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ContactEmbedded ICs Modules(1001)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Operating Temperature | Size / Dimension | Moisture Sensitivity Level (MSL) | RoHS Status | Published | Datasheet | Factory Lead Time | Connector Type | RAM Size | Speed | Core Processor | Flash Size | Module/Board Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TE0803-02-04EG-1ID | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | MPU Core | ||||||||||||
| TE0803-03-5DE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te0803035de11a-datasheets-7677.pdf | ||||||||||||||
| TE0803-01-02EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.99 x 2.05 76mmx52mm | Not Applicable | /files/trenzelectronicgmbh-te08030103cg1ea-datasheets-7617.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | |||||||
| TE0803-02-04EG-1E3 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | 2GB | Zynq UltraScale+ XCZU4EG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0808-04-06EG-1E3 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te080804151ees-datasheets-7659.pdf | B2B | 4GB | Zynq UltraScale+ XCZU6EG-1FFVC900E | 128MB | MPU Core | ||||||
| TE0803-03-3BE11-AS | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | /files/trenzelectronicgmbh-te0803033be11as-datasheets-7681.pdf | ||||||||||||||
| TE0803-02-05EV-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | 2GB | Zynq UltraScale+ XCZU5EV-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0820-03-02EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | 1 (Unlimited) | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | |||||||
| M5475BFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | 0°C~70°C | 3.7 x 4.5 93.4mmx114.3mm | 1 (Unlimited) | Non-RoHS Compliant | 64MB | 266MHz | ColdFire V4e, MCF5475 | 16MB | MPU Core | |||||||
| TE0803-02-04EV-1E3 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | 2GB | Zynq UltraScale+ XCZU4EV-1SFVC784E | 128MB | MPU Core | ||||||||
| M5474GFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||
| TE0803-02-04EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | /files/trenzelectronicgmbh-te08030204eg1ea-datasheets-7689.pdf | B2B | 2GB | Zynq UltraScale+ XCZU4EG-1SFVC784E | 128MB | MPU Core | |||||||
| A13-SOM-512 | Olimex |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | ROHS3 Compliant | 2014 | /files/a13-som-512olimex-ltd-725.png | 13 Weeks | 512MB | 1GHz | Allwinner ARM® Cortex®-A8 | MCU Core | ||||||||
| TE0803-02-05EV-1IA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 2.05 x 2.99 52mmx76mm | Not Applicable | B2B | MPU Core | ||||||||||||
| MOD5270BXCE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C | 2.6 x 2 66.04mmx50.8mm | 1 (Unlimited) | ROHS3 Compliant | 2005 | RJ-45, 2x50 Header | 2.064MB | 95MHz | ColdFire 5270 | 512KB | MCU, Ethernet Core | ||||||
| TE0820-02-03CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | /files/trenzelectronicgmbh-te08200202cg1ea-datasheets-7520.pdf | B2B | 1GB | Zynq UltraScale+ XCZU3CG-1SFVC784E | 128MB | MPU Core | ||||||||
| DC-ME4-01T-HPA-1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect ME® | -40°C~85°C | 1.45 x 0.75 36.7mmx19.1mm | 1 (Unlimited) | RJ45 | 8MB | 55MHz | ARM7TDMI, NS7520 | 4MB | MPU Core | |||||||
| TE0820-03-04CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU4EV-1SFVC784E | 128MB | MPU Core | |||||||
| TE0803-03-4DE21-L | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te0803034de21l-datasheets-7661.pdf | ||||||||||||||
| TE0820-03-02CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | |||||||
| TE0820-03-4AE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | ||||||||||||||||
| TE0820-03-3BE21FL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | |||||||||||||||
| TE0808-04-06EG-1EK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te080804151ees-datasheets-7659.pdf | B2B | 4GB | Zynq UltraScale+ XCZU6EG-1FFVC900E | 128MB | MPU Core | ||||||
| TE0803-01-03CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.99 x 2.05 76mmx52mm | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08030103cg1ea-datasheets-7617.pdf | B2B | 2GB | Zynq UltraScale+ XCZU3CG-1SFVC784E | 128MB | MPU Core | ||||||
| CC-WMX-LB69-CV | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | RoHS Compliant | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | |||||||||
| TE0820-03-02EG-1EL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200302eg1el-datasheets-7621.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | |||||||
| TE0820-03-03EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~80°C | 1.57 x 1.97 40mmx50mm | Not Applicable | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | |||||||
| TE0820-03-03EG-1EL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200302eg1el-datasheets-7621.pdf | B2B | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | |||||||
| TEC0850-03-BBEX1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | |||||||||||||||
| TE0841-02-040-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | 1 (Unlimited) | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te0841020401c-datasheets-7625.pdf | 14 Weeks | B2B | 2GB | Kintex UltraScale KU40 | 64MB | MCU, FPGA |
