| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Interface | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Oscillator Type | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | CPU Family | ROM (words) | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PK40X128VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K40 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 144-LQFP | PK40X128 | Internal | 98 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 27x16b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51AG96VLK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AG | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | 80-LQFP | 14mm | 14mm | 80 | 8542.31.00.01 | YES | QUAD | GULL WING | 3V | 0.65mm | MCF51AG96 | 5.5V | 2.7V | S-PQFP-G80 | Internal | 69 | DMA, LVD, PWM, WDT | 16K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 16MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 96KB 96K x 8 | I2C, SCI, SPI | A/D 24x12b | ||||||||||||||||||||||||||||
| S9S08SL8F1CTL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2008 | 28-TSSOP (0.173, 4.40mm Width) | S9S08SL8 | External | 22 | LVD, POR, PWM, WDT | 512 x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | A/D 16x10b | 256 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5517EAMMG66 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC55xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-spc5517ebmlq66-datasheets-3415.pdf | 208-BGA | SPC5517 | Internal | 144 | DMA, POR, PWM, WDT | 80K x 8 | 66MHz | e200z0, e200z1 | 4.5V~5.25V | FLASH | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | A/D 40x12b | ||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5604PEF0MLL6 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | 100-LQFP | SPC5604 | Internal | 68 | DMA, POR, PWM, WDT | 40K x 8 | 64MHz | e200z0h | 3V~5.5V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | A/D 30x10b | 64K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
| MCF5235CVM100J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF523x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5233cvm150-datasheets-2974.pdf | 256-LBGA | MCF5235 | External | 113 | DMA, WDT | 64K x 8 | 100MHz | Coldfire V2 | 1.4V~1.6V | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | ||||||||||||||||||||||||||||||||||||||||||||||||||
| PK20N512VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | 144-LBGA | PK20N512 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 33x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51MM128CMB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51MM | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 81-LBGA | MCF51MM128 | 81-MAPBGA (10x10) | External | 48 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 1.8V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG | A/D 8x16b; D/A 1x12b | ||||||||||||||||||||||||||||||||||||||||||||||||
| PCF52252AF80 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5225x | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | PCF52252 | Internal | 56 | DMA, LVD, POR, PWM, WDT | 32K x 8 | 80MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG | A/D 8x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF52211CVM80J | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5221x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf52211caf80-datasheets-5473.pdf | 81-LBGA | MCF52211 | 81-MAPBGA (10x10) | Internal | 55 | DMA, LVD, POR, PWM, WDT | 16K x 8 | 80MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB OTG | A/D 8x12b | ||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5604PGF0MLQ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | 144-LQFP | SPC5604 | Internal | 108 | DMA, POR, PWM, WDT | 40K x 8 | 64MHz | e200z0h | 3V~5.5V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | A/D 30x10b | 64K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
| MB9BF104NPMC-G-JNE1 | Fujitsu Electronics America, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FM3 MB9B100 | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | 85°C | -40°C | 80MHz | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/fujitsuelectronicsamericainc-mb9bf106npmcgjne1-datasheets-2351.pdf | 100-LQFP | 8 Weeks | EBI/EMI, I2C, LIN, UART, USART | 100-LQFP (14x14) | 256kB | Internal | 80 | FLASH | DMA, LVD, POR, PWM, WDT | ARM | 32K x 8 | 80MHz | ARM® Cortex®-M3 | 2.7V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | CSIO, EBI/EMI, I2C, LINbus, UART/USART | A/D 16x12b | ||||||||||||||||||||||||||||||||||||||||
| P89LPC972FN,129 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 2000 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc970fdh129-datasheets-2047.pdf | 20-DIP (0.300, 7.62mm) | 20 | e3 | MATTE TIN | NO | DUAL | 225 | 2.54mm | P89LPC97* | 20 | NOT SPECIFIED | Microcontrollers | 3/5V | 12mA | Not Qualified | R-PDIP-T20 | Internal | 18 | Brown-out Detect/Reset, POR, PWM, WDT | 256 x 8 | 18MHz | 8 | 8192 | 8051 | 2.4V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | ||||||||||||||||||||||||||||||||
| MCF51AG96VLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AG | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | 64-LQFP | 10mm | 10mm | 64 | 8542.31.00.01 | YES | QUAD | GULL WING | 3V | 0.5mm | MCF51AG96 | 5.5V | 2.7V | S-PQFP-G64 | Internal | 53 | DMA, LVD, PWM, WDT | 16K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 16MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 96KB 96K x 8 | I2C, SCI, SPI | A/D 19x12b | ||||||||||||||||||||||||||||
