 1 (Unlimited) | 85°C | -40°C | 162.5MHz | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/digi-1011327-datasheets-0877.pdf | Module | 3.3V | Lead Free | 5 Weeks | Unknown | Ethernet | Edge Connector - 52 | Yes | 250mA | 1.032MB | 162.5MHz | Rabbit 6000 | 1MB | MPU Core | ||||||||||||||||||||||||||||||||||||||||||||||||
XPDNC2000-01 | Lantronix, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XPort® Direct+™ | -40°C~85°C | 1.25 x 1.7 31.8mmx43.3mm | Not Applicable | 85°C | -40°C | 200mA | ROHS3 Compliant | /files/lantronixinc-xpd100100s01-datasheets-9523.pdf | 3.3V | 6 Weeks | Serial | RJ45 | No | 921.6 kbps | 256KB | 25MHz | DSTni-EX | 512KB | MPU Core | XPort Direct+ | |||||||||||||||||||||||||||||||||||||||||||||||||||
XP1002000-05R | Lantronix, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XPort® | -40°C~85°C | 0.57 x 0.72 14.5mmx18.3mm | Not Applicable | 85°C | -40°C | 119mA | ROHS3 Compliant | 2013 | /files/lantronixinc-xp100200005r-datasheets-2492.pdf | Module | 33.9mm | 13.5mm | 16.25mm | 3.3V | 6 Weeks | Ethernet, Serial | RJ45 | 1 | 921.6 kbps | 256KB | 25MHz | DSTni-EX | 512KB | MPU Core | XPort AR | ||||||||||||||||||||||||||||||||||||||||||||||
BS2-IC | Parallax Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BASIC Stamp® | Through Hole | 0°C~70°C | Bulk | 1.2 x 0.6 30mmx15mm | 1 (Unlimited) | 70°C | 0°C | 20MHz | RoHS Compliant | 2005 | /files/parallaxinc-bs2ic-datasheets-2501.pdf | PDIP | 30mm | 3.81mm | 16mm | 15V | Lead Free | 3 Weeks | 4.540006g | 24 | Serial | 20MHz | 32B | 15mW | EEPROM, RAM | 32B | 20MHz | 1 | 8b | PIC16C57C | 2KB EEPROM | MCU Core | |||||||||||||||||||||||||||||||||||||||
TE0808-04-09EG-1EK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te080804151ees-datasheets-7659.pdf | B2B | 2GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | 128MB | MPU Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0820-03-04EV-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | 14 Weeks | B2B | 2GB | Zynq UltraScale+ XCZU4EV-1SFVC784E | 128MB | MPU Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0820-03-3AE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0841-02-31I21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | /files/trenzelectronicgmbh-te08410241i21l-datasheets-7710.pdf | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0841-02-035-2I | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | -40°C~85°C | 1.97 x 1.57 50mmx40mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te0841020352i-datasheets-8311.pdf | 14 Weeks | B2B | 2GB | Kintex UltraScale KU035 | 64MB | FPGA Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0713-01-100-2C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0713 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | Not Applicable | /files/trenzelectronicgmbh-te0713012002c-datasheets-7652.pdf | Samtec LSHM | 1GB | 200MHz | Artix-7 A100T | 32MB | FPGA Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0820-03-02CG-1ED | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0820-03-04CG-1ED | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU4CG-1SFVC784E | 128MB | MPU Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DC-ME-Y402-NC-B | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect ME® | -40°C~80°C | 1.45 x 0.75 36.7mmx19.1mm | 1 (Unlimited) | 75MHz | RoHS Compliant | 2016 | RJ45 | ARM | 8MB | ARM926EJ-S, NS9210 | 4MB | MPU Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOMDM3730-11-2783IFCR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DM37x | 0°C~70°C | 3 x 1.22 76.2mmx31mm | 1 (Unlimited) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/logic-somdm3730101782ifxr-datasheets-6854.pdf | 12 Weeks | 256MB | 1GHz | DM3730 | 512MB N 16MB NOR | MPU Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EZ80F917150MODG | Zilog |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | eZ80® AcclaimPlus!™ | 0°C~70°C | 2.5 x 3.1 63.5mmx78.7mm | 1 (Unlimited) | 50MHz | ROHS3 Compliant | 2013 | Module | Lead Free | 13 Weeks | Header 2x30 | 8KB Internal 512KB External | eZ80F91 | 256KB Internal 8MB External | MCU, Ethernet Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0741-02-325-2IF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0741 | -40°C~85°C | 1.97 x 1.57 50mmx40mm | ROHS3 Compliant | 2016 | /files/trenzelectronicgmbh-te0741021602if-datasheets-7107.pdf | Samtec LSHM | 200MHz | Kintex-7 325T | 32MB | FPGA Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0820-03-02EG-1ED | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MOD5270BXX | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C | 2.6 x 2 66.04mmx50.8mm | 1 (Unlimited) | ROHS3 Compliant | 2005 | RJ-45, 2x50 Header | 2.064MB | 95MHz | ColdFire 5270 | 512KB | MCU, Ethernet Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
M5485EFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | -40°C~85°C | 3.7 x 4.5 93.4mmx114.3mm | 1 (Unlimited) | Non-RoHS Compliant | 64MB | 200MHz | ColdFire V4e, MCF5485 | 2MB Boot | MPU Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MOD5270BXXE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C | 2.6 x 2 66.04mmx50.8mm | 1 (Unlimited) | ROHS3 Compliant | 2005 | RJ-45, 2x50 Header | 2.064MB | 95MHz | ColdFire 5270 | 512KB | MCU, Ethernet Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0745-02-35-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | 0°C~70°C | 2.05 x 2.99 52mmx76mm | Not Applicable | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 12 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SOMDM3730-30-2780AKCR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DM37x | 0°C~70°C | 0.59 x 1.3 15mmx33mm | 1 (Unlimited) | 2013 | /files/logic-somdm3730301780akir-datasheets-6903.pdf | Board-to-Board (BTB) Socket - 200 | 256MB | 1GHz | ARM® Cortex®-A8, DM3730 | 512MB | MPU, DSP Core | TMS320C64x (DSP) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0803-02-03CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | MPU Core |
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