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ContactEmbedded ICs Modules(1001)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Operating Temperature | Size / Dimension | Moisture Sensitivity Level (MSL) | RoHS Status | Published | Datasheet | Factory Lead Time | Connector Type | RAM Size | Speed | Core Processor | Flash Size | Module/Board Type | Co-Processor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SOMDM3730-30-2780AKCR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DM37x | 0°C~70°C | 0.59 x 1.3 15mmx33mm | 1 (Unlimited) | 2013 | /files/logic-somdm3730301780akir-datasheets-6903.pdf | Board-to-Board (BTB) Socket - 200 | 256MB | 1GHz | ARM® Cortex®-A8, DM3730 | 512MB | MPU, DSP Core | TMS320C64x (DSP) | |||||
| TE0803-02-03CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | MPU Core | |||||||||||||
| TE0820-03-03EG-1ED | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~80°C | 1.57 x 1.97 40mmx50mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | ||||||||
| M5475CFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | 0°C~70°C | 3.7 x 4.5 93.4mmx114.3mm | 1 (Unlimited) | Non-RoHS Compliant | 64MB | 266MHz | ColdFire V4e, MCF5475 | 16MB | MPU Core | ||||||||
| TE0820-03-03CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0841-02-31C21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08410241i21l-datasheets-7710.pdf | |||||||||||||||
| M5485AFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | -40°C~85°C | 3.7 x 4.5 93.4mmx114.3mm | 1 (Unlimited) | ROHS3 Compliant | 64MB | 200MHz | ColdFire V4e, MCF5485 | 2MB Boot | MPU Core | ||||||||
| TE0841-02-0401IL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | -40°C~85°C | 1.97 x 1.57 50mmx40mm | Not Applicable | ROHS3 Compliant | B2B | 2GB | Kintex UltraScale KU40 | 64MB | MCU, FPGA | ||||||||
| M5485DFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | -40°C~85°C | 3.7 x 4.5 93.4mmx114.3mm | 1 (Unlimited) | Non-RoHS Compliant | 64MB | 200MHz | ColdFire V4e, MCF5485 | 2MB Boot | MPU Core | ||||||||
| TE0803-02-04CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | 2GB | Zynq UltraScale+ XCZU4CG-1SFVC784E | 128MB | MPU Core | |||||||||
| TE0745-02-30-1IA-K | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te074502453ea-datasheets-7711.pdf | Samtec ST5 | 1GB | ARM® Cortex®-A9 | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | ||||||
| TE0803-02-04EV-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | /files/trenzelectronicgmbh-te08030204ev1ea-datasheets-7773.pdf | B2B | 2GB | Zynq UltraScale+ XCZU4EV-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0803-02-02EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | 2GB | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | |||||||||
| TE0803-02-03EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | |||||||||
| TEC0850-03-015EG1E | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TEC0850 | Not Applicable | ROHS3 Compliant | CompactPCI Serial Backplane | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | 128MB | MCU, FPGA | ||||||||||
| TE0808-04-09EG-1EL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te080804151ees-datasheets-7659.pdf | B2B | 4GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | 128MB | MPU Core | |||||||
| M53017MOD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-m53017mod-datasheets-7826.pdf | 111 Weeks | Edge Connector | 64MB | 80MHz | ColdFire V3, MCF53017 | 32MB | MCU, VOIP Core | |||||||
| TE0820-03-2AI21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | ||||||||||||||||
| TE0803-02-02CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | /files/trenzelectronicgmbh-te08030202cg1ea-datasheets-7730.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0745-02-30-1I | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | 2010 | 12 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | ||||||
| TE0820-03-2BE21FL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | ||||||||||||||||
| TEC0850-03-15EG1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TEC0850 | Not Applicable | ROHS3 Compliant | CompactPCI Serial Backplane | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | 128MB | MCU, FPGA | ||||||||||
| MOD5270BXME | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C | 2.6 x 2 66.04mmx50.8mm | 1 (Unlimited) | ROHS3 Compliant | 2005 | RJ-45, 2x50 Header | 2.064MB | 95MHz | ColdFire 5270 | 512KB | MCU, Ethernet Core | |||||||
| TE0841-02-41I21-L | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | /files/trenzelectronicgmbh-te08410241i21l-datasheets-7710.pdf | |||||||||||||||
| DC-EM-02T-GORL | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect EM® | -40°C~85°C | 1.57 x 1.94 40mmx49.2mm | 1 (Unlimited) | Pin Header, RJ45 | 8MB | 55MHz | ARM7TDMI, NS7520 | 4MB | MPU Core | ||||||||
| TE0745-02-45-3EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te074502453ea-datasheets-7711.pdf | Samtec ST5 | 1GB | ARM® Cortex®-A9 | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | ||||||
| TE0808-04-15EG-1EK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te080804151ees-datasheets-7659.pdf | B2B | 4GB | Zynq UltraScale+ XCZU15EG-1FFVC900E | 128MB | MPU Core | |||||||
| TE0807-02-04EG-1E | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | |||||||||||||||||
| TE0803-02-04EG-1ID | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | MPU Core | |||||||||||||
| TE0803-03-5DE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te0803035de11a-datasheets-7677.pdf |