| PK10N512VLL100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K10 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 100-LQFP | PK10N512 | Internal | 70 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | A/D 29x16b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| S908GR16G5CFJE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 32-LQFP | S908GR16 | Internal | 21 | LVD, POR, PWM | 1K x 8 | 8MHz | 3V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5516EAMMG66 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC55xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-spc5517ebmlq66-datasheets-3415.pdf | 208-BGA | SPC5516 | Internal | 144 | DMA, POR, PWM, WDT | 64K x 8 | 66MHz | e200z0, e200z1 | 4.5V~5.25V | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | A/D 40x12b | ||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51AG96VQH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AG | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2010 | 64-QFP | 14mm | 14mm | 64 | 8542.31.00.01 | YES | QUAD | GULL WING | 3V | 0.8mm | MCF51AG96 | 5.5V | 2.7V | S-PQFP-G64 | Internal | 53 | DMA, LVD, PWM, WDT | 16K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 16MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 96KB 96K x 8 | I2C, SCI, SPI | A/D 19x12b | ||||||||||||||||||||||||||||
| S9S08DN32F1MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08dn48f2mlf-datasheets-0465.pdf | 64-LQFP | S9S08DN32 | 64-LQFP (10x10) | Internal | 53 | LVD, POR, PWM, WDT | 1.5K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | A/D 16x12b | 1K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||
| S9S08DN32F1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08dn48f2mlf-datasheets-0465.pdf | 32-LQFP | S9S08DN32 | 32-LQFP (7x7) | Internal | 25 | LVD, POR, PWM, WDT | 1.5K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | A/D 10x12b | 1K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||
| SPC5517GAMMG66 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC55xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-spc5517ebmlq66-datasheets-3415.pdf | 208-BGA | SPC5517 | Internal | 144 | DMA, POR, PWM, WDT | 80K x 8 | 66MHz | e200z0, e200z1 | 4.5V~5.25V | FLASH | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | A/D 40x12b | ||||||||||||||||||||||||||||||||||||||||||||||||
| PK30N512VLK100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K30 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 80-LQFP | PK30N512 | Internal | 56 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | A/D 22x16b; D/A 1x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51AG96CLK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AG | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 80-LQFP | MCF51AG96 | Internal | 69 | DMA, LVD, PWM, WDT | 16K x 8 | 50MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 96KB 96K x 8 | I2C, SCI, SPI | A/D 24x12b | |||||||||||||||||||||||||||||||||||||||||||||||||
| S912XHZ512F1CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xhz256vagr-datasheets-1462.pdf | 112-LQFP | 20mm | 20mm | 112 | 22 Weeks | YES | QUAD | GULL WING | 5V | 0.65mm | S912XHZ512 | 5.5V | 4.5V | Microcontrollers | 2.55V | 110mA | Not Qualified | S-PQFP-G112 | AEC-Q100 | External | 85 | LCD, Motor control PWM, POR, PWM, WDT | 32K x 8 | 80MHz | MICROCONTROLLER, RISC | 16 | YES | YES | YES | CPU12 | 524288 | 40MHz | 23 | 16 | 2.35V~5.5V | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | A/D 16x8/10b | 4K x 8 | ||||||||||||||||||||
| MCF51AG128VLK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51AG | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | 80-LQFP | 14mm | 14mm | 80 | 8542.31.00.01 | YES | QUAD | GULL WING | 3V | 0.65mm | MCF51AG128 | 5.5V | 2.7V | S-PQFP-G80 | Internal | 69 | DMA, LVD, PWM, WDT | 16K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 16MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SCI, SPI | A/D 24x12b | ||||||||||||||||||||||||||||
| MCF51MM256VMB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51MM | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 81-LBGA | MCF51MM256 | 81-MAPBGA (10x10) | External | 48 | LVD, PWM, WDT | 32K x 8 | 50MHz | Coldfire V1 | 1.8V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG | A/D 8x16b; D/A 1x12b | ||||||||||||||||||||||||||||||||||||||||||||||||
| PK60N256VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K60 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 144-LBGA | PK60N256 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 64K x 8 | 100MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 27x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MB9BF104RPMC-G-JNE1 | Fujitsu Electronics America, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FM3 MB9B100 | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | 85°C | -40°C | 80MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/fujitsuelectronicsamericainc-mb9bf106npmcgjne1-datasheets-2351.pdf | 120-LQFP | 8 Weeks | EBI/EMI, I2C, LIN, UART, USART | 100-LQFP (16x16) | 256kB | Internal | 100 | FLASH | DMA, LVD, POR, PWM, WDT | ARM | 32K x 8 | 80MHz | ARM® Cortex®-M3 | 2.7V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | CSIO, EBI/EMI, I2C, LINbus, UART/USART | A/D 16x12b | ||||||||||||||||||||||||||||||||||||||||
| MB9BF504RPMC-GE1 | Fujitsu Electronics America, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FM3 MB9B500 | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | 85°C | -40°C | 80MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-cy9bf506npmcgjne1-datasheets-7095.pdf | 120-LQFP | 8 Weeks | CAN, EBI/EMI, I2C, LIN, UART, USART, USB | 100-LQFP (16x16) | 256kB | Internal | 100 | FLASH | DMA, LVD, POR, PWM, WDT | ARM | 32K x 8 | 80MHz | ARM® Cortex®-M3 | 2.7V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB | A/D 16x12b | ||||||||||||||||||||||||||||||||||||||||
| S9S08DV32F1MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08dv16aclc-datasheets-3459.pdf | 64-LQFP | S9S08DV32 | External | 53 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 16x12b |
Please send RFQ , we will respond immediately.