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ContactEmbedded ICs Modules(1001)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Operating Temperature | Size / Dimension | Moisture Sensitivity Level (MSL) | RoHS Status | Published | Datasheet | Factory Lead Time | Connector Type | RAM Size | Speed | Core Processor | Flash Size | Module/Board Type | Co-Processor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M5474GFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||
| TE0803-02-04EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | /files/trenzelectronicgmbh-te08030204eg1ea-datasheets-7689.pdf | B2B | 2GB | Zynq UltraScale+ XCZU4EG-1SFVC784E | 128MB | MPU Core | ||||||||
| A13-SOM-512 | Olimex |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | ROHS3 Compliant | 2014 | /files/a13-som-512olimex-ltd-725.png | 13 Weeks | 512MB | 1GHz | Allwinner ARM® Cortex®-A8 | MCU Core | |||||||||
| TE0803-02-05EV-1IA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | MPU Core | |||||||||||||
| MOD5270BXCE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C | 2.6 x 2 66.04mmx50.8mm | 1 (Unlimited) | ROHS3 Compliant | 2005 | RJ-45, 2x50 Header | 2.064MB | 95MHz | ColdFire 5270 | 512KB | MCU, Ethernet Core | |||||||
| TE0803-02-03-1EA-S | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | FPGA Core | |||||||||
| M5475DFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | 0°C~70°C | 3.7 x 4.5 93.4mmx114.3mm | 1 (Unlimited) | Non-RoHS Compliant | 64MB | 266MHz | ColdFire V4e, MCF5475 | 2MB Boot | MPU Core | ||||||||
| TE0820-03-2AI21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | ||||||||||||||||
| TE0803-02-02CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | /files/trenzelectronicgmbh-te08030202cg1ea-datasheets-7730.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0745-02-30-1I | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | 2010 | 12 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | ||||||
| TE0820-03-2BE21FL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | ||||||||||||||||
| TEC0850-03-15EG1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TEC0850 | Not Applicable | ROHS3 Compliant | CompactPCI Serial Backplane | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | 128MB | MCU, FPGA | ||||||||||
| MOD5270BXME | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C | 2.6 x 2 66.04mmx50.8mm | 1 (Unlimited) | ROHS3 Compliant | 2005 | RJ-45, 2x50 Header | 2.064MB | 95MHz | ColdFire 5270 | 512KB | MCU, Ethernet Core | |||||||
| TE0841-02-41I21-L | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | /files/trenzelectronicgmbh-te08410241i21l-datasheets-7710.pdf | |||||||||||||||
| DC-EM-02T-GORL | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect EM® | -40°C~85°C | 1.57 x 1.94 40mmx49.2mm | 1 (Unlimited) | Pin Header, RJ45 | 8MB | 55MHz | ARM7TDMI, NS7520 | 4MB | MPU Core | ||||||||
| TE0820-03-03EG-1EL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200302eg1el-datasheets-7621.pdf | B2B | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | ||||||||
| TEC0850-03-BBEX1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | ||||||||||||||||
| TE0841-02-040-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | 1 (Unlimited) | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te0841020401c-datasheets-7625.pdf | 14 Weeks | B2B | 2GB | Kintex UltraScale KU40 | 64MB | MCU, FPGA | |||||||
| TE0820-03-3BE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | ||||||||||||||||
| UC5550-67HFN | GHI Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 2.67 x 1.25 67.7mmx31.7mm | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/ghielectronicsllc-uc555067hfn-datasheets-7631.pdf | 8 Weeks | 512KB Internal 32MB External | 216MHz | ARM® Cortex®-M7 | 2MB Internal 4MB External | MPU Core | ||||||||
| TE0808-04-06EG-1EE | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | /files/trenzelectronicgmbh-te08080409eg2ie-datasheets-7578.pdf | 12 Weeks | B2B | 4GB | Zynq UltraScale+ XCZU6EG-1FFVC900E | 128MB | MPU Core | |||||||
| DC-ME-01T-KC-1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect ME® | -40°C~85°C | 0.75 x 1.44 19.1mmx36.7mm | 1 (Unlimited) | RJ45 | 8MB | 55MHz | ARM7TDMI, NS7520 | 2MB | MPU Core | ||||||||
| TE0808-04-09EG-2IE | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te08080409eg2ie-datasheets-7578.pdf | 14 Weeks | B2B | 4GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | 128MB | MPU Core | |||||||
| TE0841-02-040-1I | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | -40°C~85°C | 1.97 x 1.57 50mmx40mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te0841020401i-datasheets-7637.pdf | 14 Weeks | B2B | 512MB | Kintex UltraScale KU40 | 32MB | FPGA Core | |||||||
| TE0808-04-09EG-1EE | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te08080415eg1ee-datasheets-7549.pdf | B2B | 4GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | 128MB | MPU Core | |||||||
| TE0807-02-07EV-1E | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0807 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | /files/trenzelectronicgmbh-te08070207ev1e-datasheets-7641.pdf | 14 Weeks | B2B | 4GB | Zynq UltraScale+ XCZU7EV-1FBVB900E | 128MB | MPU Core | |||||||
| TE0745-02-35-1CA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | 0°C~70°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | 2018 | /files/trenzelectronicgmbh-te074501452i-datasheets-7133.pdf | 12 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | |||||
| TE0820-03-03CG-1ED | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 1GB | Zynq UltraScale+ XCZU3CG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0745-02-45-1CA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | 0°C~70°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te074501452i-datasheets-7133.pdf | 14 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | |||||
| TE0713-01-200-2C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0713 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | Not Applicable | /files/trenzelectronicgmbh-te0713012002c-datasheets-7652.pdf | Samtec LSHM | 1GB | 200MHz | Artix-7 A200T | 32MB | FPGA Core |
